KR102085888B1 - 발광 소자 - Google Patents

발광 소자 Download PDF

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Publication number
KR102085888B1
KR102085888B1 KR1020130051766A KR20130051766A KR102085888B1 KR 102085888 B1 KR102085888 B1 KR 102085888B1 KR 1020130051766 A KR1020130051766 A KR 1020130051766A KR 20130051766 A KR20130051766 A KR 20130051766A KR 102085888 B1 KR102085888 B1 KR 102085888B1
Authority
KR
South Korea
Prior art keywords
light emitting
straight line
emitting chip
wire
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020130051766A
Other languages
English (en)
Korean (ko)
Other versions
KR20140132517A (ko
Inventor
박기훈
박정환
조현석
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to KR1020130051766A priority Critical patent/KR102085888B1/ko
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to PCT/KR2014/003781 priority patent/WO2014181996A1/ko
Priority to US14/890,095 priority patent/US9543489B2/en
Priority to CN201480026275.0A priority patent/CN105210201B/zh
Priority to EP14795411.9A priority patent/EP2996164B1/en
Priority to JP2016512822A priority patent/JP2016524322A/ja
Publication of KR20140132517A publication Critical patent/KR20140132517A/ko
Application granted granted Critical
Publication of KR102085888B1 publication Critical patent/KR102085888B1/ko
Assigned to 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 reassignment 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 권리의 전부이전등록 Assignors: 엘지이노텍 주식회사
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
KR1020130051766A 2013-05-08 2013-05-08 발광 소자 Expired - Fee Related KR102085888B1 (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020130051766A KR102085888B1 (ko) 2013-05-08 2013-05-08 발광 소자
US14/890,095 US9543489B2 (en) 2013-05-08 2014-04-29 Light emitting device
CN201480026275.0A CN105210201B (zh) 2013-05-08 2014-04-29 发光器件
EP14795411.9A EP2996164B1 (en) 2013-05-08 2014-04-29 Light emitting device
PCT/KR2014/003781 WO2014181996A1 (ko) 2013-05-08 2014-04-29 발광 소자
JP2016512822A JP2016524322A (ja) 2013-05-08 2014-04-29 発光素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130051766A KR102085888B1 (ko) 2013-05-08 2013-05-08 발광 소자

Publications (2)

Publication Number Publication Date
KR20140132517A KR20140132517A (ko) 2014-11-18
KR102085888B1 true KR102085888B1 (ko) 2020-03-06

Family

ID=51867433

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130051766A Expired - Fee Related KR102085888B1 (ko) 2013-05-08 2013-05-08 발광 소자

Country Status (6)

Country Link
US (1) US9543489B2 (https=)
EP (1) EP2996164B1 (https=)
JP (1) JP2016524322A (https=)
KR (1) KR102085888B1 (https=)
CN (1) CN105210201B (https=)
WO (1) WO2014181996A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11085591B2 (en) 2014-09-28 2021-08-10 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11997768B2 (en) 2014-09-28 2024-05-28 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11073248B2 (en) 2014-09-28 2021-07-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
US11421827B2 (en) 2015-06-19 2022-08-23 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11543083B2 (en) 2014-09-28 2023-01-03 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11686436B2 (en) 2014-09-28 2023-06-27 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and light bulb using LED filament
US11525547B2 (en) 2014-09-28 2022-12-13 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
USD770987S1 (en) 2014-10-17 2016-11-08 Panasonic Intellectual Property Management Co., Ltd. Light emitting diode
KR102402577B1 (ko) * 2017-09-19 2022-05-26 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지
EP3460861B1 (en) * 2017-09-21 2023-03-01 InnoLux Corporation Display device
JP7037044B2 (ja) * 2017-12-27 2022-03-16 日亜化学工業株式会社 発光装置及びその製造方法
US10982048B2 (en) 2018-04-17 2021-04-20 Jiaxing Super Lighting Electric Appliance Co., Ltd Organosilicon-modified polyimide resin composition and use thereof
TWI728816B (zh) * 2020-05-21 2021-05-21 健策精密工業股份有限公司 發光二極體模組及其製作方法
US12543414B2 (en) 2020-05-21 2026-02-03 Jentech Precision Industrial Co., Ltd. Light emitting diode module and manufacturing method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011086901A (ja) 2009-10-19 2011-04-28 Paragon Semiconductor Lighting Technology Co Ltd 円形に近い形状の発光効果を生成するマルチチップ発光ダイオードパッケージ構造
JP2012094865A (ja) 2010-10-22 2012-05-17 Paragon Semiconductor Lighting Technology Co Ltd 定電圧電源供給手段を使用するマルチチップパッケージ
US20120273806A1 (en) 2011-04-28 2012-11-01 Paragon Semiconductor Lighting Technology Co., Ltd Led package structure
WO2013015058A1 (ja) * 2011-07-25 2013-01-31 日亜化学工業株式会社 発光装置

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JP3993302B2 (ja) * 1998-05-20 2007-10-17 ローム株式会社 半導体装置
JP2005236182A (ja) * 2004-02-23 2005-09-02 Pentax Corp 半導体発光素子
US7514724B2 (en) * 2007-03-23 2009-04-07 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Solid state light source having a variable number of dies
KR100977260B1 (ko) * 2007-12-28 2010-08-23 한국 고덴시 주식회사 고출력 엘이디 패키지 및 그 제조방법
CN102334202B (zh) * 2009-02-27 2014-12-31 东芝照明技术株式会社 发光模块及照明装置
JP4890576B2 (ja) * 2009-02-27 2012-03-07 東芝ライテック株式会社 発光モジュール
JP5408414B2 (ja) * 2009-06-10 2014-02-05 東芝ライテック株式会社 発光モジュール
JP2011009298A (ja) * 2009-06-23 2011-01-13 Citizen Electronics Co Ltd 発光ダイオード光源装置
JP2011151268A (ja) * 2010-01-22 2011-08-04 Sharp Corp 発光装置
JP2011181888A (ja) * 2010-02-03 2011-09-15 Toshiba Lighting & Technology Corp 発光装置及び照明装置
CN102893418B (zh) 2010-04-26 2015-07-22 松下电器产业株式会社 发光单元、照明装置
JP5531823B2 (ja) * 2010-06-29 2014-06-25 日亜化学工業株式会社 発光装置およびその検査方法、製造方法
JP2012124249A (ja) * 2010-12-07 2012-06-28 Toshiba Corp Ｌｅｄパッケージ及びその製造方法
US8455908B2 (en) * 2011-02-16 2013-06-04 Cree, Inc. Light emitting devices
JP5810758B2 (ja) * 2011-08-31 2015-11-11 日亜化学工業株式会社 発光装置
KR20130046175A (ko) * 2011-10-27 2013-05-07 서울반도체 주식회사 멀티칩형 엘이디 패키지
JP6046514B2 (ja) 2012-03-01 2016-12-14 株式会社半導体エネルギー研究所 半導体装置
JP5857928B2 (ja) * 2012-09-25 2016-02-10 豊田合成株式会社 発光装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011086901A (ja) 2009-10-19 2011-04-28 Paragon Semiconductor Lighting Technology Co Ltd 円形に近い形状の発光効果を生成するマルチチップ発光ダイオードパッケージ構造
JP2012094865A (ja) 2010-10-22 2012-05-17 Paragon Semiconductor Lighting Technology Co Ltd 定電圧電源供給手段を使用するマルチチップパッケージ
US20120273806A1 (en) 2011-04-28 2012-11-01 Paragon Semiconductor Lighting Technology Co., Ltd Led package structure
WO2013015058A1 (ja) * 2011-07-25 2013-01-31 日亜化学工業株式会社 発光装置

Also Published As

Publication number Publication date
WO2014181996A1 (ko) 2014-11-13
EP2996164A4 (en) 2016-11-30
US9543489B2 (en) 2017-01-10
US20160087178A1 (en) 2016-03-24
JP2016524322A (ja) 2016-08-12
CN105210201A (zh) 2015-12-30
CN105210201B (zh) 2019-06-04
KR20140132517A (ko) 2014-11-18
EP2996164B1 (en) 2021-06-16
EP2996164A1 (en) 2016-03-16

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