KR101891894B1 - 수지 재료 공급 장치 및 방법, 그리고 압축 성형 장치 - Google Patents

수지 재료 공급 장치 및 방법, 그리고 압축 성형 장치 Download PDF

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Publication number
KR101891894B1
KR101891894B1 KR1020160157761A KR20160157761A KR101891894B1 KR 101891894 B1 KR101891894 B1 KR 101891894B1 KR 1020160157761 A KR1020160157761 A KR 1020160157761A KR 20160157761 A KR20160157761 A KR 20160157761A KR 101891894 B1 KR101891894 B1 KR 101891894B1
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KR
South Korea
Prior art keywords
resin material
flexible sheet
folding member
folding
compression molding
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KR1020160157761A
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English (en)
Korean (ko)
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KR20170074749A (ko
Inventor
신 다케우치
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토와 가부시기가이샤
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B11/00—Making preforms
    • B29B11/02—Making preforms by dividing preformed material, e.g. sheets, rods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3405—Feeding the material to the mould or the compression means using carrying means
    • B29C2043/3416—Feeding the material to the mould or the compression means using carrying means conveyor belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3405—Feeding the material to the mould or the compression means using carrying means
    • B29C2043/3427—Feeding the material to the mould or the compression means using carrying means hopper, vessel, chute, tube, conveying screw, for material in discrete form, e.g. particles or powder or fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
KR1020160157761A 2015-12-22 2016-11-24 수지 재료 공급 장치 및 방법, 그리고 압축 성형 장치 Active KR101891894B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015250316A JP6654887B2 (ja) 2015-12-22 2015-12-22 樹脂材料供給装置及び方法並びに圧縮成形装置
JPJP-P-2015-250316 2015-12-22

Publications (2)

Publication Number Publication Date
KR20170074749A KR20170074749A (ko) 2017-06-30
KR101891894B1 true KR101891894B1 (ko) 2018-08-24

Family

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KR1020160157761A Active KR101891894B1 (ko) 2015-12-22 2016-11-24 수지 재료 공급 장치 및 방법, 그리고 압축 성형 장치

Country Status (4)

Country Link
JP (1) JP6654887B2 (enExample)
KR (1) KR101891894B1 (enExample)
CN (1) CN107030952B (enExample)
TW (1) TWI597147B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10199299B1 (en) 2017-08-07 2019-02-05 Micron Technology, Inc. Semiconductor mold compound transfer system and associated methods
JP6725944B2 (ja) * 2019-06-20 2020-07-22 株式会社オリンピア 遊技機
JP6725945B2 (ja) * 2019-06-20 2020-07-22 株式会社オリンピア 遊技機
JP6725946B2 (ja) * 2019-06-25 2020-07-22 株式会社オリンピア 遊技機
CN114589852B (zh) * 2022-03-17 2024-11-29 黄高维 一种工业生产用树脂井盖上料装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008114512A (ja) * 2006-11-07 2008-05-22 Trinc:Kk 除電機能を持つ樹脂成型機および樹脂成型用除電方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5815153Y2 (ja) * 1973-06-16 1983-03-26 株式会社クボタ プレスセイケイソウチ ニ オケル カナガタ ヘノ ザイリヨウキヨウキユウケンセイケイヒンハンシユツソウチ
JPS5981123A (ja) * 1982-11-01 1984-05-10 Toyota Motor Corp 圧縮成形用金型に可塑化樹脂材料を供給する方法および装置
JPS6389311A (ja) * 1986-10-03 1988-04-20 Mikuni Seisakusho:Kk スタンピング成形型の加熱成形用基材の供給方法
JPH0449127U (enExample) * 1990-08-30 1992-04-24
US6096379A (en) * 1998-03-20 2000-08-01 Eckhoff; Paul S. Radiation processing apparatus and method
JP2000326328A (ja) * 1999-05-24 2000-11-28 Meiwa Ind Co Ltd 加熱軟化樹脂シートの搬送方法
JP2003171009A (ja) * 2001-12-04 2003-06-17 Sainekkusu:Kk 半導体封止用粉状樹脂供給装置
JP4791851B2 (ja) * 2006-02-24 2011-10-12 Ｔｏｗａ株式会社 電子部品の樹脂封止成形装置
JP5793806B2 (ja) * 2011-08-17 2015-10-14 アピックヤマダ株式会社 樹脂モールド装置
JP5693931B2 (ja) * 2010-11-25 2015-04-01 アピックヤマダ株式会社 樹脂モールド装置
KR101439596B1 (ko) * 2012-04-09 2014-09-17 (주)엘지하우시스 태양전지 밀봉재용 ｅｖａ 시트 제조장치
CN103846432A (zh) * 2012-12-05 2014-06-11 兴化市东旭机械有限公司 一种钨粉装填装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008114512A (ja) * 2006-11-07 2008-05-22 Trinc:Kk 除電機能を持つ樹脂成型機および樹脂成型用除電方法

Also Published As

Publication number Publication date
KR20170074749A (ko) 2017-06-30
TWI597147B (zh) 2017-09-01
CN107030952B (zh) 2019-12-31
JP2017113941A (ja) 2017-06-29
JP6654887B2 (ja) 2020-02-26
TW201722670A (zh) 2017-07-01
CN107030952A (zh) 2017-08-11

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