TWI601599B - 研磨裝置及研磨方法 - Google Patents

研磨裝置及研磨方法 Download PDF

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Publication number
TWI601599B
TWI601599B TW104108743A TW104108743A TWI601599B TW I601599 B TWI601599 B TW I601599B TW 104108743 A TW104108743 A TW 104108743A TW 104108743 A TW104108743 A TW 104108743A TW I601599 B TWI601599 B TW I601599B
Authority
TW
Taiwan
Prior art keywords
polishing
polished
pressing
peripheral portion
pressure
Prior art date
Application number
TW104108743A
Other languages
English (en)
Chinese (zh)
Other versions
TW201540424A (zh
Inventor
塩川陽一
八木圭太
小林洋一
Original Assignee
荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荏原製作所股份有限公司 filed Critical 荏原製作所股份有限公司
Publication of TW201540424A publication Critical patent/TW201540424A/zh
Application granted granted Critical
Publication of TWI601599B publication Critical patent/TWI601599B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW104108743A 2014-03-20 2015-03-19 研磨裝置及研磨方法 TWI601599B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014057859 2014-03-20
JP2014228346A JP6266493B2 (ja) 2014-03-20 2014-11-10 研磨装置及び研磨方法

Publications (2)

Publication Number Publication Date
TW201540424A TW201540424A (zh) 2015-11-01
TWI601599B true TWI601599B (zh) 2017-10-11

Family

ID=54111783

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104108743A TWI601599B (zh) 2014-03-20 2015-03-19 研磨裝置及研磨方法

Country Status (6)

Country Link
US (1) US9550269B2 (https=)
JP (1) JP6266493B2 (https=)
KR (1) KR101862441B1 (https=)
CN (1) CN104924198B (https=)
SG (1) SG10201502022QA (https=)
TW (1) TWI601599B (https=)

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TWI780253B (zh) * 2017-11-06 2022-10-11 日商荏原製作所股份有限公司 研磨方法及研磨裝置

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JP6266493B2 (ja) * 2014-03-20 2018-01-24 株式会社荏原製作所 研磨装置及び研磨方法
JP6473050B2 (ja) * 2015-06-05 2019-02-20 株式会社荏原製作所 研磨装置
JP6475604B2 (ja) * 2015-11-24 2019-02-27 株式会社荏原製作所 研磨方法
CN105575841B (zh) * 2015-12-15 2019-08-02 北京中电科电子装备有限公司 一种晶圆测量装置
JP6546845B2 (ja) * 2015-12-18 2019-07-17 株式会社荏原製作所 研磨装置、制御方法及びプログラム
JP6560147B2 (ja) * 2016-03-07 2019-08-14 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP6588854B2 (ja) 2016-03-30 2019-10-09 株式会社荏原製作所 基板処理装置
CN107813220A (zh) * 2016-09-13 2018-03-20 清华大学 压力加载膜
CN109844923B (zh) * 2016-10-10 2023-07-11 应用材料公司 用于化学机械抛光的实时轮廓控制
CN106378698B (zh) * 2016-10-27 2018-12-11 上海华力微电子有限公司 一种化学机械研磨机台研磨压力补偿方法
JP6535649B2 (ja) 2016-12-12 2019-06-26 株式会社荏原製作所 基板処理装置、排出方法およびプログラム
KR102015647B1 (ko) * 2017-03-24 2019-08-28 주식회사 케이씨텍 기판 이송 유닛 및 이를 포함하는 기판 연마 시스템
JP6827663B2 (ja) 2017-04-24 2021-02-10 株式会社荏原製作所 基板の研磨装置
JP6948868B2 (ja) * 2017-07-24 2021-10-13 株式会社荏原製作所 研磨装置および研磨方法
CN107803744A (zh) * 2017-09-26 2018-03-16 合肥新汇成微电子有限公司 一种半导体晶圆的背面研磨方法
JP7012519B2 (ja) 2017-11-29 2022-01-28 株式会社荏原製作所 基板処理装置
JP7244250B2 (ja) * 2017-12-26 2023-03-22 株式会社荏原製作所 磁性素子、及びそれを用いた渦電流式センサ
KR102461597B1 (ko) * 2018-01-04 2022-11-01 주식회사 케이씨텍 기판 처리 시스템
CN110497317B (zh) * 2019-07-25 2024-05-03 杭州电子科技大学 一种适用于自动打磨设备的恒压装置
CN110524394A (zh) * 2019-09-10 2019-12-03 艾国金 一种抛光装置及其吸盘固定机构
JP2021091033A (ja) 2019-12-10 2021-06-17 キオクシア株式会社 研磨装置、研磨ヘッド、研磨方法、及び半導体装置の製造方法
JP7443169B2 (ja) * 2020-06-29 2024-03-05 株式会社荏原製作所 基板処理装置、基板処理方法、および基板処理方法を基板処理装置のコンピュータに実行させるためのプログラムを格納した記憶媒体
CN111844831B (zh) * 2020-07-06 2022-03-22 大连理工大学 一种轻质基材薄壁反射镜的制作方法
JP7290140B2 (ja) * 2020-09-09 2023-06-13 株式会社Sumco ウェーハ研磨方法およびウェーハ研磨装置
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CN112936085B (zh) * 2021-02-04 2022-09-16 华海清科股份有限公司 一种化学机械抛光控制方法及控制系统
JP7684058B2 (ja) 2021-03-01 2025-05-27 株式会社荏原製作所 研磨装置および研磨方法
US12343840B2 (en) 2021-03-05 2025-07-01 Applied Materials, Inc. Control of processing parameters for substrate polishing with substrate precession
JP7575309B2 (ja) 2021-03-17 2024-10-29 株式会社荏原製作所 膜厚測定方法、ノッチ部の検出方法、および研磨装置
KR20250041367A (ko) * 2023-09-18 2025-03-25 삼성전자주식회사 기판 처리 방법
CN117697614A (zh) * 2023-12-22 2024-03-15 华海清科(北京)科技有限公司 晶圆减薄系统、方法、装置、电子设备及存储介质
JP2025187082A (ja) 2024-06-13 2025-12-25 株式会社荏原製作所 リテーナリングおよび基板保持装置
CN119115785B (zh) * 2024-09-26 2025-10-28 华海清科股份有限公司 用于晶圆加工的承载头及化学机械抛光设备
CN121340121A (zh) * 2025-12-17 2026-01-16 合肥晶合集成电路股份有限公司 化学机械研磨方法、装置及晶圆的制作方法

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Also Published As

Publication number Publication date
SG10201502022QA (en) 2015-10-29
CN104924198A (zh) 2015-09-23
CN104924198B (zh) 2018-11-16
KR101862441B1 (ko) 2018-05-29
JP2015193068A (ja) 2015-11-05
US20150266159A1 (en) 2015-09-24
KR20150110347A (ko) 2015-10-02
US9550269B2 (en) 2017-01-24
TW201540424A (zh) 2015-11-01
JP6266493B2 (ja) 2018-01-24

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