KR102192243B1 - 성형 다이, 수지 성형 장치 및 수지 성형품의 제조 방법 - Google Patents

성형 다이, 수지 성형 장치 및 수지 성형품의 제조 방법 Download PDF

Info

Publication number
KR102192243B1
KR102192243B1 KR1020180148683A KR20180148683A KR102192243B1 KR 102192243 B1 KR102192243 B1 KR 102192243B1 KR 1020180148683 A KR1020180148683 A KR 1020180148683A KR 20180148683 A KR20180148683 A KR 20180148683A KR 102192243 B1 KR102192243 B1 KR 102192243B1
Authority
KR
South Korea
Prior art keywords
resin
lower die
die
molding
molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020180148683A
Other languages
English (en)
Korean (ko)
Other versions
KR20190089711A (ko
Inventor
요헤이 오니시
Original Assignee
토와 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 토와 가부시기가이샤 filed Critical 토와 가부시기가이샤
Publication of KR20190089711A publication Critical patent/KR20190089711A/ko
Application granted granted Critical
Publication of KR102192243B1 publication Critical patent/KR102192243B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B29C33/14—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
    • B29C33/18—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/10—Moulds or cores; Details thereof or accessories therefor with incorporated venting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/50—Removing moulded articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/52—Heating or cooling
    • H01L21/52—
    • H01L21/56—
    • H01L21/67092—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/3602—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould
    • B29C2043/3605—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
    • B29C2791/006—Using vacuum
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
KR1020180148683A 2018-01-22 2018-11-27 성형 다이, 수지 성형 장치 및 수지 성형품의 제조 방법 Active KR102192243B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2018-008487 2018-01-22
JP2018008487A JP6876637B2 (ja) 2018-01-22 2018-01-22 成形型、樹脂成形装置及び樹脂成形品の製造方法

Publications (2)

Publication Number Publication Date
KR20190089711A KR20190089711A (ko) 2019-07-31
KR102192243B1 true KR102192243B1 (ko) 2020-12-16

Family

ID=67365880

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180148683A Active KR102192243B1 (ko) 2018-01-22 2018-11-27 성형 다이, 수지 성형 장치 및 수지 성형품의 제조 방법

Country Status (5)

Country Link
JP (1) JP6876637B2 (https=)
KR (1) KR102192243B1 (https=)
CN (1) CN110065191B (https=)
SG (1) SG10201900307RA (https=)
TW (1) TWI718447B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112428501B (zh) * 2020-10-29 2022-09-23 台州耘智科技有限公司 一种节能橡胶成型机
JP7560059B2 (ja) * 2021-10-08 2024-10-02 株式会社神戸製鋼所 金属樹脂複合体を製造するための装置、金型セット、および方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012081678A (ja) 2010-10-14 2012-04-26 Towa Corp 半導体チップの圧縮成形方法及び圧縮成形型
JP4953619B2 (ja) 2005-11-04 2012-06-13 Ｔｏｗａ株式会社 電子部品の樹脂封止成形装置
JP2012166432A (ja) 2011-02-14 2012-09-06 Apic Yamada Corp 樹脂モールド方法および樹脂モールド装置
JP2012187902A (ja) 2011-03-14 2012-10-04 Apic Yamada Corp 樹脂封止方法および樹脂封止装置
JP2016022672A (ja) 2014-07-22 2016-02-08 アピックヤマダ株式会社 成形金型、成形装置および成形品の製造方法
JP2017024398A (ja) 2015-07-15 2017-02-02 アピックヤマダ株式会社 モールド金型及び樹脂モールド装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3994705B2 (ja) * 2001-09-13 2007-10-24 松下電工株式会社 メモリーカードの製造方法
JP5539814B2 (ja) * 2010-08-30 2014-07-02 Ｔｏｗａ株式会社 基板露出面を備えた樹脂封止成形品の製造方法及び装置
JP5906528B2 (ja) * 2011-07-29 2016-04-20 アピックヤマダ株式会社 モールド金型及びこれを用いた樹脂モールド装置
SG11201508166RA (en) * 2013-05-29 2015-12-30 Apic Yamada Corp Resin molding apparatus and resin molding method
JP5694486B2 (ja) * 2013-11-12 2015-04-01 アピックヤマダ株式会社 樹脂封止装置
TWI689396B (zh) * 2014-07-22 2020-04-01 日商山田尖端科技股份有限公司 成形模具、成形裝置及成形品的製造方法
JP6525580B2 (ja) * 2014-12-24 2019-06-05 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
WO2017010319A1 (ja) * 2015-07-15 2017-01-19 アピックヤマダ株式会社 モールド金型及び樹脂モールド装置
JP6506680B2 (ja) * 2015-11-09 2019-04-24 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
JP2017177554A (ja) * 2016-03-30 2017-10-05 株式会社ケーヒン 回路装置、回路装置の製造装置及びその製造方法
JP2017212419A (ja) * 2016-05-27 2017-11-30 Ｔｏｗａ株式会社 樹脂封止品製造方法及び樹脂封止装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4953619B2 (ja) 2005-11-04 2012-06-13 Ｔｏｗａ株式会社 電子部品の樹脂封止成形装置
JP2012081678A (ja) 2010-10-14 2012-04-26 Towa Corp 半導体チップの圧縮成形方法及び圧縮成形型
JP2012166432A (ja) 2011-02-14 2012-09-06 Apic Yamada Corp 樹脂モールド方法および樹脂モールド装置
JP2012187902A (ja) 2011-03-14 2012-10-04 Apic Yamada Corp 樹脂封止方法および樹脂封止装置
JP2016022672A (ja) 2014-07-22 2016-02-08 アピックヤマダ株式会社 成形金型、成形装置および成形品の製造方法
JP2017024398A (ja) 2015-07-15 2017-02-02 アピックヤマダ株式会社 モールド金型及び樹脂モールド装置

Also Published As

Publication number Publication date
JP6876637B2 (ja) 2021-05-26
TW201932273A (zh) 2019-08-16
JP2019126927A (ja) 2019-08-01
CN110065191B (zh) 2021-12-03
CN110065191A (zh) 2019-07-30
KR20190089711A (ko) 2019-07-31
TWI718447B (zh) 2021-02-11
SG10201900307RA (en) 2019-08-27

Similar Documents

Publication Publication Date Title
KR101959624B1 (ko) 압축 성형 장치, 수지 밀봉품 제조 장치, 압축 성형 방법 및 수지 밀봉품의 제조 방법
CN105269744B (zh) 树脂封装装置及树脂封装方法
KR102059738B1 (ko) 성형 다이, 수지 성형 장치, 수지 성형 방법 및 수지 성형품의 제조 방법
CN101405854B (zh) 树脂封固成形装置
KR102192732B1 (ko) 수지 밀봉 장치 및 수지 밀봉 방법
TWI647085B (zh) 樹脂成形裝置及樹脂成形方法
KR102192241B1 (ko) 반송 기구, 수지 성형 장치, 성형 대상물의 성형 다이로의 전달 방법, 및 수지 성형품의 제조 방법
KR102119992B1 (ko) 수지 밀봉 장치 및 수지 밀봉 방법
KR20160065025A (ko) 성형품 제조 장치 및 성형품 제조 방법
JP6180206B2 (ja) 樹脂封止方法および圧縮成形装置
KR20220117804A (ko) 수지 성형품의 제조 방법, 성형 다이 및 수지 성형 장치
KR102086889B1 (ko) 수지 밀봉 장치 및 수지 밀봉 방법
CN109383047B (zh) 树脂成型装置以及树脂成型品的制造方法
KR102192243B1 (ko) 성형 다이, 수지 성형 장치 및 수지 성형품의 제조 방법
TW201910088A (zh) 樹脂成型品的搬運機構、樹脂成型裝置以及樹脂成型品的製造方法
CN108568929B (zh) 树脂成型装置、树脂成型方法以及树脂成型品的制造方法
KR102511575B1 (ko) 수지 누설 방지용 부재, 수지 누설 방지용 부재 공급 기구, 수지 성형 장치 및 수지 성형품의 제조 방법
WO2022172592A1 (ja) 搬送機構、樹脂成形装置及び樹脂成形品の製造方法
JP7240339B2 (ja) 樹脂成形品の製造方法及び樹脂成形装置
KR20190090777A (ko) 압축 성형 장치, 압축 성형 방법 및 압축 성형품의 제조 방법
CN113211686A (zh) 树脂成型装置及树脂成型品的制造方法

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000