KR101862441B1 - 연마 장치 및 연마 방법 - Google Patents

연마 장치 및 연마 방법 Download PDF

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Publication number
KR101862441B1
KR101862441B1 KR1020150036588A KR20150036588A KR101862441B1 KR 101862441 B1 KR101862441 B1 KR 101862441B1 KR 1020150036588 A KR1020150036588 A KR 1020150036588A KR 20150036588 A KR20150036588 A KR 20150036588A KR 101862441 B1 KR101862441 B1 KR 101862441B1
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South Korea
Prior art keywords
polished
pressing
polishing
film thickness
peripheral portion
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Korean (ko)
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KR20150110347A (ko
Inventor
요이치 시오카와
요이치 시오카와
게이타 야기
요이치 고바야시
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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    • H01L21/304—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • H01L21/02024—
    • H01L22/12—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement
    • H01L2224/03602—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020150036588A 2014-03-20 2015-03-17 연마 장치 및 연마 방법 Active KR101862441B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014057859 2014-03-20
JPJP-P-2014-057859 2014-03-20
JPJP-P-2014-228346 2014-11-10
JP2014228346A JP6266493B2 (ja) 2014-03-20 2014-11-10 研磨装置及び研磨方法

Publications (2)

Publication Number Publication Date
KR20150110347A KR20150110347A (ko) 2015-10-02
KR101862441B1 true KR101862441B1 (ko) 2018-05-29

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KR1020150036588A Active KR101862441B1 (ko) 2014-03-20 2015-03-17 연마 장치 및 연마 방법

Country Status (6)

Country Link
US (1) US9550269B2 (https=)
JP (1) JP6266493B2 (https=)
KR (1) KR101862441B1 (https=)
CN (1) CN104924198B (https=)
SG (1) SG10201502022QA (https=)
TW (1) TWI601599B (https=)

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JP6266493B2 (ja) * 2014-03-20 2018-01-24 株式会社荏原製作所 研磨装置及び研磨方法
JP6473050B2 (ja) * 2015-06-05 2019-02-20 株式会社荏原製作所 研磨装置
JP6475604B2 (ja) * 2015-11-24 2019-02-27 株式会社荏原製作所 研磨方法
CN105575841B (zh) * 2015-12-15 2019-08-02 北京中电科电子装备有限公司 一种晶圆测量装置
JP6546845B2 (ja) * 2015-12-18 2019-07-17 株式会社荏原製作所 研磨装置、制御方法及びプログラム
JP6560147B2 (ja) * 2016-03-07 2019-08-14 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP6588854B2 (ja) 2016-03-30 2019-10-09 株式会社荏原製作所 基板処理装置
CN107813220A (zh) * 2016-09-13 2018-03-20 清华大学 压力加载膜
CN109844923B (zh) * 2016-10-10 2023-07-11 应用材料公司 用于化学机械抛光的实时轮廓控制
CN106378698B (zh) * 2016-10-27 2018-12-11 上海华力微电子有限公司 一种化学机械研磨机台研磨压力补偿方法
JP6535649B2 (ja) 2016-12-12 2019-06-26 株式会社荏原製作所 基板処理装置、排出方法およびプログラム
KR102015647B1 (ko) * 2017-03-24 2019-08-28 주식회사 케이씨텍 기판 이송 유닛 및 이를 포함하는 기판 연마 시스템
JP6827663B2 (ja) 2017-04-24 2021-02-10 株式会社荏原製作所 基板の研磨装置
JP6948868B2 (ja) * 2017-07-24 2021-10-13 株式会社荏原製作所 研磨装置および研磨方法
CN107803744A (zh) * 2017-09-26 2018-03-16 合肥新汇成微电子有限公司 一种半导体晶圆的背面研磨方法
JP6985107B2 (ja) * 2017-11-06 2021-12-22 株式会社荏原製作所 研磨方法および研磨装置
JP7012519B2 (ja) 2017-11-29 2022-01-28 株式会社荏原製作所 基板処理装置
JP7244250B2 (ja) * 2017-12-26 2023-03-22 株式会社荏原製作所 磁性素子、及びそれを用いた渦電流式センサ
KR102461597B1 (ko) * 2018-01-04 2022-11-01 주식회사 케이씨텍 기판 처리 시스템
CN110497317B (zh) * 2019-07-25 2024-05-03 杭州电子科技大学 一种适用于自动打磨设备的恒压装置
CN110524394A (zh) * 2019-09-10 2019-12-03 艾国金 一种抛光装置及其吸盘固定机构
JP2021091033A (ja) 2019-12-10 2021-06-17 キオクシア株式会社 研磨装置、研磨ヘッド、研磨方法、及び半導体装置の製造方法
JP7443169B2 (ja) * 2020-06-29 2024-03-05 株式会社荏原製作所 基板処理装置、基板処理方法、および基板処理方法を基板処理装置のコンピュータに実行させるためのプログラムを格納した記憶媒体
CN111844831B (zh) * 2020-07-06 2022-03-22 大连理工大学 一种轻质基材薄壁反射镜的制作方法
JP7290140B2 (ja) * 2020-09-09 2023-06-13 株式会社Sumco ウェーハ研磨方法およびウェーハ研磨装置
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JP7684058B2 (ja) 2021-03-01 2025-05-27 株式会社荏原製作所 研磨装置および研磨方法
US12343840B2 (en) 2021-03-05 2025-07-01 Applied Materials, Inc. Control of processing parameters for substrate polishing with substrate precession
JP7575309B2 (ja) 2021-03-17 2024-10-29 株式会社荏原製作所 膜厚測定方法、ノッチ部の検出方法、および研磨装置
KR20250041367A (ko) * 2023-09-18 2025-03-25 삼성전자주식회사 기판 처리 방법
CN117697614A (zh) * 2023-12-22 2024-03-15 华海清科(北京)科技有限公司 晶圆减薄系统、方法、装置、电子设备及存储介质
JP2025187082A (ja) 2024-06-13 2025-12-25 株式会社荏原製作所 リテーナリングおよび基板保持装置
CN119115785B (zh) * 2024-09-26 2025-10-28 华海清科股份有限公司 用于晶圆加工的承载头及化学机械抛光设备
CN121340121A (zh) * 2025-12-17 2026-01-16 合肥晶合集成电路股份有限公司 化学机械研磨方法、装置及晶圆的制作方法

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Also Published As

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SG10201502022QA (en) 2015-10-29
CN104924198A (zh) 2015-09-23
CN104924198B (zh) 2018-11-16
JP2015193068A (ja) 2015-11-05
US20150266159A1 (en) 2015-09-24
KR20150110347A (ko) 2015-10-02
US9550269B2 (en) 2017-01-24
TW201540424A (zh) 2015-11-01
TWI601599B (zh) 2017-10-11
JP6266493B2 (ja) 2018-01-24

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