KR101994570B1 - 열처리 장치 및 열처리 방법 - Google Patents

열처리 장치 및 열처리 방법 Download PDF

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Publication number
KR101994570B1
KR101994570B1 KR1020177026625A KR20177026625A KR101994570B1 KR 101994570 B1 KR101994570 B1 KR 101994570B1 KR 1020177026625 A KR1020177026625 A KR 1020177026625A KR 20177026625 A KR20177026625 A KR 20177026625A KR 101994570 B1 KR101994570 B1 KR 101994570B1
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South Korea
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control
temperature
value
heat treatment
plate
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KR1020177026625A
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Korean (ko)
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KR20170120151A (ko
Inventor
도루 몸마
야스히로 후쿠모토
고지 니시
시게히로 고토
겐이치로 조
아쓰시 다나카
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가부시키가이샤 스크린 홀딩스
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H01L21/67098—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
    • H01L21/324—
    • H01L21/67248—
    • H01L21/67253—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/021—Control thereof
    • F25B2321/0212—Control thereof of electric power, current or voltage

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Temperature (AREA)
KR1020177026625A 2015-03-26 2015-11-17 열처리 장치 및 열처리 방법 Active KR101994570B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2015-063949 2015-03-26
JP2015063949A JP6442339B2 (ja) 2015-03-26 2015-03-26 熱処理装置および熱処理方法
PCT/JP2015/005727 WO2016151651A1 (ja) 2015-03-26 2015-11-17 熱処理装置および熱処理方法

Publications (2)

Publication Number Publication Date
KR20170120151A KR20170120151A (ko) 2017-10-30
KR101994570B1 true KR101994570B1 (ko) 2019-06-28

Family

ID=56977144

Family Applications (1)

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KR1020177026625A Active KR101994570B1 (ko) 2015-03-26 2015-11-17 열처리 장치 및 열처리 방법

Country Status (6)

Country Link
US (1) US10629463B2 (https=)
JP (1) JP6442339B2 (https=)
KR (1) KR101994570B1 (https=)
CN (1) CN107430985B (https=)
TW (1) TWI644342B (https=)
WO (1) WO2016151651A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10908195B2 (en) 2016-06-15 2021-02-02 Watlow Electric Manufacturing Company System and method for controlling power to a heater
JP6872914B2 (ja) * 2017-01-30 2021-05-19 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置および熱処理方法
CN111226498B (zh) * 2017-08-10 2022-04-12 沃特洛电气制造公司 用于控制给加热器的功率的系统和方法
IT201800020272A1 (it) * 2018-12-20 2020-06-20 Amx Automatrix S R L Pressa di sinterizzazione per sinterizzare componenti elettronici su un substrato
JP7256034B2 (ja) * 2019-03-04 2023-04-11 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置および熱処理方法
JP7198718B2 (ja) * 2019-04-26 2023-01-04 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置および熱処理方法
JP2022125685A (ja) * 2021-02-17 2022-08-29 株式会社Kelk 半導体ウエハの温度制御装置及び半導体ウエハの温度制御方法
JP2025132352A (ja) 2024-02-29 2025-09-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07115058A (ja) 1993-10-18 1995-05-02 Dainippon Screen Mfg Co Ltd 基板冷却装置
US5638687A (en) 1994-11-21 1997-06-17 Dainippon Screen Mfg. Co., Ltd. Substrate cooling method and apparatus
JPH08148421A (ja) 1994-11-21 1996-06-07 Dainippon Screen Mfg Co Ltd 基板冷却装置
JPH08203796A (ja) 1995-01-30 1996-08-09 Dainippon Screen Mfg Co Ltd 基板冷却装置
JPH08236414A (ja) 1995-02-27 1996-09-13 Dainippon Screen Mfg Co Ltd 基板冷却装置
JP3504018B2 (ja) * 1995-03-31 2004-03-08 大日本スクリーン製造株式会社 基板冷却装置
JP3665826B2 (ja) * 1997-05-29 2005-06-29 Ｓｍｃ株式会社 基板熱処理装置
US6230497B1 (en) * 1999-12-06 2001-05-15 Motorola, Inc. Semiconductor circuit temperature monitoring and controlling apparatus and method
US6191399B1 (en) * 2000-02-01 2001-02-20 Asm America, Inc. System of controlling the temperature of a processing chamber
CN100367458C (zh) * 2002-10-25 2008-02-06 东京毅力科创株式会社 热处理装置和热处理方法
JP4384538B2 (ja) * 2003-06-16 2009-12-16 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP5040213B2 (ja) 2006-08-15 2012-10-03 東京エレクトロン株式会社 熱処理装置、熱処理方法及び記憶媒体
JP5041016B2 (ja) 2010-03-01 2012-10-03 東京エレクトロン株式会社 熱処理装置、熱処理方法及び記憶媒体
JP5048810B2 (ja) * 2010-06-23 2012-10-17 東京エレクトロン株式会社 熱処理装置及び熱処理方法
KR101512874B1 (ko) * 2010-09-07 2015-04-16 도쿄엘렉트론가부시키가이샤 종형 열처리 장치 및 그 제어 방법
JP2012080080A (ja) 2010-09-07 2012-04-19 Tokyo Electron Ltd 縦型熱処理装置及びその制御方法
US9845981B2 (en) 2011-04-19 2017-12-19 Liebert Corporation Load estimator for control of vapor compression cooling system with pumped refrigerant economization
US9038404B2 (en) 2011-04-19 2015-05-26 Liebert Corporation High efficiency cooling system
US9316424B2 (en) 2011-04-19 2016-04-19 Liebert Corporation Multi-stage cooling system with tandem compressors and optimized control of sensible cooling and dehumidification
JP5708310B2 (ja) * 2011-07-01 2015-04-30 東京エレクトロン株式会社 基板処理装置
JP2013062361A (ja) 2011-09-13 2013-04-04 Tokyo Electron Ltd 熱処理装置、温度制御システム、熱処理方法、温度制御方法及びその熱処理方法又はその温度制御方法を実行させるためのプログラムを記録した記録媒体
JP5951438B2 (ja) * 2012-10-05 2016-07-13 光洋サーモシステム株式会社 熱処理装置
JP6064613B2 (ja) * 2013-01-18 2017-01-25 株式会社ノーリツ 給湯装置

Also Published As

Publication number Publication date
TW201637077A (zh) 2016-10-16
US10629463B2 (en) 2020-04-21
US20180033660A1 (en) 2018-02-01
JP6442339B2 (ja) 2018-12-19
CN107430985B (zh) 2020-10-30
WO2016151651A1 (ja) 2016-09-29
KR20170120151A (ko) 2017-10-30
TWI644342B (zh) 2018-12-11
CN107430985A (zh) 2017-12-01
JP2016183815A (ja) 2016-10-20

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