TWI597147B - 樹脂材料供給裝置及方法、以及壓縮成形裝置 - Google Patents

樹脂材料供給裝置及方法、以及壓縮成形裝置 Download PDF

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Publication number
TWI597147B
TWI597147B TW105130601A TW105130601A TWI597147B TW I597147 B TWI597147 B TW I597147B TW 105130601 A TW105130601 A TW 105130601A TW 105130601 A TW105130601 A TW 105130601A TW I597147 B TWI597147 B TW I597147B
Authority
TW
Taiwan
Prior art keywords
resin material
flexible sheet
folding
material supply
folding member
Prior art date
Application number
TW105130601A
Other languages
English (en)
Chinese (zh)
Other versions
TW201722670A (zh
Inventor
竹內慎
Original Assignee
東和股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東和股份有限公司 filed Critical 東和股份有限公司
Publication of TW201722670A publication Critical patent/TW201722670A/zh
Application granted granted Critical
Publication of TWI597147B publication Critical patent/TWI597147B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B11/00—Making preforms
    • B29B11/02—Making preforms by dividing preformed material, e.g. sheets, rods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3405—Feeding the material to the mould or the compression means using carrying means
    • B29C2043/3416—Feeding the material to the mould or the compression means using carrying means conveyor belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3405—Feeding the material to the mould or the compression means using carrying means
    • B29C2043/3427—Feeding the material to the mould or the compression means using carrying means hopper, vessel, chute, tube, conveying screw, for material in discrete form, e.g. particles or powder or fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
TW105130601A 2015-12-22 2016-09-22 樹脂材料供給裝置及方法、以及壓縮成形裝置 TWI597147B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015250316A JP6654887B2 (ja) 2015-12-22 2015-12-22 樹脂材料供給装置及び方法並びに圧縮成形装置

Publications (2)

Publication Number Publication Date
TW201722670A TW201722670A (zh) 2017-07-01
TWI597147B true TWI597147B (zh) 2017-09-01

Family

ID=59231227

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105130601A TWI597147B (zh) 2015-12-22 2016-09-22 樹脂材料供給裝置及方法、以及壓縮成形裝置

Country Status (4)

Country Link
JP (1) JP6654887B2 (enExample)
KR (1) KR101891894B1 (enExample)
CN (1) CN107030952B (enExample)
TW (1) TWI597147B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10199299B1 (en) * 2017-08-07 2019-02-05 Micron Technology, Inc. Semiconductor mold compound transfer system and associated methods
JP6725945B2 (ja) * 2019-06-20 2020-07-22 株式会社オリンピア 遊技機
JP6725944B2 (ja) * 2019-06-20 2020-07-22 株式会社オリンピア 遊技機
JP6725946B2 (ja) * 2019-06-25 2020-07-22 株式会社オリンピア 遊技機
CN114589852B (zh) * 2022-03-17 2024-11-29 黄高维 一种工业生产用树脂井盖上料装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5815153Y2 (ja) * 1973-06-16 1983-03-26 株式会社クボタ プレスセイケイソウチ ニ オケル カナガタ ヘノ ザイリヨウキヨウキユウケンセイケイヒンハンシユツソウチ
JPS5981123A (ja) * 1982-11-01 1984-05-10 Toyota Motor Corp 圧縮成形用金型に可塑化樹脂材料を供給する方法および装置
JPS6389311A (ja) * 1986-10-03 1988-04-20 Mikuni Seisakusho:Kk スタンピング成形型の加熱成形用基材の供給方法
JPH0449127U (enExample) * 1990-08-30 1992-04-24
US6096379A (en) * 1998-03-20 2000-08-01 Eckhoff; Paul S. Radiation processing apparatus and method
JP2000326328A (ja) * 1999-05-24 2000-11-28 Meiwa Ind Co Ltd 加熱軟化樹脂シートの搬送方法
JP2003171009A (ja) * 2001-12-04 2003-06-17 Sainekkusu:Kk 半導体封止用粉状樹脂供給装置
JP4791851B2 (ja) * 2006-02-24 2011-10-12 Ｔｏｗａ株式会社 電子部品の樹脂封止成形装置
JP2008114512A (ja) * 2006-11-07 2008-05-22 Trinc:Kk 除電機能を持つ樹脂成型機および樹脂成型用除電方法
JP5793806B2 (ja) * 2011-08-17 2015-10-14 アピックヤマダ株式会社 樹脂モールド装置
JP5693931B2 (ja) * 2010-11-25 2015-04-01 アピックヤマダ株式会社 樹脂モールド装置
KR101439596B1 (ko) * 2012-04-09 2014-09-17 (주)엘지하우시스 태양전지 밀봉재용 ｅｖａ 시트 제조장치
CN103846432A (zh) * 2012-12-05 2014-06-11 兴化市东旭机械有限公司 一种钨粉装填装置

Also Published As

Publication number Publication date
KR20170074749A (ko) 2017-06-30
JP2017113941A (ja) 2017-06-29
JP6654887B2 (ja) 2020-02-26
KR101891894B1 (ko) 2018-08-24
CN107030952A (zh) 2017-08-11
CN107030952B (zh) 2019-12-31
TW201722670A (zh) 2017-07-01

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