CN114106742B - High-viscosity liquid crystal frame sealing adhesive - Google Patents
High-viscosity liquid crystal frame sealing adhesive Download PDFInfo
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- CN114106742B CN114106742B CN202111282805.6A CN202111282805A CN114106742B CN 114106742 B CN114106742 B CN 114106742B CN 202111282805 A CN202111282805 A CN 202111282805A CN 114106742 B CN114106742 B CN 114106742B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4035—Hydrazines; Hydrazides
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Epoxy Resins (AREA)
- Sealing Material Composition (AREA)
- Liquid Crystal (AREA)
Abstract
The invention discloses a high-viscosity liquid crystal frame sealing adhesive which comprises the following raw materials in parts by weight: 10-20 parts of epoxy resin, 40-60 parts of acrylic resin, 0.2-2 parts of bismaleimide resin, 0.2-2 parts of photoinitiator, 15-30 parts of organic filler, 0.2-2 parts of coupling agent, 0.2-3 parts of silicon dioxide and 10-20 parts of thermal curing agent, wherein the thermal curing agent adopts malonic dihydrazide curing agent. The viscosity of the frame sealing glue is greatly improved, and the adhesive force of the frame sealing glue is improved under the condition of not influencing other performances of a product.
Description
Technical Field
The invention relates to the technical field of displays, in particular to high-viscosity liquid crystal frame sealing glue.
Background
The frame sealing glue of the liquid crystal screen seals the liquid crystal and provides a certain thickness and mechanical strength for the liquid crystal screen. Generally, the frame sealing glue of the liquid crystal display needs to be irradiated by ultraviolet light to perform photocuring, and then is further thermally cured in a certain high-temperature manufacturing process. At present, the conventional liquid crystal frame sealing glue has viscosity of 26 to 36 ten thousand mPa · s, preferably 36 to 42 ten thousand mPa · s, and is coated on an Array substrate or a CF substrate, the upper substrate and the lower substrate are bonded, then Ultraviolet (UV) irradiation is performed on the frame sealing glue to perform photocuring on the frame sealing glue, and then the frame sealing glue is further thermally cured under certain high-temperature baking, so that liquid crystal is sealed, certain thickness and mechanical strength are provided, and meanwhile, water vapor and oxygen in air are prevented from entering a liquid crystal box. However, in the practical application process, the sealing effect of the liquid crystal frame sealing glue within the viscosity range is still not ideal enough, and the problems of liquid crystal leakage, insufficient screen strength and the like can occur. Therefore, the viscosity of the sealant for the customer needs to be more than 60 ten thousand mPa · s, which cannot be achieved by the conventional ingredients, and therefore, how to increase the viscosity of the sealant to meet the customer requirement is a matter that the skilled person is trying to solve.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a high-viscosity liquid crystal frame sealing adhesive.
In order to achieve the purpose, the invention adopts the technical scheme that: the high-viscosity liquid crystal frame sealing glue comprises the following raw materials in parts by weight: 10-20 parts of epoxy resin, 40-60 parts of acrylic resin, 0.2-2 parts of bismaleimide resin, 0.2-2 parts of photoinitiator, 15-30 parts of organic filler, 0.2-2 parts of coupling agent, 0.2-3 parts of silicon dioxide and 10-20 parts of thermal curing agent, wherein the thermal curing agent adopts malonic dihydrazide curing agent.
Preferably, the heat curing agent is obtained from malonic acid dihydrazide curing agent model MDH, manufactured by Nippon Ajinomoto Fine Chemicals.
Preferably, the epoxy resin adopts fatty acid modified bisphenol A epoxy acrylate.
Preferably, the photoinitiator is a radical photoinitiator.
As a specific embodiment, the photoinitiator adopts an oxime ester photoinitiator OEX-02.
Preferably, the coupling agent is a silane coupling agent.
Preferably, the organic filler is polymethacrylate.
As a specific implementation mode, the frame sealing glue comprises the following raw materials in parts by weight: 10-20 parts of epoxy resin, 40-60 parts of acrylic resin, 0.2-2 parts of bismaleimide resin, 0.2-2 parts of photoinitiator, 25-30 parts of organic filler, 0.2-2 parts of coupling agent, 0.2-3 parts of silicon dioxide and 17-20 parts of thermal curing agent, wherein the thermal curing agent adopts malonic dihydrazide curing agent, and the organic filler adopts polymethacrylate.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages: the frame sealing glue is prepared from epoxy resin, acrylic resin, bismaleimide resin, a photoinitiator, organic filler, a coupling agent, silicon dioxide and a thermal curing agent, wherein the thermal curing agent is a malonic dihydrazide curing agent, and replaces the epoxy curing agent in the conventional frame sealing glue, so that the viscosity of the frame sealing glue is greatly improved to more than 60 ten thousand mPa.s, and the adhesive force of the frame sealing glue is improved under the condition of not influencing other performances of a product.
Detailed Description
The technical solution of the present invention is further illustrated by the following specific examples.
The invention provides a high-viscosity liquid crystal frame sealing glue which comprises the following raw materials in parts by weight: 10-20 parts of epoxy resin, 40-60 parts of acrylic resin, 0.2-2 parts of bismaleimide resin, 0.2-2 parts of photoinitiator, 15-30 parts of organic filler, 0.2-2 parts of coupling agent, 0.2-3 parts of silicon dioxide and 10-20 parts of thermal curing agent, wherein the thermal curing agent adopts malonic dihydrazide curing agent.
The preparation method of the frame sealing adhesive comprises the following steps:
s1, sufficiently mixing and uniformly stirring epoxy resin, acrylic resin, bismaleimide resin, a photoinitiator, an organic filler, a coupling agent and silicon dioxide;
s3, adding a thermal curing agent into the mixture obtained in the step S1, ensuring that the temperature is below 25 ℃, and uniformly mixing and stirring;
and S3, carrying out three-roll grinding (three times) on the mixture obtained in the S2 to ensure that the particle size of the particles is below 5 microns, and thus obtaining the nano-particles.
1. Influence of different contents and types of thermal curing agents on performance of frame sealing adhesive
The high-viscosity liquid crystal frame sealing glue comprises the following raw materials in parts by weight: 16 parts of epoxy resin, 48 parts of acrylic resin, 0.9 part of bismaleimide resin, 0.4 part of photoinitiator, 20 parts of organic filler, 0.4 part of coupling agent and 0.5 part of silicon dioxide, wherein the content of the thermal curing agent is shown in Table 1.
In examples 1 to 7 and comparative examples 1 to 2, fatty acid-modified bisphenol A epoxy acrylate was used as the epoxy resin, oxime ester type photo initiator OEX-02 was used as the photo initiator, polymethacrylate was used as the organic filler, gamma-aminopropyltriethoxysilane was used as the coupling agent, MDH type malonic acid dihydrazide curing agent was used as the thermal curing agent in examples 1 to 7, manufactured by Nippon Ajinomoto Fine Chemicals, 2-phenylimidazole was used as the thermal curing agent in comparative example 1 (manufactured by Shanghai Haoden materials Co., ltd.), malonic acid dihydrazide curing agent was used as the thermal curing agent in comparative example 2 (manufactured by Nantong Runfeng petrochemical Co., ltd.), and the results of the product test are shown in Table 1.
The testing method of the prepared frame sealing glue comprises the following steps:
1) Viscosity test method:
using Brookfiled cone and plate viscometer, spindle CP51 (Spindle), 1rpm (rotation speed), temperature: 25 deg.C
Sample amount: 0.5ml
2) Thixotropic index test method:
the thixotropic index is the ratio of the viscosity at 0.5rpm (Spindle) to the viscosity at 5rpm (Spindle) of a Brookfiltered cone-plate viscometer, spindle CP 51.
3) The adhesion test method comprises the following steps:
base material: ITO glass, PI glass
And (3) size specification: 15mm 40mm 0.7mm
Baking conditions: 3000mj + C/60min
Stretching rate: 2mm/min
4) The moisture permeability test method comprises the following steps:
weighing the ratio of calcium chloride in the moisture permeable cup before and after water absorption at the temperature of 60 ℃ and under the environment of 90% for 24H;
5) The reliability test method comprises the following steps:
after the samples were placed at-30 ℃,70% environment and 60 ℃,90% environment for 200H, respectively, the adhesion values and the original adhesion values were tested. If they match, OK is performed, and if the deviation occurs, NG is performed.
TABLE 1
As can be seen from Table 1, when the amount of the thermosetting agent added is less than 10 parts, the viscosity is more decreased in the case where the other components are the same, as in example 1; when the addition amount exceeds 20 parts, the viscosity of the product is not increased any more, and other properties are not improved any more, therefore, under the condition that other components are the same, the addition amount of the heat curing agent is between 10 and 20 parts, and compared with the comparative example 1 and the example 3, the product prepared by adopting the malonic dihydrazide as the heat curing agent is higher in viscosity, strong in adhesive force and good in reliability compared with the product prepared by 2-phenylimidazole, and compared with the product prepared by other manufacturers, the malonic dihydrazide curing agent with the model of MDH, which is prepared by the fine chemical company of Japan monosodium glutamate, can be obviously improved in viscosity and stronger in adhesive force compared with the product prepared by adopting the heat curing agent prepared by other manufacturers, which is shown in the comparative example 2 and the example 5. Meanwhile, as can be seen from Table 1, the addition amount of the thermal curing agent is between 17 and 20, and the performance of the product is optimal under the condition that other components are the same.
2. Influence of organic fillers with different contents on frame sealing glue
The high-viscosity liquid crystal frame sealing glue comprises the following raw materials in parts by weight: 10 parts of epoxy resin, 55 parts of acrylic resin, 0.2 part of bismaleimide resin, 0.2 part of photoinitiator, 0.2 part of coupling agent, 0.2 part of silicon dioxide and 10 parts of thermal curing agent, wherein the content of organic filler is shown in Table 2.
In the following examples 8 to 13 and comparative examples 3 to 4, the epoxy resin used fatty acid-modified bisphenol A epoxy acrylate, the photoinitiator used oxime ester photoinitiator OEX-02, the coupling agent used gamma-aminopropyltriethoxysilane, the heat-curing agent used was malonic acid dihydrazide curing agent (MDH) manufactured by Mitsubishi fine chemical Co., ltd., japan), the organic filler used in examples 8 to 13 was polymethacrylate, the organic filler used in comparative example 3 was polyphenylene sulfide, the styrene-divinylbenzene copolymer used in comparative example 4, the product test method was the same as above, and the test results are shown in Table 2.
TABLE 2
From table 2, it can be seen that, under the condition that other components are the same, adjusting the content of the organic filler has a certain influence on the viscosity and other properties of the product, and under the condition that other components are the same, when the adding amount of the organic filler is less than 15 parts, the viscosity, the adhesive force and the transmittance are relatively poor; after the adding amount is more than 30 parts, the viscosity, the adhesive force and the moisture permeability are not increased any more, so the range of the organic filler is controlled between 15 and 30 parts, and more preferably, the viscosity of the product is higher and the adhesive force is stronger when the content of the organic filler is between 25 and 30 parts, which can be seen from the table 2; in addition, as can be seen from comparison of comparative examples 3 and 4 with example 10, the performance of the product obtained by using polymethacrylate as the organic filler is superior to that obtained by using other organic fillers under the condition that other components are the same, so that polymethacrylate is used as the organic filler.
Example 14
The high-viscosity liquid crystal frame sealing glue comprises the following raw materials in parts by weight: 20 parts of epoxy resin, 40 parts of acrylic resin, 1 part of bismaleimide resin, 1 part of photoinitiator, 25 parts of organic filler, 1 part of coupling agent, 1 part of silicon dioxide and 15 parts of thermal curing agent. The performance test data is as follows: viscosity 625000mPa · s; thixotropic index 1.20; the adhesive force is 6.31N/mm; the reliability is OK.
Example 15
The high-viscosity liquid crystal frame sealing glue comprises the following raw materials in parts by weight: 15 parts of epoxy resin, 60 parts of acrylic resin, 2 parts of bismaleimide resin, 2 parts of photoinitiator, 30 parts of organic filler, 2 parts of coupling agent, 3 parts of silicon dioxide and 20 parts of thermal curing agent. The performance test data is as follows: viscosity 630000 mPas; thixotropic index 1.20; the adhesive force is 6.31N/mm; the reliability is OK.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (7)
1. The high-viscosity liquid crystal frame sealing glue is characterized by comprising the following raw materials in parts by weight: 10-20 parts of epoxy resin, 40-60 parts of acrylic resin, 0.2-2 parts of bismaleimide resin, 0.2-2 parts of photoinitiator, 15-30 parts of organic filler, 0.2-2 parts of coupling agent, 0.2-3 parts of silicon dioxide and 10-20 parts of thermal curing agent, wherein the thermal curing agent adopts malonic dihydrazide curing agent which is purchased from maleic anhydride fine chemical company of Japan and has the model number of MDH.
2. The high viscosity liquid crystal frame sealant according to claim 1, wherein the epoxy resin is fatty acid modified bisphenol a epoxy acrylate.
3. The high-viscosity liquid crystal frame sealing adhesive according to claim 1, wherein the photoinitiator is a free radical photoinitiator.
4. The high viscosity liquid crystal frame sealing glue according to claim 3, wherein the photoinitiator is oxime ester photoinitiator OEX-02.
5. The frame sealing adhesive for high viscosity liquid crystal according to claim 1, wherein the coupling agent is a silane coupling agent.
6. The high viscosity liquid crystal frame sealant according to claim 1, wherein the organic filler is polymethacrylate.
7. The high-viscosity liquid crystal frame sealing glue according to claim 1, wherein the frame sealing glue comprises the following raw materials in parts by weight: 10-20 parts of epoxy resin, 40-60 parts of acrylic resin, 0.2-2 parts of bismaleimide resin, 0.2-2 parts of photoinitiator, 25-30 parts of organic filler, 0.2-2 parts of coupling agent, 0.2-3 parts of silicon dioxide and 17-20 parts of thermal curing agent, wherein the thermal curing agent adopts malonic dihydrazide curing agent, and the organic filler adopts polymethacrylate.
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| CN202111282805.6A CN114106742B (en) | 2021-11-01 | 2021-11-01 | High-viscosity liquid crystal frame sealing adhesive |
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| CN202111282805.6A CN114106742B (en) | 2021-11-01 | 2021-11-01 | High-viscosity liquid crystal frame sealing adhesive |
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| CN114106742B true CN114106742B (en) | 2023-03-14 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115537165B (en) * | 2022-11-30 | 2023-03-10 | 苏州润邦半导体材料科技有限公司 | Adhesive composition and application thereof |
| CN115537166B (en) * | 2022-12-01 | 2023-03-10 | 苏州润邦半导体材料科技有限公司 | Adhesive composition with high bonding and high moisture permeability characteristics and application thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5635259A (en) * | 1993-06-29 | 1997-06-03 | Mitsui Toatsu Chemicals, Inc. | Resin composition for sealing film-made liquid crystal cells |
| CN102859428A (en) * | 2010-04-14 | 2013-01-02 | 日本化药株式会社 | Liquid crystal sealing agent and liquid crystal display cell using same |
| CN105176425A (en) * | 2015-10-28 | 2015-12-23 | 京东方科技集团股份有限公司 | Frame sealing adhesive composition and preparation method thereof |
| CN106062075A (en) * | 2014-02-19 | 2016-10-26 | 汉高股份有限及两合公司 | Curable resin composition for sealing liquid crystal |
| CN112080239A (en) * | 2020-09-10 | 2020-12-15 | 苏州润邦半导体材料科技有限公司 | Sealant composition and preparation method and application thereof |
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- 2021-11-01 CN CN202111282805.6A patent/CN114106742B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5635259A (en) * | 1993-06-29 | 1997-06-03 | Mitsui Toatsu Chemicals, Inc. | Resin composition for sealing film-made liquid crystal cells |
| CN102859428A (en) * | 2010-04-14 | 2013-01-02 | 日本化药株式会社 | Liquid crystal sealing agent and liquid crystal display cell using same |
| CN106062075A (en) * | 2014-02-19 | 2016-10-26 | 汉高股份有限及两合公司 | Curable resin composition for sealing liquid crystal |
| CN105176425A (en) * | 2015-10-28 | 2015-12-23 | 京东方科技集团股份有限公司 | Frame sealing adhesive composition and preparation method thereof |
| CN112080239A (en) * | 2020-09-10 | 2020-12-15 | 苏州润邦半导体材料科技有限公司 | Sealant composition and preparation method and application thereof |
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