KR102133559B1 - 폴리이미드 전구체, 수지 조성물 및 수지 필름의 제조 방법 - Google Patents

폴리이미드 전구체, 수지 조성물 및 수지 필름의 제조 방법 Download PDF

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KR102133559B1
KR102133559B1 KR1020187003697A KR20187003697A KR102133559B1 KR 102133559 B1 KR102133559 B1 KR 102133559B1 KR 1020187003697 A KR1020187003697 A KR 1020187003697A KR 20187003697 A KR20187003697 A KR 20187003697A KR 102133559 B1 KR102133559 B1 KR 102133559B1
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polyimide
group
film
carbon atoms
polyimide precursor
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KR20180048605A (ko
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마사키 마이타니
다케키 시미즈
다카유키 가나다
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아사히 가세이 가부시키가이샤
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1025—Preparatory processes from tetracarboxylic acids or derivatives and diamines polymerised by radiations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/16—Polyester-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electroluminescent Light Sources (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Laminated Bodies (AREA)
  • Liquid Crystal (AREA)
KR1020187003697A 2015-09-24 2016-09-21 폴리이미드 전구체, 수지 조성물 및 수지 필름의 제조 방법 Active KR102133559B1 (ko)

Priority Applications (1)

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KR1020207019673A KR102460768B1 (ko) 2015-09-24 2016-09-21 폴리이미드 전구체, 수지 조성물 및 수지 필름의 제조 방법

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2015186730 2015-09-24
JPJP-P-2015-186730 2015-09-24
JPJP-P-2015-218783 2015-11-06
JP2015218783 2015-11-06
JP2016055476 2016-03-18
JPJP-P-2016-055476 2016-03-18
JPJP-P-2016-124849 2016-06-23
JP2016124849 2016-06-23
PCT/JP2016/077878 WO2017051827A1 (ja) 2015-09-24 2016-09-21 ポリイミド前駆体、樹脂組成物および樹脂フィルムの製造方法

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KR1020207019673A Division KR102460768B1 (ko) 2015-09-24 2016-09-21 폴리이미드 전구체, 수지 조성물 및 수지 필름의 제조 방법

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KR20180048605A KR20180048605A (ko) 2018-05-10
KR102133559B1 true KR102133559B1 (ko) 2020-07-13

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KR1020227037038A Active KR102659377B1 (ko) 2015-09-24 2016-09-21 폴리이미드 전구체, 수지 조성물 및 수지 필름의 제조 방법
KR1020207019673A Active KR102460768B1 (ko) 2015-09-24 2016-09-21 폴리이미드 전구체, 수지 조성물 및 수지 필름의 제조 방법

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KR1020207019673A Active KR102460768B1 (ko) 2015-09-24 2016-09-21 폴리이미드 전구체, 수지 조성물 및 수지 필름의 제조 방법

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JP (5) JP6444522B2 (enrdf_load_stackoverflow)
KR (3) KR102133559B1 (enrdf_load_stackoverflow)
CN (2) CN108026273B (enrdf_load_stackoverflow)
TW (2) TWI641632B (enrdf_load_stackoverflow)
WO (1) WO2017051827A1 (enrdf_load_stackoverflow)

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KR102516144B1 (ko) * 2018-08-28 2023-03-29 주식회사 엘지화학 투명 필름 제조용 용매의 전처리 방법
KR102452136B1 (ko) * 2018-12-20 2022-10-07 코오롱인더스트리 주식회사 폴리아믹산, 폴리이미드 수지 및 폴리이미드 필름
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JP6690057B1 (ja) * 2019-02-01 2020-04-28 ウィンゴーテクノロジー株式会社 ポリイミド化合物及び該ポリイミド化合物を含む成形物
JP7414011B2 (ja) 2019-02-01 2024-01-16 エルジー・ケム・リミテッド ポリイミド系樹脂フィルム、およびこれを利用したディスプレイ装置用基板ならびに光学装置
WO2020159193A1 (ko) * 2019-02-01 2020-08-06 주식회사 엘지화학 폴리이미드 전구체 조성물 및 이로부터 제조된 폴리이미드 필름, 디스플레이 장치용 기판, 및 광학 장치
JPWO2020195819A1 (enrdf_load_stackoverflow) * 2019-03-26 2020-10-01
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JP2021175790A (ja) * 2020-04-24 2021-11-04 旭化成株式会社 ポリイミド前駆体及びそれを含む樹脂組成物、ポリイミド樹脂膜、樹脂フィルム及びその製造方法
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CN112175186B (zh) * 2020-10-29 2022-12-20 深圳市道尔顿电子材料有限公司 聚酰亚胺材料及其制备方法、聚酰亚胺薄膜及其制备方法
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WO2025084154A1 (ja) * 2023-10-19 2025-04-24 三菱瓦斯化学株式会社 ポリイミド樹脂の製造方法
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