CN114106743B - Low-moisture-permeability liquid crystal frame sealing adhesive and preparation method thereof - Google Patents
Low-moisture-permeability liquid crystal frame sealing adhesive and preparation method thereof Download PDFInfo
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- CN114106743B CN114106743B CN202111284270.6A CN202111284270A CN114106743B CN 114106743 B CN114106743 B CN 114106743B CN 202111284270 A CN202111284270 A CN 202111284270A CN 114106743 B CN114106743 B CN 114106743B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- Inorganic Chemistry (AREA)
- Sealing Material Composition (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a low-moisture-permeability frame sealing adhesive and a preparation method thereof, wherein the frame sealing adhesive comprises the following raw materials in parts by weight: 40-50 parts of acrylic polymer, 0.2-2 parts of photoinitiator, 0.2-4 parts of coupling agent, 1-5 parts of inorganic silicon balls, 2-5 parts of silicon dioxide, 10-20 parts of organic filler, 10-20 parts of thermal curing agent and 0.1-1 part of antioxidant. The moisture permeability of the frame sealing glue is good, the moisture permeability can be reduced to below 10g/m 24H, the invasion of water vapor and oxygen can be thoroughly prevented through the ultralow moisture permeability, and the possibility of liquid crystal pollution is reduced.
Description
Technical Field
The invention relates to the technical field of LCD (liquid crystal display) liquid crystal panels, in particular to a low-moisture-permeability liquid crystal frame sealing adhesive and a preparation method thereof.
Background
The frame sealing glue of the liquid crystal screen plays a role in sealing the liquid crystal and provides a certain thickness and mechanical strength for the liquid crystal screen. Generally, the frame sealing glue of the liquid crystal display needs to be irradiated by ultraviolet light to perform photocuring, and then is further thermally cured in a certain high-temperature manufacturing process. Compared with the traditional vacuum infusion process, the conventional ODF process has the advantages of short process time, high liquid crystal utilization rate, high automation degree and the like, but one key point of the ODF process is that liquid crystal materials are easily polluted when liquid crystals are diffused, and meanwhile, the phenomenon that the liquid crystals penetrate through a frame, namely, the frame glue puncture phenomenon is easily caused.
At present, the moisture permeability of ODF frame glue in the market is about 50-70g/m224H, the water absorption rate is high, and liquid crystal pollution is easy to generate. How to reduce the moisture permeability of the frame sealing glue to prevent the invasion of water vapor and oxygen is a matter that those skilled in the art are dedicated to solve.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides the low-moisture-permeability liquid crystal frame sealing glue.
In order to achieve the purpose, the invention adopts the technical scheme that: the low-moisture-permeability frame sealing glue comprises the following raw materials in parts by weight:
wherein the particle size of the inorganic silicon spheres is not more than 1 micron, and the heat curing agent adopts a malonic dihydrazide powder curing agent.
As a specific embodiment, the inorganic silica spheres are available from the Japanese Kaiki corporation as model IX-3-G silica spheres.
As a specific embodiment, the thermal curing agent is obtained from malonic acid dihydrazide curing agent with model number MDH manufactured by Nippon monosodium glutamate Fine Chemicals, inc.
As a specific embodiment, the photoinitiator is a radical photoinitiator.
Preferably, the photoinitiator adopts oxime ester photoinitiator OEX-01 or OEX-02.
In a specific embodiment, the coupling agent is a silane coupling agent.
As a specific embodiment, 2, 6-di-tert-butyl-p-cresol is used as the antioxidant.
Preferably, the frame sealing glue comprises the following raw materials in parts by weight:
wherein the particle size of the inorganic silicon spheres is not more than 1 micron, and the heat curing agent adopts a malonic dihydrazide powder curing agent.
Another object of the present invention is to provide a method for preparing the low moisture permeability frame sealing adhesive, comprising the following steps:
s1, putting an acrylic polymer and an antioxidant into a reaction kettle according to parts by weight, heating to 70-75 ℃ for 10-15min to ensure that the antioxidant is completely oxidized;
s2, fully mixing and stirring the product obtained in the step S1 with a photoinitiator, an organic filler, a coupling agent, inorganic silicon spheres and silicon dioxide at normal temperature;
s3, adding the mixture obtained in the step S2 into a thermal curing agent, and uniformly mixing and stirring under the condition that the temperature is ensured not to be higher than 25 ℃;
and S4, carrying out three-roll grinding on the mixture obtained in the step S3 until the particle size of the particles is less than 5 microns, and thus obtaining the required product.
Since the dissolution temperature of the antioxidant is 70 ℃ or higher, the antioxidant and the acrylic polymer are first subjected to a heat treatment to completely dissolve the antioxidant in the acrylic polymer.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages: the low-moisture-permeability frame sealing glue adopts acrylic acid polymer, photoinitiator, coupling agent, inorganic silicon spheres, silicon dioxide, organic filler, thermal curing agent and antioxidant as raw materials, and all the components are cooperated with each other, so that the moisture permeability of the obtained frame sealing glue can be reduced to below 10g/m224H, the ultralow moisture permeability can thoroughly prevent the invasion of water vapor and oxygen, and the possibility of liquid crystal pollution is reduced.
Detailed Description
The technical solution of the present invention is further illustrated below with reference to specific examples.
The low-moisture-permeability frame sealing glue comprises the following raw materials in parts by weight: 40-50 parts of acrylic polymer, 0.2-2 parts of photoinitiator, 0.2-4 parts of coupling agent, 1-5 parts of inorganic silicon balls, 2-5 parts of silicon dioxide, 10-20 parts of organic filler, 10-20 parts of thermal curing agent and 0.1-1 part of antioxidant.
Wherein the inorganic silica spheres having a particle size of not more than 1 μm are used, and preferably, the inorganic silica spheres are available from silica spheres having a size of IX-3-G manufactured by Nippon Kabushiki Kaisha.
As the heat-curing agent, use was made of a malonic acid dihydrazide powder curing agent, preferably a malonic acid dihydrazide powder curing agent of MDH model manufactured by Nippon monosodium glutamate Fine Chemicals K.K.
The photoinitiator is a free radical photoinitiator, specifically an oxime ester photoinitiator OEX-01 or OEX-02. The coupling agent adopts a silane coupling agent; the antioxidant adopts 2, 6-di-tert-butyl-p-cresol.
Here, the preparation method of the low moisture permeability frame sealing adhesive includes the following steps:
s1, putting an acrylic polymer and an antioxidant into a reaction kettle according to parts by weight, heating to 70-75 ℃ for 10-15min to ensure that the antioxidant is completely oxidized;
s2, fully mixing and stirring the product obtained in the step S1 with a photoinitiator, an organic filler, a coupling agent, inorganic silicon spheres and silicon dioxide at normal temperature;
s3, adding the mixture obtained in the S2 into a thermal curing agent, and uniformly mixing and stirring under the condition of ensuring that the temperature is not higher than 25 ℃;
and S4, carrying out three-roll grinding on the mixture obtained in the step S3 until the particle size of the particles is below 5 microns, and thus obtaining the required product.
1. Influence of different contents and types of inorganic silicon balls on frame sealing adhesive performance
The low-moisture-permeability frame sealing glue comprises the following raw materials in parts by weight: 45 parts of acrylic polymer, 0.4 part of photoinitiator, 0.4 part of coupling agent, 2 parts of silicon dioxide, 19 parts of organic filler, 13 parts of thermal curing agent and 0.5 part of antioxidant, and the adding amount of inorganic silicon spheres is shown in Table 1.
Here, the acrylic polymer was obtained from the acrylic polymer of model EA-1010N, manufactured by Ningmura chemical industries, ltd; the photoinitiator adopts oxime ester photoinitiator OEX-01; the coupling agent adopts silane coupling agent gamma-aminopropyl triethoxysilane; the organic filler adopts polymethacrylate; the antioxidant adopts 2, 6-di-tert-butyl-p-cresol; the heat-curing agent used was MDH malonic acid dihydrazide curing agent made by Nippon monosodium glutamate Fine Chemicals, which was in powder form, and the inorganic silica spheres used in examples 1 to 4 and comparative examples 1 to 2 were IX-3-G silica spheres made by Nippon Kabushiki Kaisha and had a particle size of less than 1 μm; the inorganic silica spheres used in comparative example 3 had a particle size of 2 μm, and the results of the product test are shown in Table 1.
The testing method of the prepared frame sealing glue comprises the following steps:
1) Viscosity test method:
using Brookfiled cone and plate viscometer, spindle CP51 (Spindle), 1rpm (rpm), temperature: 25 deg.C
Sample amount: 0.5ml
2) Thixotropic index test method:
the thixotropic index is the ratio of the viscosity at 0.5rpm (Spindle) to the viscosity at 5rpm (Spindle) of a Brookfiltered cone-plate viscometer, spindle CP 51.
3) The adhesion test method comprises the following steps:
base material: ITO glass, PI glass
The size specification is as follows: 15mm 40mm 0.7mm
Baking conditions: 3000mj + C/60min
Stretching rate: 2mm/min
4) The moisture permeability test method comprises the following steps:
weighing the ratio of calcium chloride in the moisture permeable cup before and after water absorption at the temperature of 60 ℃ and under the environment of 90% for 24H;
5) The reliability test method comprises the following steps:
after the samples were placed at-30 ℃,70% environment and 60 ℃,90% environment for 200H, respectively, the adhesion values and the original adhesion values were tested. If they match, OK is performed, and if there is a deviation, NG is performed.
TABLE 1
It can be seen from table 1 that, when the other components are the same, the higher the content of the inorganic silicon spheres is, the higher the viscosity is, the stronger the adhesion is, when the addition amount of the inorganic silicon spheres is between 1 and 5 parts, the moisture permeability of the frame sealing adhesive is good, which can be reduced to 10g/m224H, even lower, the adhesion is also stronger, and when the addition amount of the inorganic silicon spheres is less than 1 part or more than 5 parts, from comparative examples 1 and 2, the moisture permeability is poor, the adhesion is also not good, and when the inorganic silicon spheres with the particle size of more than 1 micron are adopted, as in comparative example 3, the moisture permeability and the adhesion of the product are poor, and the reliability is also not good, for this reason, when the content of the other components is the same, the addition amount of the inorganic silicon spheres is controlled between 1 and 5 parts.
2. Influence of different contents and types of thermal curing agents on performance of frame sealing adhesive
The frame sealing glue with low moisture permeability comprises the following raw materials in parts by weight: 40 parts of acrylic polymer, 1 part of photoinitiator, 1 part of coupling agent, 4 parts of inorganic silicon spheres, 3 parts of silicon dioxide, 10 parts of organic filler and 1 part of antioxidant, and the adding amount of the thermal curing agent is shown in Table 2.
In examples 5 to 8 and comparative examples 4 to 7 below, the acrylic polymer was obtained from an acrylate polymer of type EA-1010N manufactured by Ninghamu chemical Co., ltd; the photoinitiator adopts oxime ester photoinitiator OEX-01; the coupling agent adopts silane coupling agent gamma-aminopropyl triethoxysilane; the organic filler adopts polymethacrylate; the inorganic silica spheres are silica spheres of type IX-3-G manufactured by Nippon clothing Co; 2, 6-di-tert-butyl-p-cresol is used as the antioxidant. The thermal curing agents of examples 5 to 8 and comparative examples 4 to 5 used a malonic acid dihydrazide curing agent of MDH type manufactured by mauritiki fine chemicals co., ltd.p. japan, which was powdered, the thermal curing agent of comparative example 6 used 2-phenylimidazole (available from shanghainen materials gmbh) and the thermal curing agent of comparative example 7 used a malonic acid dihydrazide curing agent (available from southeast runfeng petrochemical company, ltd.), and the product test results are shown in table 2.
TABLE 2
It can be seen from table 2 that the adhesive force of the sealant obtained by using malonic dihydrazide as the heat curing agent is better and the moisture permeability is smaller than that of the sealant obtained by using 2-phenylimidazole in the same content of other components, as seen from example 6 and comparative example 6, and from example 5 to 8 and comparative example 4 to 5, the moisture permeability and the adhesive force of the sealant are poorer when the addition amount of malonic dihydrazide is less than 8 parts or more than 20 parts, while the moisture permeability and the adhesive force of the sealant obtained by using malonic dihydrazide from other manufacturers are poorer and the adhesive force is also reduced when the addition amount of malonic dihydrazide is between 10 and 20 parts, and the maleic dihydrazide powder curing agent with model number of MDH manufactured by japan's paucin fine chemistry co.
3. Effect of different antioxidant content on frame sealing adhesive performance
The frame sealing glue with low moisture permeability comprises the following raw materials in parts by weight: 50 parts of acrylic polymer, 2 parts of photoinitiator, 3 parts of coupling agent, 4 parts of inorganic silicon spheres, 5 parts of silicon dioxide, 15 parts of organic filler and 15 parts of thermal curing agent, and the addition amount of antioxidant is shown in Table 3.
In examples 9 to 11 and comparative examples 8 to 10 below, the acrylic polymer was obtained from a type EA-1010N acrylic polymer manufactured by Ninghamu chemical Co., ltd; the photoinitiator adopts oxime ester photoinitiator OEX-02; the coupling agent adopts silane coupling agent gamma-aminopropyl triethoxysilane; the organic filler adopts polymethacrylate; as the inorganic silica beads, there were used IX-3-G silica beads manufactured by Nippon Kabushiki Kaisha, and as the heat-curing agent, there was used MDH malonic acid dihydrazide curing agent manufactured by Nippon Ajinomosu Fine Chemicals. 2, 6-di-tert-butyl-p-cresol was used as the antioxidant in examples 9 to 11 and comparative examples 8 to 9, and antioxidant 1076 was used as the antioxidant in comparative example 10, and the product test data are shown in Table 3.
TABLE 3
From Table 3, it can be seen that the addition of the antioxidant 2, 6-di-t-butyl-p-cresol in examples 9 to 11 and comparative examples 8 to 9 has a moisture permeability better than that of the non-added antioxidant, and the optimum addition amount is 0.5 to 1 part, while from example 11 and comparative example 10, the use of other antioxidants has a moisture permeability and an adhesion which are not as good as those of the product obtained by using 2, 6-di-t-butyl-p-cresol, and thus the product requirements cannot be met.
4. Influence of different contents of silicon dioxide on frame sealing adhesive performance
The low-moisture-permeability frame sealing glue comprises the following raw materials in parts by weight: 48 parts of acrylic polymer, 0.2 part of photoinitiator, 4 parts of coupling agent, 3 parts of inorganic silicon spheres, 15 parts of organic filler, 15 parts of thermal curing agent and 1 part of antioxidant, and the adding amount of silicon dioxide is shown in Table 4.
In the following examples 12 to 15 and comparative examples 11 to 12, the acrylic polymer was obtained from a type EA-1010N acrylic polymer manufactured by Ningmura chemical industries, ltd.; the photoinitiator adopts oxime ester photoinitiator OEX-02; the coupling agent adopts silane coupling agent gamma-aminopropyl triethoxysilane; the organic filler adopts polymethacrylate; the inorganic silica beads used were IX-3-G silica beads manufactured by Nippon Kabushiki Kaisha, the heat-curing agent used was MDH malonic acid dihydrazide curing agent manufactured by Nippon Ajinomogi Fine Chemie, and the antioxidant used was 2, 6-di-t-butyl-p-cresol, and the product detection data are shown in Table 4.
TABLE 4
As can be seen from Table 4, when the amount of silica added is in the range of 2 to 5 parts, particularly 4 to 5 parts, the moisture permeability of the product is preferably reduced to 10g/m224H or less, while when the amount of silica added is less than 2 parts, the moisture permeability is poor and the adhesion is poor, and when the amount of silica added is more than 5 parts, the reliability is poor although the moisture permeability and the adhesion are good, and the amount of silica added is preferably 2 to 5 parts, preferably 4 to 5 parts.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (7)
1. The low-moisture-permeability frame sealing glue is characterized by comprising the following raw materials in parts by weight:
40-50 parts of acrylic polymer
0.2 to 2 portions of photoinitiator
0.2-4 parts of coupling agent
1-5 parts of inorganic silicon spheres
2-5 parts of silicon dioxide
10-20 parts of organic filler
10-20 parts of thermal curing agent
0.1 to 1 portion of antioxidant
Wherein the inorganic silicon spheres have a particle size of not more than 1 micron, the heat-curing agent is MDH (maleic dihydrazide) curing agent manufactured by Nippon monosodium glutamate Fine chemical Co., ltd, and the antioxidant is 2, 6-di-tert-butyl-p-cresol.
2. The low moisture permeability frame sealing adhesive according to claim 1, wherein the inorganic silicon spheres are obtained from silica spheres of type IX-3-G manufactured by Nippon clothing Co.
3. The low moisture permeability frame sealing adhesive according to claim 1, wherein the photoinitiator is a radical photoinitiator.
4. The low moisture permeability frame sealing glue according to claim 3, wherein the photoinitiator is an oxime ester photoinitiator OEX-01 or OEX-02.
5. The low moisture permeability frame sealing glue according to claim 1, wherein the coupling agent is a silane coupling agent.
6. The low moisture permeability frame sealing glue according to claim 1, wherein the frame sealing glue comprises the following raw materials in parts by weight:
40-50 parts of acrylic polymer
0.2 to 2 portions of photoinitiator
0.2-4 parts of coupling agent
1-5 parts of inorganic silicon spheres
4-5 parts of silicon dioxide
10-20 parts of organic filler
10-20 parts of thermal curing agent
0.5-1 part of antioxidant.
7. The preparation method of the low moisture permeability frame sealing glue according to any one of claims 1 to 6, characterized by comprising the following steps:
s1, putting an acrylic polymer and an antioxidant into a reaction kettle according to parts by weight, heating to 70-75 ℃ for 10-15min to ensure that the antioxidant is completely oxidized;
s2, fully mixing and stirring the product obtained in the step S1 with a photoinitiator, an organic filler, a coupling agent, inorganic silicon spheres and silicon dioxide at normal temperature;
s3, adding the mixture obtained in the step S2 into a thermal curing agent, and uniformly mixing and stirring under the condition that the temperature is ensured not to be higher than 25 ℃;
and S4, carrying out three-roll grinding on the mixture obtained in the step S3 until the particle size of the particles is below 5 microns, and thus obtaining the required product.
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| JP2014063971A (en) * | 2012-09-21 | 2014-04-10 | Toray Advanced Materials Korea Inc | Adhesive composition for masking tape in mold underfill process, and masking tape using the same |
| CN103788880A (en) * | 2014-01-27 | 2014-05-14 | 北京京东方光电科技有限公司 | Frame sealing gum composition and preparation method thereof |
| CN105176425A (en) * | 2015-10-28 | 2015-12-23 | 京东方科技集团股份有限公司 | Frame sealing adhesive composition and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101220047B1 (en) * | 2009-10-12 | 2013-01-08 | 금호석유화학 주식회사 | Sealant composition for liquid crystal display device |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014063971A (en) * | 2012-09-21 | 2014-04-10 | Toray Advanced Materials Korea Inc | Adhesive composition for masking tape in mold underfill process, and masking tape using the same |
| CN103788880A (en) * | 2014-01-27 | 2014-05-14 | 北京京东方光电科技有限公司 | Frame sealing gum composition and preparation method thereof |
| CN105176425A (en) * | 2015-10-28 | 2015-12-23 | 京东方科技集团股份有限公司 | Frame sealing adhesive composition and preparation method thereof |
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