KR102166100B1 - 봉지용 수지 조성물 및 반도체 장치 - Google Patents

봉지용 수지 조성물 및 반도체 장치 Download PDF

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KR102166100B1
KR102166100B1 KR1020177003859A KR20177003859A KR102166100B1 KR 102166100 B1 KR102166100 B1 KR 102166100B1 KR 1020177003859 A KR1020177003859 A KR 1020177003859A KR 20177003859 A KR20177003859 A KR 20177003859A KR 102166100 B1 KR102166100 B1 KR 102166100B1
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South Korea
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group
sealing
resin composition
compound
preferable
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KR1020177003859A
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Korean (ko)
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KR20170031198A (ko
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준-이치 다베이
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스미토모 베이클리트 컴퍼니 리미티드
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Wire Bonding (AREA)
KR1020177003859A 2014-07-16 2015-06-01 봉지용 수지 조성물 및 반도체 장치 KR102166100B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014145613A JP6507506B2 (ja) 2014-07-16 2014-07-16 封止用樹脂組成物及び半導体装置
JPJP-P-2014-145613 2014-07-16
PCT/JP2015/065723 WO2016009730A1 (ja) 2014-07-16 2015-06-01 封止用樹脂組成物及び半導体装置

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Publication Number Publication Date
KR20170031198A KR20170031198A (ko) 2017-03-20
KR102166100B1 true KR102166100B1 (ko) 2020-10-15

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JP (1) JP6507506B2 (ja)
KR (1) KR102166100B1 (ja)
CN (1) CN106536591B (ja)
TW (1) TWI657128B (ja)
WO (1) WO2016009730A1 (ja)

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Publication number Priority date Publication date Assignee Title
CN107200995A (zh) * 2016-03-16 2017-09-26 住友电木株式会社 环氧树脂组合物和半导体装置
CN109563352B (zh) * 2016-08-30 2021-10-22 琳得科株式会社 树脂组合物、树脂片及半导体装置
JP7139598B2 (ja) * 2017-06-23 2022-09-21 住友ベークライト株式会社 封止用樹脂組成物の製造方法及び電子装置の製造方法
WO2019035430A1 (ja) * 2017-08-14 2019-02-21 日立化成株式会社 封止用樹脂組成物、半導体装置及び半導体装置の製造方法
JP7329320B2 (ja) * 2018-11-01 2023-08-18 株式会社ダイセル 硬化性エポキシ樹脂組成物
JP7341828B2 (ja) * 2019-09-30 2023-09-11 太陽ホールディングス株式会社 硬化性樹脂組成物、ドライフィルム、樹脂付き銅箔、硬化物、及び電子部品
CN115461406A (zh) * 2020-04-30 2022-12-09 昭和电工材料株式会社 密封用环氧树脂组合物、电子零件装置及其制造方法

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JP2009209318A (ja) 2008-03-06 2009-09-17 Dic Corp エポキシ樹脂組成物、及びその硬化物
JP2009209317A (ja) 2008-03-06 2009-09-17 Dic Corp エポキシ樹脂組成物、及びその硬化物

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JPS62207320A (ja) * 1986-03-07 1987-09-11 Hitachi Ltd 熱硬化性樹脂組成物で封止してなる半導体装置
JPH06322076A (ja) * 1993-05-10 1994-11-22 Mitsui Toatsu Chem Inc 半導体封止用エポキシ樹脂組成物
JP2001055488A (ja) * 1999-06-10 2001-02-27 Shin Etsu Chem Co Ltd フリップチップ型半導体装置用封止材及びフリップチップ型半導体装置
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