MY182167A - Film-like adhesive, semiconductor package using film-like adhesive and method for producing the same - Google Patents

Film-like adhesive, semiconductor package using film-like adhesive and method for producing the same

Info

Publication number
MY182167A
MY182167A MYPI2017000228A MYPI2017000228A MY182167A MY 182167 A MY182167 A MY 182167A MY PI2017000228 A MYPI2017000228 A MY PI2017000228A MY PI2017000228 A MYPI2017000228 A MY PI2017000228A MY 182167 A MY182167 A MY 182167A
Authority
MY
Malaysia
Prior art keywords
film
adhesive
epoxy resin
semiconductor package
silica filler
Prior art date
Application number
MYPI2017000228A
Inventor
Minoru Morita
Kunihiko Ishiguro
Masami Aoyama
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY182167A publication Critical patent/MY182167A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

Provided are a film-like adhesive which can reduce the occurrence of voids even in a case in which curing is performed at a high temperature for a short period of time in multilevel lamination of semiconductor chips (4), a semiconductor package (9) using the film-like adhesive, and a method for producing the semiconductor package (9). Disclosed is a film-like adhesive containing an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and a silica filler (D), in which the content of the silica filler (D) is 30% to 70% by mass relative to the total amount of the epoxy resin (A), the epoxy resin curing agent (B), the phenoxy resin (C) and the silica filler (D), when the film-like adhesive is heated from room temperature at a rate of temperature increase of 5?C/min, the film-like adhesive exhibits a minimum melt viscosity in the range of 200 Pa?s to 10,000 Pa?s in a temperature range of higher than 120?C and 180?C or lower, and the gelation time at 180?C according to the hot plate method defined in JIS K6911 is 1 second to 200 seconds.
MYPI2017000228A 2014-09-05 2015-08-28 Film-like adhesive, semiconductor package using film-like adhesive and method for producing the same MY182167A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014181750A JP5901715B1 (en) 2014-09-05 2014-09-05 Film adhesive, semiconductor package using film adhesive, and manufacturing method thereof
PCT/JP2015/074337 WO2016035686A1 (en) 2014-09-05 2015-08-28 Film adhesive, semiconductor package using film adhesive and method for manufacturing same

Publications (1)

Publication Number Publication Date
MY182167A true MY182167A (en) 2021-01-18

Family

ID=55439750

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017000228A MY182167A (en) 2014-09-05 2015-08-28 Film-like adhesive, semiconductor package using film-like adhesive and method for producing the same

Country Status (8)

Country Link
JP (1) JP5901715B1 (en)
KR (1) KR101856914B1 (en)
CN (1) CN106575625B (en)
MY (1) MY182167A (en)
PH (1) PH12017500308A1 (en)
SG (1) SG11201701032XA (en)
TW (1) TWI589662B (en)
WO (1) WO2016035686A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2017183722A1 (en) * 2016-04-22 2019-02-28 日立化成株式会社 Adhesive film for multilayer printed wiring boards
KR101889808B1 (en) * 2017-04-26 2018-08-21 주식회사 제일화성 Bisphenol a type epoxy resin composition with excellent curing property and water-proof
JP6920723B2 (en) * 2017-07-14 2021-08-18 ナミックス株式会社 NCF for pressure mounting
GB2579582B (en) * 2018-12-04 2022-08-31 Hexcel Composites Ltd Adhesive composition
JP2020120828A (en) * 2019-01-29 2020-08-13 ザイオソフト株式会社 Medical image processing apparatus, medical image processing method, and medical image processing program
JP6902641B1 (en) * 2020-03-13 2021-07-14 古河電気工業株式会社 A dicing die attach film, a semiconductor package using the dicing die attach film, and a method for manufacturing the same.
JPWO2022070503A1 (en) * 2020-09-29 2022-04-07
JP7356534B1 (en) 2022-03-30 2023-10-04 株式会社レゾナック Adhesive film for semiconductors, dicing die bonding film, and method for manufacturing semiconductor devices
WO2023188170A1 (en) * 2022-03-30 2023-10-05 株式会社レゾナック Adhesive film for semiconductors, dicing/die-bonding film, and method for manufacturing semiconductor device
CN115746761A (en) * 2022-11-17 2023-03-07 苏州高泰电子技术股份有限公司 DAF adhesive, DAF adhesive tape and preparation method thereof

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4537555B2 (en) * 2000-09-11 2010-09-01 新日鐵化学株式会社 Semiconductor package manufacturing method and semiconductor package
JP4064228B2 (en) * 2002-12-20 2008-03-19 ジャパンゴアテックス株式会社 Wafer bonding sheet, wafer laminate, and semiconductor device
JP4309710B2 (en) * 2003-07-11 2009-08-05 住友ベークライト株式会社 Adhesive film for semiconductor, dicing film and semiconductor device
JP2007063333A (en) * 2005-08-29 2007-03-15 Nippon Steel Chem Co Ltd Film adhesive for fixing semiconductor element, semiconductor device using the same and method for manufacturing the semiconductor device
JP4994743B2 (en) * 2006-08-10 2012-08-08 新日鐵化学株式会社 Film adhesive and method of manufacturing semiconductor package using the same
JP4380684B2 (en) 2006-10-20 2009-12-09 住友ベークライト株式会社 Adhesive film for semiconductor, dicing film and semiconductor device
JP5466368B2 (en) * 2008-02-18 2014-04-09 積水化学工業株式会社 Adhesive for joining electronic components
JP5303326B2 (en) 2008-06-18 2013-10-02 積水化学工業株式会社 Adhesive film, dicing die-bonding tape, and semiconductor device manufacturing method
JP5160380B2 (en) * 2008-11-12 2013-03-13 新日鉄住金化学株式会社 Film adhesive, semiconductor package using the same, and manufacturing method thereof
JP5866851B2 (en) * 2011-08-05 2016-02-24 日立化成株式会社 Semiconductor device manufacturing method, film adhesive, and adhesive sheet
CN104245874B (en) * 2012-04-26 2016-08-24 古河电气工业株式会社 Membranaceous cement compositions and manufacture method thereof, membranaceous cement and employ semiconductor packages and the manufacture method thereof of membranaceous cement

Also Published As

Publication number Publication date
KR101856914B1 (en) 2018-05-10
TW201612271A (en) 2016-04-01
CN106575625A (en) 2017-04-19
SG11201701032XA (en) 2017-04-27
CN106575625B (en) 2019-02-26
JP5901715B1 (en) 2016-04-13
WO2016035686A1 (en) 2016-03-10
JP2016058457A (en) 2016-04-21
PH12017500308A1 (en) 2017-07-10
KR20170013386A (en) 2017-02-06
TWI589662B (en) 2017-07-01

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