MY169301A - Adhesive composition for masking tape used in molded underfill process and masking tape using the same - Google Patents
Adhesive composition for masking tape used in molded underfill process and masking tape using the sameInfo
- Publication number
- MY169301A MY169301A MYPI2013000782A MYPI2013000782A MY169301A MY 169301 A MY169301 A MY 169301A MY PI2013000782 A MYPI2013000782 A MY PI2013000782A MY PI2013000782 A MYPI2013000782 A MY PI2013000782A MY 169301 A MY169301 A MY 169301A
- Authority
- MY
- Malaysia
- Prior art keywords
- masking tape
- adhesive composition
- energy
- underfill process
- molded underfill
- Prior art date
Links
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Adhesive composition for a masking tape used in a molded underfill process and a masking tape using the adhesive composition, and more particularly, adhesive composition capable of reducing trapped voids due to epoxy molding compound (EMC) flow imbalance in a molded underfill process, and consequently reducing the frequency of occurrence of errors, such as void swelling, which are related to package reliability. The masking tape is ensured with a superior film compression rate by a substrate film that exhibits a high elongation at a molding temperature so that a pressure around a vent region which may have effects on void trapping can be maintained at a high level, thereby reducing void occurrence The adhesive composition includes (a) acrylic copolymer, (b) thermosetting resin, (c) energy-ray curable urethane resin, (d) energy-ray curable silicone resin, (e) energy-ray initiator, and (f) chemical particles.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20120105331 | 2012-09-21 | ||
| KR1020120139062A KR101392441B1 (en) | 2012-09-21 | 2012-12-03 | Adhesive composition for masking tape of mold underfill process and masking tape using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY169301A true MY169301A (en) | 2019-03-21 |
Family
ID=50618901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2013000782A MY169301A (en) | 2012-09-21 | 2013-03-07 | Adhesive composition for masking tape used in molded underfill process and masking tape using the same |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5942321B2 (en) |
| MY (1) | MY169301A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6520055B2 (en) * | 2014-11-06 | 2019-05-29 | 日立化成株式会社 | Semiconductor compression molding release sheet and semiconductor package molded using the same |
| JP6117858B2 (en) * | 2015-06-16 | 2017-04-19 | 三菱樹脂株式会社 | Laminated film |
| CN109476960A (en) * | 2016-07-28 | 2019-03-15 | 日东电工株式会社 | Enhancing film with isolation film |
| JP6819721B2 (en) * | 2019-04-26 | 2021-01-27 | 昭和電工マテリアルズ株式会社 | Release sheet for semiconductor compression molding and semiconductor package molded using this |
| JP7052891B2 (en) * | 2021-01-04 | 2022-04-12 | 昭和電工マテリアルズ株式会社 | Release sheet for semiconductor compression molding and semiconductor package molded using this |
| CN114106743B (en) * | 2021-11-01 | 2022-12-20 | 苏州润邦半导体材料科技有限公司 | Low-moisture-permeability liquid crystal frame sealing adhesive and preparation method thereof |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2709035B2 (en) * | 1994-12-28 | 1998-02-04 | 日東電工株式会社 | Semiconductor package manufacturing method |
| JP3779601B2 (en) * | 2001-11-28 | 2006-05-31 | 株式会社巴川製紙所 | Mask sheet for semiconductor device assembly |
| JP2004200467A (en) * | 2002-12-19 | 2004-07-15 | Hitachi Chem Co Ltd | Release sheet for semiconductor mould |
| JP2005166904A (en) * | 2003-12-02 | 2005-06-23 | Hitachi Chem Co Ltd | Mold releasing sheet for semiconductor mold |
| JP2008227475A (en) * | 2007-02-14 | 2008-09-25 | Toray Ind Inc | Release sheet for semiconductor sealing, and its production process |
| KR100910672B1 (en) * | 2007-08-03 | 2009-08-04 | 도레이새한 주식회사 | Heat-resistant adhesive sheet |
| KR101075192B1 (en) * | 2009-03-03 | 2011-10-21 | 도레이첨단소재 주식회사 | Adhesive tape for manufacturing electronic component |
| JP2011009425A (en) * | 2009-06-25 | 2011-01-13 | Sumitomo Bakelite Co Ltd | Method for manufacturing semiconductor element and method for manufacturing semiconductor device |
| JP5471730B2 (en) * | 2010-03-31 | 2014-04-16 | 大日本印刷株式会社 | Decorative sheet |
| KR101194544B1 (en) * | 2011-01-20 | 2012-10-25 | 도레이첨단소재 주식회사 | Adhesive masking tape for die exposed flip-chip package defcp molded underfill muf |
-
2013
- 2013-02-14 JP JP2013026884A patent/JP5942321B2/en active Active
- 2013-03-07 MY MYPI2013000782A patent/MY169301A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014063971A (en) | 2014-04-10 |
| JP5942321B2 (en) | 2016-06-29 |
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