KR101894965B1 - 프로브 핀 및 ic 소켓 - Google Patents
프로브 핀 및 ic 소켓 Download PDFInfo
- Publication number
- KR101894965B1 KR101894965B1 KR1020167031384A KR20167031384A KR101894965B1 KR 101894965 B1 KR101894965 B1 KR 101894965B1 KR 1020167031384 A KR1020167031384 A KR 1020167031384A KR 20167031384 A KR20167031384 A KR 20167031384A KR 101894965 B1 KR101894965 B1 KR 101894965B1
- Authority
- KR
- South Korea
- Prior art keywords
- coil spring
- movable member
- slit
- arm
- auxiliary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014087081 | 2014-04-21 | ||
JPJP-P-2014-087081 | 2014-04-21 | ||
JPJP-P-2014-195895 | 2014-09-25 | ||
JP2014195895A JP2015215328A (ja) | 2014-04-21 | 2014-09-25 | プローブピンおよびicソケット |
JP2014195894A JP6442668B2 (ja) | 2014-04-21 | 2014-09-25 | プローブピンおよびicソケット |
JPJP-P-2014-195894 | 2014-09-25 | ||
PCT/JP2015/061171 WO2015163160A1 (ja) | 2014-04-21 | 2015-04-09 | プローブピンおよびicソケット |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20170020314A KR20170020314A (ko) | 2017-02-22 |
KR101894965B1 true KR101894965B1 (ko) | 2018-09-05 |
Family
ID=54752325
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020167031384A Active KR101894965B1 (ko) | 2014-04-21 | 2015-04-09 | 프로브 핀 및 ic 소켓 |
Country Status (2)
Country | Link |
---|---|
JP (2) | JP2015215328A (enrdf_load_stackoverflow) |
KR (1) | KR101894965B1 (enrdf_load_stackoverflow) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6837283B2 (ja) | 2016-02-29 | 2021-03-03 | 株式会社ヨコオ | ソケット |
KR101819191B1 (ko) * | 2016-07-20 | 2018-01-16 | 주식회사 마이크로컨텍솔루션 | 컨택트 프로브 |
JP7021874B2 (ja) * | 2017-06-28 | 2022-02-17 | 株式会社ヨコオ | コンタクトプローブ及び検査治具 |
JP7024275B2 (ja) * | 2017-09-19 | 2022-02-24 | 日本電産リード株式会社 | 接触端子、検査治具、及び検査装置 |
JP7141796B2 (ja) * | 2018-09-26 | 2022-09-26 | 株式会社エンプラス | コンタクトピン及びソケット |
JP6837513B2 (ja) * | 2019-05-07 | 2021-03-03 | 株式会社ヨコオ | ソケット |
JP7130247B2 (ja) * | 2019-05-31 | 2022-09-05 | 共進電機株式会社 | プローブ及び太陽電池セル用測定装置 |
KR102182784B1 (ko) * | 2019-05-31 | 2020-11-25 | 주식회사 오킨스전자 | Mems 켈빈 스프링 핀, 및 이를 이용한 켈빈 테스트 소켓 |
KR102162476B1 (ko) * | 2019-07-18 | 2020-10-06 | 박상량 | 단일 몸체의 하우징으로 구성되는 고성능 반도체 테스트 소켓 |
KR102147699B1 (ko) * | 2020-04-29 | 2020-08-26 | (주)피티앤케이 | 프로브 핀 및 이의 제조 방법 |
KR102456449B1 (ko) * | 2020-08-11 | 2022-10-20 | 리노공업주식회사 | 검사 프로브 |
KR102202827B1 (ko) * | 2020-10-27 | 2021-01-14 | (주) 네스텍코리아 | 프로브 핀 및 이를 적용한 동축 프로브 조립체 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003307542A (ja) | 2002-02-18 | 2003-10-31 | Tokyo Cosmos Electric Co Ltd | Icソケット |
JP4089976B2 (ja) | 2004-05-17 | 2008-05-28 | リーノ アイエヌディー.インコーポレイテッド | 大電流用プローブ |
JP5858781B2 (ja) | 2011-12-29 | 2016-02-10 | 株式会社エンプラス | プローブピン及び電気部品用ソケット |
JP6011103B2 (ja) | 2012-07-23 | 2016-10-19 | 山一電機株式会社 | コンタクトプローブ及びそれを備えた半導体素子用ソケット |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3326095B2 (ja) * | 1996-12-27 | 2002-09-17 | 日本発条株式会社 | 導電性接触子 |
JP2007048576A (ja) * | 2005-08-09 | 2007-02-22 | Yamaichi Electronics Co Ltd | アダプタソケット |
JP5067790B2 (ja) * | 2007-04-27 | 2012-11-07 | センサータ テクノロジーズ マサチューセッツ インコーポレーテッド | プローブピンおよびそれを用いたソケット |
CN101669034A (zh) * | 2007-04-27 | 2010-03-10 | 日本发条株式会社 | 导电性接触器 |
JP4900843B2 (ja) * | 2008-12-26 | 2012-03-21 | 山一電機株式会社 | 半導体装置用電気接続装置及びそれに使用されるコンタクト |
JP5624746B2 (ja) | 2009-10-23 | 2014-11-12 | 株式会社ヨコオ | コンタクトプローブ及びソケット |
KR101154519B1 (ko) * | 2010-05-27 | 2012-06-13 | 하이콘 주식회사 | 스프링 콘택트 구조 |
JP5503477B2 (ja) | 2010-09-13 | 2014-05-28 | シチズンセイミツ株式会社 | コンタクトプローブ及びこれを用いた電子回路試験装置 |
-
2014
- 2014-09-25 JP JP2014195895A patent/JP2015215328A/ja active Pending
- 2014-09-25 JP JP2014195894A patent/JP6442668B2/ja not_active Expired - Fee Related
-
2015
- 2015-04-09 KR KR1020167031384A patent/KR101894965B1/ko active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003307542A (ja) | 2002-02-18 | 2003-10-31 | Tokyo Cosmos Electric Co Ltd | Icソケット |
JP4089976B2 (ja) | 2004-05-17 | 2008-05-28 | リーノ アイエヌディー.インコーポレイテッド | 大電流用プローブ |
JP5858781B2 (ja) | 2011-12-29 | 2016-02-10 | 株式会社エンプラス | プローブピン及び電気部品用ソケット |
JP6011103B2 (ja) | 2012-07-23 | 2016-10-19 | 山一電機株式会社 | コンタクトプローブ及びそれを備えた半導体素子用ソケット |
Also Published As
Publication number | Publication date |
---|---|
JP6442668B2 (ja) | 2018-12-26 |
KR20170020314A (ko) | 2017-02-22 |
JP2015215327A (ja) | 2015-12-03 |
JP2015215328A (ja) | 2015-12-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101894965B1 (ko) | 프로브 핀 및 ic 소켓 | |
KR101959696B1 (ko) | 프로브 핀 및 그것을 사용한 검사 장치 | |
KR101012712B1 (ko) | 컴플라이언트 전기적 상호접속체 및 전기적 접촉 프로브 | |
TWI482974B (zh) | 接觸式探針及探針座 | |
JP6711469B2 (ja) | プローブ | |
EP2411820B1 (en) | Scrub inducing compliant electrical contact | |
KR101869211B1 (ko) | 접속 단자 | |
US20100267291A1 (en) | Swaging process for improved compliant contact electrical test performance | |
JP4614434B2 (ja) | プローブ | |
TW201935010A (zh) | 探針 | |
JP5008582B2 (ja) | コンタクトプローブ | |
WO2018105316A1 (ja) | プローブピンおよびicソケット | |
JP5071587B2 (ja) | 検査用同軸コネクタ | |
JP2014211378A (ja) | スプリングプローブ | |
WO2015037696A1 (ja) | プローブピンおよびicソケット | |
JP2015004614A (ja) | コンタクトプローブ | |
KR101910063B1 (ko) | 검사장치용 프로브 | |
JP2017142138A (ja) | プローブピンおよび異方導電性部材 | |
US11394148B2 (en) | Contact probe and inspection socket provided with contact probe | |
WO2015163160A1 (ja) | プローブピンおよびicソケット | |
TWI878490B (zh) | 觸針及插座 | |
JP2016125903A (ja) | コンタクトプローブ | |
JP2018021816A (ja) | スプリングプローブ | |
CN114223098B (zh) | 探头 | |
CN118946811A (zh) | 弹簧连接器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
|
PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |