KR101856914B1 - 필름상 접착제, 필름상 접착제를 사용한 반도체 패키지 및 그 제조 방법 - Google Patents

필름상 접착제, 필름상 접착제를 사용한 반도체 패키지 및 그 제조 방법 Download PDF

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KR101856914B1
KR101856914B1 KR1020177000150A KR20177000150A KR101856914B1 KR 101856914 B1 KR101856914 B1 KR 101856914B1 KR 1020177000150 A KR1020177000150 A KR 1020177000150A KR 20177000150 A KR20177000150 A KR 20177000150A KR 101856914 B1 KR101856914 B1 KR 101856914B1
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KR
South Korea
Prior art keywords
film
adhesive
adhesive layer
epoxy resin
temperature
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KR1020177000150A
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English (en)
Korean (ko)
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KR20170013386A (ko
Inventor
미노루 모리따
구니히꼬 이시구로
마사미 아오야마
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후루카와 덴키 고교 가부시키가이샤
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Publication of KR20170013386A publication Critical patent/KR20170013386A/ko
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
KR1020177000150A 2014-09-05 2015-08-28 필름상 접착제, 필름상 접착제를 사용한 반도체 패키지 및 그 제조 방법 KR101856914B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2014-181750 2014-09-05
JP2014181750A JP5901715B1 (ja) 2014-09-05 2014-09-05 フィルム状接着剤、フィルム状接着剤を用いた半導体パッケージ及びその製造方法
PCT/JP2015/074337 WO2016035686A1 (ja) 2014-09-05 2015-08-28 フィルム状接着剤、フィルム状接着剤を用いた半導体パッケージ及びその製造方法

Publications (2)

Publication Number Publication Date
KR20170013386A KR20170013386A (ko) 2017-02-06
KR101856914B1 true KR101856914B1 (ko) 2018-05-10

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Application Number Title Priority Date Filing Date
KR1020177000150A KR101856914B1 (ko) 2014-09-05 2015-08-28 필름상 접착제, 필름상 접착제를 사용한 반도체 패키지 및 그 제조 방법

Country Status (8)

Country Link
JP (1) JP5901715B1 (ja)
KR (1) KR101856914B1 (ja)
CN (1) CN106575625B (ja)
MY (1) MY182167A (ja)
PH (1) PH12017500308A1 (ja)
SG (1) SG11201701032XA (ja)
TW (1) TWI589662B (ja)
WO (1) WO2016035686A1 (ja)

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* Cited by examiner, † Cited by third party
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CN109072018B (zh) * 2016-04-22 2021-10-08 昭和电工材料株式会社 多层印刷线路板用的粘接膜
KR101889808B1 (ko) * 2017-04-26 2018-08-21 주식회사 제일화성 경화성 및 내수성이 우수한 비스페놀 a형 에폭시 수지 조성물
JP6920723B2 (ja) * 2017-07-14 2021-08-18 ナミックス株式会社 加圧実装用ｎｃｆ
GB2579582B (en) * 2018-12-04 2022-08-31 Hexcel Composites Ltd Adhesive composition
JP2020120828A (ja) * 2019-01-29 2020-08-13 ザイオソフト株式会社 医用画像処理装置、医用画像処理方法、及び医用画像処理プログラム
JP6902641B1 (ja) * 2020-03-13 2021-07-14 古河電気工業株式会社 ダイシングダイアタッチフィルム、並びに、ダイシングダイアタッチフィルムを用いた半導体パッケージ及びその製造方法
WO2022070503A1 (ja) * 2020-09-29 2022-04-07 古河電気工業株式会社 透明接着剤用組成物及びフィルム状透明接着剤、並びに、透明接着剤硬化層付部材の製造方法、電子部品及びその製造方法
JP7269446B1 (ja) * 2021-08-23 2023-05-08 古河電気工業株式会社 フィルム状接着剤、これを用いた電子部品及びその製造方法
JP7356534B1 (ja) * 2022-03-30 2023-10-04 株式会社レゾナック 半導体用接着フィルム、ダイシングダイボンディングフィルム、及び半導体装置を製造する方法
WO2023188170A1 (ja) * 2022-03-30 2023-10-05 株式会社レゾナック 半導体用接着フィルム、ダイシングダイボンディングフィルム、及び半導体装置を製造する方法
CN115746761A (zh) * 2022-11-17 2023-03-07 苏州高泰电子技术股份有限公司 一种daf胶黏剂、daf胶带及其制备方法
CN118685130A (zh) * 2024-08-27 2024-09-24 武汉市三选科技有限公司 用于一体膜封装的背胶膜及其制备方法、芯片封装方法

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JP2005032961A (ja) * 2003-07-11 2005-02-03 Sumitomo Bakelite Co Ltd 半導体用接着フィルム、ダイシングフィルムおよび半導体装置
JP2013038175A (ja) * 2011-08-05 2013-02-21 Hitachi Chem Co Ltd 半導体装置の製造方法、フィルム状接着剤及び接着剤シート
WO2013161864A1 (ja) * 2012-04-26 2013-10-31 新日鉄住金化学株式会社 フィルム状接着剤用組成物及びその製造方法、フィルム状接着剤、並びに、フィルム状接着剤を用いた半導体パッケージ及びその製造方法

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JP4537555B2 (ja) * 2000-09-11 2010-09-01 新日鐵化学株式会社 半導体パッケージの製造方法及び半導体パッケージ
JP4064228B2 (ja) * 2002-12-20 2008-03-19 ジャパンゴアテックス株式会社 ウェハボンディングシート、ウェハ積層体および半導体装置
JP2007063333A (ja) * 2005-08-29 2007-03-15 Nippon Steel Chem Co Ltd 半導体素子固定用フィルム状接着剤、それを用いた半導体装置、及び、その半導体装置の製造方法
JP4994743B2 (ja) * 2006-08-10 2012-08-08 新日鐵化学株式会社 フィルム状接着剤及びそれを使用する半導体パッケージの製造方法
JP4380684B2 (ja) 2006-10-20 2009-12-09 住友ベークライト株式会社 半導体用接着フィルム、ダイシングフィルムおよび半導体装置
JP5466368B2 (ja) * 2008-02-18 2014-04-09 積水化学工業株式会社 電子部品接合用接着剤
JP5303326B2 (ja) 2008-06-18 2013-10-02 積水化学工業株式会社 接着フィルム、ダイシング−ダイボンディングテープ及び半導体装置の製造方法
JP5160380B2 (ja) * 2008-11-12 2013-03-13 新日鉄住金化学株式会社 フィルム状接着剤、それを用いた半導体パッケージ及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005032961A (ja) * 2003-07-11 2005-02-03 Sumitomo Bakelite Co Ltd 半導体用接着フィルム、ダイシングフィルムおよび半導体装置
JP2013038175A (ja) * 2011-08-05 2013-02-21 Hitachi Chem Co Ltd 半導体装置の製造方法、フィルム状接着剤及び接着剤シート
WO2013161864A1 (ja) * 2012-04-26 2013-10-31 新日鉄住金化学株式会社 フィルム状接着剤用組成物及びその製造方法、フィルム状接着剤、並びに、フィルム状接着剤を用いた半導体パッケージ及びその製造方法

Also Published As

Publication number Publication date
TW201612271A (en) 2016-04-01
JP2016058457A (ja) 2016-04-21
CN106575625A (zh) 2017-04-19
SG11201701032XA (en) 2017-04-27
JP5901715B1 (ja) 2016-04-13
MY182167A (en) 2021-01-18
WO2016035686A1 (ja) 2016-03-10
KR20170013386A (ko) 2017-02-06
CN106575625B (zh) 2019-02-26
PH12017500308A1 (en) 2017-07-10
TWI589662B (zh) 2017-07-01

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