CN110065191B - 成型模、树脂成型装置及树脂成型品的制造方法 - Google Patents
成型模、树脂成型装置及树脂成型品的制造方法 Download PDFInfo
- Publication number
- CN110065191B CN110065191B CN201811566727.0A CN201811566727A CN110065191B CN 110065191 B CN110065191 B CN 110065191B CN 201811566727 A CN201811566727 A CN 201811566727A CN 110065191 B CN110065191 B CN 110065191B
- Authority
- CN
- China
- Prior art keywords
- resin
- mold
- lower mold
- molding
- release film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
- B29C33/14—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
- B29C33/18—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall using vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/10—Moulds or cores; Details thereof or accessories therefor with incorporated venting means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/50—Removing moulded articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/52—Heating or cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C2043/3602—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould
- B29C2043/3605—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2791/00—Shaping characteristics in general
- B29C2791/004—Shaping under special conditions
- B29C2791/006—Using vacuum
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-008487 | 2018-01-22 | ||
| JP2018008487A JP6876637B2 (ja) | 2018-01-22 | 2018-01-22 | 成形型、樹脂成形装置及び樹脂成形品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110065191A CN110065191A (zh) | 2019-07-30 |
| CN110065191B true CN110065191B (zh) | 2021-12-03 |
Family
ID=67365880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811566727.0A Active CN110065191B (zh) | 2018-01-22 | 2018-12-20 | 成型模、树脂成型装置及树脂成型品的制造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6876637B2 (https=) |
| KR (1) | KR102192243B1 (https=) |
| CN (1) | CN110065191B (https=) |
| SG (1) | SG10201900307RA (https=) |
| TW (1) | TWI718447B (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112428501B (zh) * | 2020-10-29 | 2022-09-23 | 台州耘智科技有限公司 | 一种节能橡胶成型机 |
| JP7560059B2 (ja) * | 2021-10-08 | 2024-10-02 | 株式会社神戸製鋼所 | 金属樹脂複合体を製造するための装置、金型セット、および方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102386110A (zh) * | 2010-08-30 | 2012-03-21 | 东和株式会社 | 树脂密封成形品的制造方法和树脂密封成形品的制造装置 |
| CN102896714A (zh) * | 2011-07-29 | 2013-01-30 | 山田尖端科技株式会社 | 模制用模组和具有该模制用模组的树脂模制装置 |
| CN105291335A (zh) * | 2014-07-22 | 2016-02-03 | 山田尖端科技株式会社 | 成形模具、成形装置、成形品的制造方法及树脂模制方法 |
| WO2017010319A1 (ja) * | 2015-07-15 | 2017-01-19 | アピックヤマダ株式会社 | モールド金型及び樹脂モールド装置 |
| CN108025466A (zh) * | 2015-11-09 | 2018-05-11 | 东和株式会社 | 树脂封装装置以及树脂封装方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3994705B2 (ja) * | 2001-09-13 | 2007-10-24 | 松下電工株式会社 | メモリーカードの製造方法 |
| JP4953619B2 (ja) * | 2005-11-04 | 2012-06-13 | Towa株式会社 | 電子部品の樹脂封止成形装置 |
| JP5237346B2 (ja) * | 2010-10-14 | 2013-07-17 | Towa株式会社 | 半導体チップの圧縮成形方法及び圧縮成形型 |
| JP5799422B2 (ja) * | 2011-02-14 | 2015-10-28 | アピックヤマダ株式会社 | 樹脂モールド方法および樹脂モールド装置 |
| JP5682033B2 (ja) * | 2011-03-14 | 2015-03-11 | アピックヤマダ株式会社 | 樹脂封止装置 |
| SG11201508166RA (en) * | 2013-05-29 | 2015-12-30 | Apic Yamada Corp | Resin molding apparatus and resin molding method |
| JP5694486B2 (ja) * | 2013-11-12 | 2015-04-01 | アピックヤマダ株式会社 | 樹脂封止装置 |
| JP6307374B2 (ja) * | 2014-07-22 | 2018-04-04 | アピックヤマダ株式会社 | 成形金型、成形装置および成形品の製造方法 |
| JP6525580B2 (ja) * | 2014-12-24 | 2019-06-05 | Towa株式会社 | 樹脂成形装置及び樹脂成形方法 |
| JP6438913B2 (ja) * | 2015-07-15 | 2018-12-19 | アピックヤマダ株式会社 | モールド金型及び樹脂モールド装置 |
| JP2017177554A (ja) * | 2016-03-30 | 2017-10-05 | 株式会社ケーヒン | 回路装置、回路装置の製造装置及びその製造方法 |
| JP2017212419A (ja) * | 2016-05-27 | 2017-11-30 | Towa株式会社 | 樹脂封止品製造方法及び樹脂封止装置 |
-
2018
- 2018-01-22 JP JP2018008487A patent/JP6876637B2/ja active Active
- 2018-11-27 KR KR1020180148683A patent/KR102192243B1/ko active Active
- 2018-12-07 TW TW107144013A patent/TWI718447B/zh active
- 2018-12-20 CN CN201811566727.0A patent/CN110065191B/zh active Active
-
2019
- 2019-01-14 SG SG10201900307RA patent/SG10201900307RA/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102386110A (zh) * | 2010-08-30 | 2012-03-21 | 东和株式会社 | 树脂密封成形品的制造方法和树脂密封成形品的制造装置 |
| CN102896714A (zh) * | 2011-07-29 | 2013-01-30 | 山田尖端科技株式会社 | 模制用模组和具有该模制用模组的树脂模制装置 |
| CN105291335A (zh) * | 2014-07-22 | 2016-02-03 | 山田尖端科技株式会社 | 成形模具、成形装置、成形品的制造方法及树脂模制方法 |
| WO2017010319A1 (ja) * | 2015-07-15 | 2017-01-19 | アピックヤマダ株式会社 | モールド金型及び樹脂モールド装置 |
| CN108025466A (zh) * | 2015-11-09 | 2018-05-11 | 东和株式会社 | 树脂封装装置以及树脂封装方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6876637B2 (ja) | 2021-05-26 |
| TW201932273A (zh) | 2019-08-16 |
| JP2019126927A (ja) | 2019-08-01 |
| CN110065191A (zh) | 2019-07-30 |
| KR20190089711A (ko) | 2019-07-31 |
| TWI718447B (zh) | 2021-02-11 |
| SG10201900307RA (en) | 2019-08-27 |
| KR102192243B1 (ko) | 2020-12-16 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |