CN107430985B - 热处理装置以及热处理方法 - Google Patents

热处理装置以及热处理方法 Download PDF

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Publication number
CN107430985B
CN107430985B CN201580077665.5A CN201580077665A CN107430985B CN 107430985 B CN107430985 B CN 107430985B CN 201580077665 A CN201580077665 A CN 201580077665A CN 107430985 B CN107430985 B CN 107430985B
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control
value
temperature
heat treatment
unit
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Chinese (zh)
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CN107430985A (zh
Inventor
门间徹
福本靖博
西幸治
后藤茂宏
城宪一郎
田中淳
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/021—Control thereof
    • F25B2321/0212—Control thereof of electric power, current or voltage

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Temperature (AREA)
CN201580077665.5A 2015-03-26 2015-11-17 热处理装置以及热处理方法 Active CN107430985B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015-063949 2015-03-26
JP2015063949A JP6442339B2 (ja) 2015-03-26 2015-03-26 熱処理装置および熱処理方法
PCT/JP2015/005727 WO2016151651A1 (ja) 2015-03-26 2015-11-17 熱処理装置および熱処理方法

Publications (2)

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CN107430985A CN107430985A (zh) 2017-12-01
CN107430985B true CN107430985B (zh) 2020-10-30

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US (1) US10629463B2 (https=)
JP (1) JP6442339B2 (https=)
KR (1) KR101994570B1 (https=)
CN (1) CN107430985B (https=)
TW (1) TWI644342B (https=)
WO (1) WO2016151651A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10908195B2 (en) 2016-06-15 2021-02-02 Watlow Electric Manufacturing Company System and method for controlling power to a heater
JP6872914B2 (ja) * 2017-01-30 2021-05-19 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置および熱処理方法
CN111226498B (zh) * 2017-08-10 2022-04-12 沃特洛电气制造公司 用于控制给加热器的功率的系统和方法
IT201800020272A1 (it) * 2018-12-20 2020-06-20 Amx Automatrix S R L Pressa di sinterizzazione per sinterizzare componenti elettronici su un substrato
JP7256034B2 (ja) * 2019-03-04 2023-04-11 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置および熱処理方法
JP7198718B2 (ja) * 2019-04-26 2023-01-04 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置および熱処理方法
JP2022125685A (ja) * 2021-02-17 2022-08-29 株式会社Kelk 半導体ウエハの温度制御装置及び半導体ウエハの温度制御方法
JP2025132352A (ja) 2024-02-29 2025-09-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Citations (9)

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US6080969A (en) * 1997-05-29 2000-06-27 Smc Corporation Apparatus for and method of thermally processing substrate
CN1685476A (zh) * 2002-10-25 2005-10-19 东京毅力科创株式会社 热处理装置和热处理方法
CN101127298A (zh) * 2006-08-15 2008-02-20 东京毅力科创株式会社 热处理装置、热处理方法、计算机程序及存储介质
CN102194662A (zh) * 2010-03-01 2011-09-21 东京毅力科创株式会社 热处理装置、热处理方法和存储介质
CN102299047A (zh) * 2010-06-23 2011-12-28 东京毅力科创株式会社 热处理装置和热处理方法
CN102403195A (zh) * 2010-09-07 2012-04-04 东京毅力科创株式会社 纵型热处理装置及其控制方法
CN103609206A (zh) * 2011-04-19 2014-02-26 力博特公司 高效冷却系统
CN103712465A (zh) * 2012-10-05 2014-04-09 光洋热系统股份有限公司 热处理装置
CN103940094A (zh) * 2013-01-18 2014-07-23 株式会社能率 供热水装置及其控制方法

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JPH07115058A (ja) 1993-10-18 1995-05-02 Dainippon Screen Mfg Co Ltd 基板冷却装置
US5638687A (en) 1994-11-21 1997-06-17 Dainippon Screen Mfg. Co., Ltd. Substrate cooling method and apparatus
JPH08148421A (ja) 1994-11-21 1996-06-07 Dainippon Screen Mfg Co Ltd 基板冷却装置
JPH08203796A (ja) 1995-01-30 1996-08-09 Dainippon Screen Mfg Co Ltd 基板冷却装置
JPH08236414A (ja) 1995-02-27 1996-09-13 Dainippon Screen Mfg Co Ltd 基板冷却装置
JP3504018B2 (ja) * 1995-03-31 2004-03-08 大日本スクリーン製造株式会社 基板冷却装置
US6230497B1 (en) * 1999-12-06 2001-05-15 Motorola, Inc. Semiconductor circuit temperature monitoring and controlling apparatus and method
US6191399B1 (en) * 2000-02-01 2001-02-20 Asm America, Inc. System of controlling the temperature of a processing chamber
JP4384538B2 (ja) * 2003-06-16 2009-12-16 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP2012080080A (ja) 2010-09-07 2012-04-19 Tokyo Electron Ltd 縦型熱処理装置及びその制御方法
US9845981B2 (en) 2011-04-19 2017-12-19 Liebert Corporation Load estimator for control of vapor compression cooling system with pumped refrigerant economization
US9316424B2 (en) 2011-04-19 2016-04-19 Liebert Corporation Multi-stage cooling system with tandem compressors and optimized control of sensible cooling and dehumidification
JP5708310B2 (ja) * 2011-07-01 2015-04-30 東京エレクトロン株式会社 基板処理装置
JP2013062361A (ja) 2011-09-13 2013-04-04 Tokyo Electron Ltd 熱処理装置、温度制御システム、熱処理方法、温度制御方法及びその熱処理方法又はその温度制御方法を実行させるためのプログラムを記録した記録媒体

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6080969A (en) * 1997-05-29 2000-06-27 Smc Corporation Apparatus for and method of thermally processing substrate
CN1685476A (zh) * 2002-10-25 2005-10-19 东京毅力科创株式会社 热处理装置和热处理方法
CN101127298A (zh) * 2006-08-15 2008-02-20 东京毅力科创株式会社 热处理装置、热处理方法、计算机程序及存储介质
CN102194662A (zh) * 2010-03-01 2011-09-21 东京毅力科创株式会社 热处理装置、热处理方法和存储介质
CN102299047A (zh) * 2010-06-23 2011-12-28 东京毅力科创株式会社 热处理装置和热处理方法
CN102403195A (zh) * 2010-09-07 2012-04-04 东京毅力科创株式会社 纵型热处理装置及其控制方法
CN103609206A (zh) * 2011-04-19 2014-02-26 力博特公司 高效冷却系统
CN103712465A (zh) * 2012-10-05 2014-04-09 光洋热系统股份有限公司 热处理装置
CN103940094A (zh) * 2013-01-18 2014-07-23 株式会社能率 供热水装置及其控制方法

Also Published As

Publication number Publication date
TW201637077A (zh) 2016-10-16
US10629463B2 (en) 2020-04-21
US20180033660A1 (en) 2018-02-01
JP6442339B2 (ja) 2018-12-19
WO2016151651A1 (ja) 2016-09-29
KR20170120151A (ko) 2017-10-30
TWI644342B (zh) 2018-12-11
KR101994570B1 (ko) 2019-06-28
CN107430985A (zh) 2017-12-01
JP2016183815A (ja) 2016-10-20

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