PH12017500308A1 - Film-like adhesive, semiconductor package using film-like adhesive, and method for producing the same - Google Patents

Film-like adhesive, semiconductor package using film-like adhesive, and method for producing the same

Info

Publication number
PH12017500308A1
PH12017500308A1 PH12017500308A PH12017500308A PH12017500308A1 PH 12017500308 A1 PH12017500308 A1 PH 12017500308A1 PH 12017500308 A PH12017500308 A PH 12017500308A PH 12017500308 A PH12017500308 A PH 12017500308A PH 12017500308 A1 PH12017500308 A1 PH 12017500308A1
Authority
PH
Philippines
Prior art keywords
film
epoxy resin
film adhesive
adhesive
semiconductor package
Prior art date
Application number
PH12017500308A
Other languages
English (en)
Inventor
Minoru Morita
Kunihiko Ishiguro
Masami Aoyama
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of PH12017500308A1 publication Critical patent/PH12017500308A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
PH12017500308A 2014-09-05 2017-02-20 Film-like adhesive, semiconductor package using film-like adhesive, and method for producing the same PH12017500308A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014181750A JP5901715B1 (ja) 2014-09-05 2014-09-05 フィルム状接着剤、フィルム状接着剤を用いた半導体パッケージ及びその製造方法
PCT/JP2015/074337 WO2016035686A1 (ja) 2014-09-05 2015-08-28 フィルム状接着剤、フィルム状接着剤を用いた半導体パッケージ及びその製造方法

Publications (1)

Publication Number Publication Date
PH12017500308A1 true PH12017500308A1 (en) 2017-07-10

Family

ID=55439750

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12017500308A PH12017500308A1 (en) 2014-09-05 2017-02-20 Film-like adhesive, semiconductor package using film-like adhesive, and method for producing the same

Country Status (8)

Country Link
JP (1) JP5901715B1 (ja)
KR (1) KR101856914B1 (ja)
CN (1) CN106575625B (ja)
MY (1) MY182167A (ja)
PH (1) PH12017500308A1 (ja)
SG (1) SG11201701032XA (ja)
TW (1) TWI589662B (ja)
WO (1) WO2016035686A1 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109072018B (zh) * 2016-04-22 2021-10-08 昭和电工材料株式会社 多层印刷线路板用的粘接膜
KR101889808B1 (ko) * 2017-04-26 2018-08-21 주식회사 제일화성 경화성 및 내수성이 우수한 비스페놀 a형 에폭시 수지 조성물
JP6920723B2 (ja) * 2017-07-14 2021-08-18 ナミックス株式会社 加圧実装用ｎｃｆ
GB2579582B (en) * 2018-12-04 2022-08-31 Hexcel Composites Ltd Adhesive composition
JP2020120828A (ja) * 2019-01-29 2020-08-13 ザイオソフト株式会社 医用画像処理装置、医用画像処理方法、及び医用画像処理プログラム
JP6902641B1 (ja) * 2020-03-13 2021-07-14 古河電気工業株式会社 ダイシングダイアタッチフィルム、並びに、ダイシングダイアタッチフィルムを用いた半導体パッケージ及びその製造方法
WO2022070503A1 (ja) * 2020-09-29 2022-04-07 古河電気工業株式会社 透明接着剤用組成物及びフィルム状透明接着剤、並びに、透明接着剤硬化層付部材の製造方法、電子部品及びその製造方法
JP7269446B1 (ja) * 2021-08-23 2023-05-08 古河電気工業株式会社 フィルム状接着剤、これを用いた電子部品及びその製造方法
JP7356534B1 (ja) * 2022-03-30 2023-10-04 株式会社レゾナック 半導体用接着フィルム、ダイシングダイボンディングフィルム、及び半導体装置を製造する方法
WO2023188170A1 (ja) * 2022-03-30 2023-10-05 株式会社レゾナック 半導体用接着フィルム、ダイシングダイボンディングフィルム、及び半導体装置を製造する方法
CN115746761A (zh) * 2022-11-17 2023-03-07 苏州高泰电子技术股份有限公司 一种daf胶黏剂、daf胶带及其制备方法
CN118685130A (zh) * 2024-08-27 2024-09-24 武汉市三选科技有限公司 用于一体膜封装的背胶膜及其制备方法、芯片封装方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4537555B2 (ja) * 2000-09-11 2010-09-01 新日鐵化学株式会社 半導体パッケージの製造方法及び半導体パッケージ
JP4064228B2 (ja) * 2002-12-20 2008-03-19 ジャパンゴアテックス株式会社 ウェハボンディングシート、ウェハ積層体および半導体装置
JP4309710B2 (ja) * 2003-07-11 2009-08-05 住友ベークライト株式会社 半導体用接着フィルム、ダイシングフィルムおよび半導体装置
JP2007063333A (ja) * 2005-08-29 2007-03-15 Nippon Steel Chem Co Ltd 半導体素子固定用フィルム状接着剤、それを用いた半導体装置、及び、その半導体装置の製造方法
JP4994743B2 (ja) * 2006-08-10 2012-08-08 新日鐵化学株式会社 フィルム状接着剤及びそれを使用する半導体パッケージの製造方法
JP4380684B2 (ja) 2006-10-20 2009-12-09 住友ベークライト株式会社 半導体用接着フィルム、ダイシングフィルムおよび半導体装置
JP5466368B2 (ja) * 2008-02-18 2014-04-09 積水化学工業株式会社 電子部品接合用接着剤
JP5303326B2 (ja) 2008-06-18 2013-10-02 積水化学工業株式会社 接着フィルム、ダイシング−ダイボンディングテープ及び半導体装置の製造方法
JP5160380B2 (ja) * 2008-11-12 2013-03-13 新日鉄住金化学株式会社 フィルム状接着剤、それを用いた半導体パッケージ及びその製造方法
JP5866851B2 (ja) * 2011-08-05 2016-02-24 日立化成株式会社 半導体装置の製造方法、フィルム状接着剤及び接着剤シート
CN104245874B (zh) * 2012-04-26 2016-08-24 古河电气工业株式会社 膜状接合剂用组合物及其制造方法、膜状接合剂和使用了膜状接合剂的半导体封装及其制造方法

Also Published As

Publication number Publication date
TW201612271A (en) 2016-04-01
JP2016058457A (ja) 2016-04-21
CN106575625A (zh) 2017-04-19
SG11201701032XA (en) 2017-04-27
KR101856914B1 (ko) 2018-05-10
JP5901715B1 (ja) 2016-04-13
MY182167A (en) 2021-01-18
WO2016035686A1 (ja) 2016-03-10
KR20170013386A (ko) 2017-02-06
CN106575625B (zh) 2019-02-26
TWI589662B (zh) 2017-07-01

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