KR102205230B1 - 점착 테이프 - Google Patents

점착 테이프 Download PDF

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Publication number
KR102205230B1
KR102205230B1 KR1020140008805A KR20140008805A KR102205230B1 KR 102205230 B1 KR102205230 B1 KR 102205230B1 KR 1020140008805 A KR1020140008805 A KR 1020140008805A KR 20140008805 A KR20140008805 A KR 20140008805A KR 102205230 B1 KR102205230 B1 KR 102205230B1
Authority
KR
South Korea
Prior art keywords
meth
adhesive tape
adhesive layer
thickness
acrylic polymer
Prior art date
Application number
KR1020140008805A
Other languages
English (en)
Korean (ko)
Other versions
KR20140097017A (ko
Inventor
다쿠미 유토
도시타카 스즈키
아키노리 니시오
다카히로 야타가이
Original Assignee
닛토덴코 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛토덴코 가부시키가이샤 filed Critical 닛토덴코 가부시키가이샤
Publication of KR20140097017A publication Critical patent/KR20140097017A/ko
Application granted granted Critical
Publication of KR102205230B1 publication Critical patent/KR102205230B1/ko

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04Polysiloxanes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020140008805A 2013-01-29 2014-01-24 점착 테이프 KR102205230B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-013928 2013-01-29
JP2013013928A JP6021263B2 (ja) 2013-01-29 2013-01-29 粘着テープ

Publications (2)

Publication Number Publication Date
KR20140097017A KR20140097017A (ko) 2014-08-06
KR102205230B1 true KR102205230B1 (ko) 2021-01-20

Family

ID=51235812

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140008805A KR102205230B1 (ko) 2013-01-29 2014-01-24 점착 테이프

Country Status (4)

Country Link
JP (1) JP6021263B2 (zh)
KR (1) KR102205230B1 (zh)
CN (1) CN103965797B (zh)
TW (1) TWI586786B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI605942B (zh) * 2016-01-04 2017-11-21 厚生股份有限公司 感壓複合結構及其製造方法
KR102625368B1 (ko) * 2016-04-05 2024-01-15 린텍 가부시키가이샤 삼차원 집적 적층 회로 제조용 시트 및 삼차원 집적 적층 회로의 제조 방법
JP6797559B2 (ja) * 2016-05-23 2020-12-09 日東電工株式会社 ダイシングテープ
US11549039B2 (en) * 2017-10-19 2023-01-10 Dow Silicones Corporation Pressure sensitive adhesive composition and methods for its preparation and use in flexible organic light emitting diode applications
JP6535118B1 (ja) * 2018-03-28 2019-06-26 古河電気工業株式会社 半導体加工用テープ
WO2019187186A1 (ja) * 2018-03-28 2019-10-03 古河電気工業株式会社 半導体加工用テープ
JP7437151B2 (ja) * 2019-12-20 2024-02-22 日東電工株式会社 粘着テープ

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009013183A (ja) 2005-12-07 2009-01-22 Denki Kagaku Kogyo Kk 粘着シート及びそれを用いた電子部品製造方法。
JP2009135254A (ja) 2007-11-30 2009-06-18 Disco Abrasive Syst Ltd 粘着テープ貼着方法
JP2010123763A (ja) 2008-11-20 2010-06-03 Sumitomo Bakelite Co Ltd 半導体ウエハ加工用粘着フィルム

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5945123A (ja) * 1982-09-07 1984-03-13 Mitsubishi Plastics Ind Ltd エンボス形成方法
JP3523939B2 (ja) * 1995-07-18 2004-04-26 リンテック株式会社 ウェハ加工用粘着シートおよびその製造方法
JP3599158B2 (ja) * 1997-12-12 2004-12-08 王子製紙株式会社 粘着テープ
JPH11199840A (ja) * 1998-01-16 1999-07-27 Kureha Chem Ind Co Ltd 粘着テープ用基材、粘着テープ及び離型テープ付き粘着テープ
JP4531355B2 (ja) * 2003-06-25 2010-08-25 日東電工株式会社 ダイシング用粘着シートおよび半導体素子の製造方法
JP5457703B2 (ja) * 2008-03-31 2014-04-02 三井化学株式会社 ダイシングフィルム
JP5313837B2 (ja) * 2009-10-23 2013-10-09 日東電工株式会社 再剥離性粘着シート
JP5820619B2 (ja) * 2011-01-20 2015-11-24 日東電工株式会社 粘着テープ
KR101240916B1 (ko) * 2011-02-01 2013-03-11 도레이첨단소재 주식회사 반사시트용 점착필름 및 그를 이용한 반사시트
JP2012169573A (ja) * 2011-02-17 2012-09-06 Furukawa Electric Co Ltd:The ダイシングダイボンドシートおよびled用サファイヤ基板の加工方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009013183A (ja) 2005-12-07 2009-01-22 Denki Kagaku Kogyo Kk 粘着シート及びそれを用いた電子部品製造方法。
JP2009135254A (ja) 2007-11-30 2009-06-18 Disco Abrasive Syst Ltd 粘着テープ貼着方法
JP2010123763A (ja) 2008-11-20 2010-06-03 Sumitomo Bakelite Co Ltd 半導体ウエハ加工用粘着フィルム

Also Published As

Publication number Publication date
KR20140097017A (ko) 2014-08-06
JP6021263B2 (ja) 2016-11-09
TWI586786B (zh) 2017-06-11
JP2014145019A (ja) 2014-08-14
TW201437315A (zh) 2014-10-01
CN103965797A (zh) 2014-08-06
CN103965797B (zh) 2018-05-01

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