MY182167A - Film-like adhesive, semiconductor package using film-like adhesive and method for producing the same - Google Patents

Film-like adhesive, semiconductor package using film-like adhesive and method for producing the same

Info

Publication number
MY182167A
MY182167A MYPI2017000228A MYPI2017000228A MY182167A MY 182167 A MY182167 A MY 182167A MY PI2017000228 A MYPI2017000228 A MY PI2017000228A MY PI2017000228 A MYPI2017000228 A MY PI2017000228A MY 182167 A MY182167 A MY 182167A
Authority
MY
Malaysia
Prior art keywords
film
adhesive
epoxy resin
semiconductor package
silica filler
Prior art date
Application number
MYPI2017000228A
Other languages
English (en)
Inventor
Minoru Morita
Kunihiko Ishiguro
Masami Aoyama
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY182167A publication Critical patent/MY182167A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
MYPI2017000228A 2014-09-05 2015-08-28 Film-like adhesive, semiconductor package using film-like adhesive and method for producing the same MY182167A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014181750A JP5901715B1 (ja) 2014-09-05 2014-09-05 フィルム状接着剤、フィルム状接着剤を用いた半導体パッケージ及びその製造方法
PCT/JP2015/074337 WO2016035686A1 (ja) 2014-09-05 2015-08-28 フィルム状接着剤、フィルム状接着剤を用いた半導体パッケージ及びその製造方法

Publications (1)

Publication Number Publication Date
MY182167A true MY182167A (en) 2021-01-18

Family

ID=55439750

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017000228A MY182167A (en) 2014-09-05 2015-08-28 Film-like adhesive, semiconductor package using film-like adhesive and method for producing the same

Country Status (8)

Country Link
JP (1) JP5901715B1 (ja)
KR (1) KR101856914B1 (ja)
CN (1) CN106575625B (ja)
MY (1) MY182167A (ja)
PH (1) PH12017500308A1 (ja)
SG (1) SG11201701032XA (ja)
TW (1) TWI589662B (ja)
WO (1) WO2016035686A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180134349A (ko) * 2016-04-22 2018-12-18 히타치가세이가부시끼가이샤 다층 프린트 배선판용의 접착 필름
KR101889808B1 (ko) * 2017-04-26 2018-08-21 주식회사 제일화성 경화성 및 내수성이 우수한 비스페놀 a형 에폭시 수지 조성물
JP6920723B2 (ja) * 2017-07-14 2021-08-18 ナミックス株式会社 加圧実装用ｎｃｆ
GB2579582B (en) * 2018-12-04 2022-08-31 Hexcel Composites Ltd Adhesive composition
JP2020120828A (ja) * 2019-01-29 2020-08-13 ザイオソフト株式会社 医用画像処理装置、医用画像処理方法、及び医用画像処理プログラム
JP6902641B1 (ja) * 2020-03-13 2021-07-14 古河電気工業株式会社 ダイシングダイアタッチフィルム、並びに、ダイシングダイアタッチフィルムを用いた半導体パッケージ及びその製造方法
JPWO2022070503A1 (ja) * 2020-09-29 2022-04-07
WO2023188170A1 (ja) * 2022-03-30 2023-10-05 株式会社レゾナック 半導体用接着フィルム、ダイシングダイボンディングフィルム、及び半導体装置を製造する方法
JP7356534B1 (ja) 2022-03-30 2023-10-04 株式会社レゾナック 半導体用接着フィルム、ダイシングダイボンディングフィルム、及び半導体装置を製造する方法
CN115746761A (zh) * 2022-11-17 2023-03-07 苏州高泰电子技术股份有限公司 一种daf胶黏剂、daf胶带及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4537555B2 (ja) * 2000-09-11 2010-09-01 新日鐵化学株式会社 半導体パッケージの製造方法及び半導体パッケージ
JP4064228B2 (ja) * 2002-12-20 2008-03-19 ジャパンゴアテックス株式会社 ウェハボンディングシート、ウェハ積層体および半導体装置
JP4309710B2 (ja) * 2003-07-11 2009-08-05 住友ベークライト株式会社 半導体用接着フィルム、ダイシングフィルムおよび半導体装置
JP2007063333A (ja) * 2005-08-29 2007-03-15 Nippon Steel Chem Co Ltd 半導体素子固定用フィルム状接着剤、それを用いた半導体装置、及び、その半導体装置の製造方法
JP4994743B2 (ja) * 2006-08-10 2012-08-08 新日鐵化学株式会社 フィルム状接着剤及びそれを使用する半導体パッケージの製造方法
JP4380684B2 (ja) 2006-10-20 2009-12-09 住友ベークライト株式会社 半導体用接着フィルム、ダイシングフィルムおよび半導体装置
JP5466368B2 (ja) * 2008-02-18 2014-04-09 積水化学工業株式会社 電子部品接合用接着剤
JP5303326B2 (ja) 2008-06-18 2013-10-02 積水化学工業株式会社 接着フィルム、ダイシング−ダイボンディングテープ及び半導体装置の製造方法
JP5160380B2 (ja) * 2008-11-12 2013-03-13 新日鉄住金化学株式会社 フィルム状接着剤、それを用いた半導体パッケージ及びその製造方法
JP5866851B2 (ja) * 2011-08-05 2016-02-24 日立化成株式会社 半導体装置の製造方法、フィルム状接着剤及び接着剤シート
WO2013161864A1 (ja) * 2012-04-26 2013-10-31 新日鉄住金化学株式会社 フィルム状接着剤用組成物及びその製造方法、フィルム状接着剤、並びに、フィルム状接着剤を用いた半導体パッケージ及びその製造方法

Also Published As

Publication number Publication date
JP5901715B1 (ja) 2016-04-13
PH12017500308A1 (en) 2017-07-10
TWI589662B (zh) 2017-07-01
KR101856914B1 (ko) 2018-05-10
TW201612271A (en) 2016-04-01
CN106575625A (zh) 2017-04-19
SG11201701032XA (en) 2017-04-27
KR20170013386A (ko) 2017-02-06
CN106575625B (zh) 2019-02-26
JP2016058457A (ja) 2016-04-21
WO2016035686A1 (ja) 2016-03-10

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