KR101954410B1 - 플라즈마 에칭을 이용한 반사방지 표면의 제조방법 및 반사방지 표면이 형성된 기판 - Google Patents

플라즈마 에칭을 이용한 반사방지 표면의 제조방법 및 반사방지 표면이 형성된 기판 Download PDF

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Publication number
KR101954410B1
KR101954410B1 KR1020160106210A KR20160106210A KR101954410B1 KR 101954410 B1 KR101954410 B1 KR 101954410B1 KR 1020160106210 A KR1020160106210 A KR 1020160106210A KR 20160106210 A KR20160106210 A KR 20160106210A KR 101954410 B1 KR101954410 B1 KR 101954410B1
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KR
South Korea
Prior art keywords
antireflection
substrate
base substrate
dry etching
plasma
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KR1020160106210A
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English (en)
Korean (ko)
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KR20170023396A (ko
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김현중
김홍철
김정래
최병경
왕홍래
권아현
신동현
이성도
나종주
권정대
Original Assignee
주식회사 쎄코
한국기계연구원
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Publication of KR20170023396A publication Critical patent/KR20170023396A/ko
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Publication of KR101954410B1 publication Critical patent/KR101954410B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0216—Coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0216—Coatings
    • H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H01L31/02168—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells the coatings being antireflective or having enhancing optical properties for the solar cells

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Electromagnetism (AREA)
  • Plasma & Fusion (AREA)
  • Sustainable Energy (AREA)
  • Surface Treatment Of Optical Elements (AREA)
  • Laminated Bodies (AREA)
  • Drying Of Semiconductors (AREA)
KR1020160106210A 2015-08-21 2016-08-22 플라즈마 에칭을 이용한 반사방지 표면의 제조방법 및 반사방지 표면이 형성된 기판 KR101954410B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020150117742 2015-08-21
KR20150117742 2015-08-21

Publications (2)

Publication Number Publication Date
KR20170023396A KR20170023396A (ko) 2017-03-03
KR101954410B1 true KR101954410B1 (ko) 2019-03-06

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KR1020160106210A KR101954410B1 (ko) 2015-08-21 2016-08-22 플라즈마 에칭을 이용한 반사방지 표면의 제조방법 및 반사방지 표면이 형성된 기판

Country Status (4)

Country Link
JP (1) JP6770576B2 (ja)
KR (1) KR101954410B1 (ja)
CN (1) CN107949901B (ja)
WO (1) WO2017034262A1 (ja)

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KR101965343B1 (ko) * 2017-11-28 2019-04-03 와이아이테크(주) 결정질 태양전지용 플라즈마 텍스처링 방법
DE102018109884B4 (de) * 2018-04-24 2023-07-27 Webasto SE Sensoranordnung mit Blendenelement und Verfahren zur Herstellung des Blendenelements
JP2020184002A (ja) * 2019-05-07 2020-11-12 キヤノン株式会社 光学素子の製造方法、光学素子、撮像装置、および光学機器
CN112531124A (zh) * 2019-09-19 2021-03-19 北京小米移动软件有限公司 显示屏和终端
CN115806775A (zh) * 2022-11-16 2023-03-17 武汉光鹿科技发展有限公司 镜片用有色保护膜及其制备方法

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JP2012048239A (ja) * 2011-08-23 2012-03-08 Dainippon Printing Co Ltd 反射防止フィルムの製造方法

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JP2012048239A (ja) * 2011-08-23 2012-03-08 Dainippon Printing Co Ltd 反射防止フィルムの製造方法

Also Published As

Publication number Publication date
KR20170023396A (ko) 2017-03-03
WO2017034262A1 (ko) 2017-03-02
JP6770576B2 (ja) 2020-10-14
CN107949901B (zh) 2021-08-31
JP2018525688A (ja) 2018-09-06
CN107949901A (zh) 2018-04-20

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