KR102001356B1 - 비트 불량 및 가상 검사를 이용한 웨이퍼 검사 공정의 생성 - Google Patents

비트 불량 및 가상 검사를 이용한 웨이퍼 검사 공정의 생성 Download PDF

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KR102001356B1
KR102001356B1 KR1020187022407A KR20187022407A KR102001356B1 KR 102001356 B1 KR102001356 B1 KR 102001356B1 KR 1020187022407 A KR1020187022407 A KR 1020187022407A KR 20187022407 A KR20187022407 A KR 20187022407A KR 102001356 B1 KR102001356 B1 KR 102001356B1
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wafer
defects
physical locations
inspection
defect detection
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KR20180093090A (ko
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포 분 용
조지 시몬
위에종 두
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케이엘에이-텐코 코포레이션
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    • H01L22/20—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H01L22/12—
    • H01L22/14—
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/207—Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
KR1020187022407A 2012-01-18 2013-01-17 비트 불량 및 가상 검사를 이용한 웨이퍼 검사 공정의 생성 Active KR102001356B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261587911P 2012-01-18 2012-01-18
US61/587,911 2012-01-18
US13/743,074 US9277186B2 (en) 2012-01-18 2013-01-16 Generating a wafer inspection process using bit failures and virtual inspection
US13/743,074 2013-01-16
PCT/US2013/021880 WO2013109714A1 (en) 2012-01-18 2013-01-17 Generating a wafer inspection process using bit failures and virtual inspection

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KR1020147022835A Division KR101886853B1 (ko) 2012-01-18 2013-01-17 비트 불량 및 가상 검사를 이용한 웨이퍼 검사 공정의 생성

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KR20180093090A KR20180093090A (ko) 2018-08-20
KR102001356B1 true KR102001356B1 (ko) 2019-07-17

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KR1020147022835A Active KR101886853B1 (ko) 2012-01-18 2013-01-17 비트 불량 및 가상 검사를 이용한 웨이퍼 검사 공정의 생성

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US (2) US9277186B2 (https=)
JP (2) JP6180435B2 (https=)
KR (2) KR102001356B1 (https=)
CN (2) CN108062558B (https=)
TW (1) TWI625803B (https=)
WO (1) WO2013109714A1 (https=)

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US9470743B2 (en) 2014-03-04 2016-10-18 Nvidia Corporation Dynamic yield prediction
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US10127653B2 (en) * 2014-07-22 2018-11-13 Kla-Tencor Corp. Determining coordinates for an area of interest on a specimen
US9816939B2 (en) 2014-07-22 2017-11-14 Kla-Tencor Corp. Virtual inspection systems with multiple modes
US10133263B1 (en) 2014-08-18 2018-11-20 Kla-Tencor Corporation Process condition based dynamic defect inspection
US10267746B2 (en) 2014-10-22 2019-04-23 Kla-Tencor Corp. Automated pattern fidelity measurement plan generation
US9830421B2 (en) * 2014-12-31 2017-11-28 Kla-Tencor Corp. Alignment of inspection to design using built in targets
US10012599B2 (en) * 2015-04-03 2018-07-03 Kla-Tencor Corp. Optical die to database inspection
US10018571B2 (en) * 2015-05-28 2018-07-10 Kla-Tencor Corporation System and method for dynamic care area generation on an inspection tool
US9916965B2 (en) * 2015-12-31 2018-03-13 Kla-Tencor Corp. Hybrid inspectors
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WO2018134287A1 (en) * 2017-01-18 2018-07-26 Asml Netherlands B.V. Cascade defect inspection
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JP7404009B2 (ja) * 2019-09-19 2023-12-25 キオクシア株式会社 加工情報管理システム及び加工情報管理方法
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CN101785009B (zh) * 2007-08-20 2012-10-10 恪纳腾公司 确定实际缺陷是潜在系统性缺陷还是潜在随机缺陷的计算机实现的方法
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Also Published As

Publication number Publication date
US20160163606A1 (en) 2016-06-09
CN108062558A (zh) 2018-05-22
CN104137120A (zh) 2014-11-05
KR20140124778A (ko) 2014-10-27
KR101886853B1 (ko) 2018-08-09
KR20180093090A (ko) 2018-08-20
TWI625803B (zh) 2018-06-01
JP2015509196A (ja) 2015-03-26
TW201344822A (zh) 2013-11-01
CN108062558B (zh) 2022-10-11
JP6180435B2 (ja) 2017-08-16
WO2013109714A1 (en) 2013-07-25
JP2017216466A (ja) 2017-12-07
US9277186B2 (en) 2016-03-01
US20130182101A1 (en) 2013-07-18
US10014229B2 (en) 2018-07-03
CN104137120B (zh) 2018-01-02
JP6342046B2 (ja) 2018-06-13

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