CN115537166B - Adhesive composition with high bonding and high moisture permeability characteristics and application thereof - Google Patents

Adhesive composition with high bonding and high moisture permeability characteristics and application thereof Download PDF

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CN115537166B
CN115537166B CN202211525382.0A CN202211525382A CN115537166B CN 115537166 B CN115537166 B CN 115537166B CN 202211525382 A CN202211525382 A CN 202211525382A CN 115537166 B CN115537166 B CN 115537166B
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adhesive composition
epoxy resin
percent
curing agent
bisphenol
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CN115537166A (en
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陈玉
马晓明
高清
张博
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Suzhou Runbang Semiconductor Material Technology Co ltd
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Suzhou Runbang Semiconductor Material Technology Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/10—Epoxy resins modified by unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/265—Calcium, strontium or barium carbonate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention relates to an adhesive composition with high bonding and high moisture permeability characteristics and application thereof, wherein the adhesive composition comprises the following components by taking the total mass of the adhesive composition as 100 percent: 10 to 40 percent of modified methacrylate, 10 to 40 percent of hyperbranched polyester acrylate, 30 to 70 percent of epoxy resin, 0.1 to 3 percent of photoinitiator, 0.1 to 3 percent of thermal curing agent, 0.1 to 3 percent of coupling agent and 1 to 15 percent of filler; the epoxy resin comprises bisphenol A type epoxy resin and/or bisphenol F type epoxy resin and partial acrylic modified epoxy resin. The adhesive composition disclosed by the invention has excellent bonding force, moisture permeability and hydrophobic property after being cured, particularly under severe environment, compared with the adhesive composition of the traditional liquid crystal display product, the adhesive composition has the advantages that the high-temperature and high-humidity resistance is improved, the water resistance and the moisture permeability are more excellent, and the adhesive composition is suitable for the liquid crystal display product.

Description

Adhesive composition with high bonding and high moisture permeability characteristics and application thereof
Technical Field
The invention relates to the technical field of adhesives, in particular to an adhesive composition with high bonding and high moisture permeability and application thereof.
Background
Adhesives are of vital importance in modern industrial products.
CN103339214A discloses an adhesive which has good adhesive strength to a surface-untreated material such as an untreated polyester film, and can maintain the adhesive strength for a long period of time by suppressing the decrease of the adhesive strength with time even under outdoor exposure conditions. The polyurethane adhesive disclosed therein is a polyurethane adhesive using a main agent containing a specific polyester polyol (a), a specific polycarbonate polyurethane polyol (B), and a specific bisphenol epoxy resin (C) in specific proportions and a curing agent containing a specific amount of a polyisocyanate component having an isocyanurate skeleton.
CN111187591A discloses an epoxy modified polyester adhesive, a solar photovoltaic back plate comprising the same, and a solar photovoltaic cell module. The epoxy modified polyester adhesive comprises the following raw materials in parts by weight: 90-110 parts of epoxy modified polyester resin, 1-20 parts of isocyanate curing agent and 0.1-5 parts of ultraviolet absorbent: the epoxy modified polyester resin comprises the following raw materials in parts by weight: 90-110 parts of polyester resin and 2-20 parts of hydrogenated epoxy resin. The epoxy modified polyester adhesive has excellent adhesive force, hydrolysis resistance, ultraviolet aging resistance and wide processing window on a base material film, and a solar backboard using the adhesive is applied to a double-sided battery assembly, so that the long-term reliable double-sided power generation efficiency can be kept.
At present, the adhesive composition applied to the liquid crystal display device has the problems of poor adhesion after curing, poor moisture permeability and poor hydrophobic property, and the development of the adhesive composition capable of solving the technical problems is very important.
Disclosure of Invention
In view of the defects of the prior art, the invention aims to provide an adhesive composition with high adhesion and high moisture permeability and application thereof, wherein the adhesive composition has excellent adhesion force, moisture permeability and hydrophobic property after being cured, has improved high-temperature and high-humidity resistance compared with the adhesive composition of the conventional liquid crystal display product particularly under severe environment, has durability and reliability, and is suitable for the liquid crystal display product.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the present invention provides an adhesive composition comprising, based on 100% of the total mass of the adhesive composition:
10 to 40 percent of modified methacrylate
10 to 40 percent of hyperbranched polyester acrylate
30 to 70 percent of epoxy resin
0.1 to 3 percent of photoinitiator
0.1 to 3 percent of thermal curing agent
0.1 to 3 percent of coupling agent
1% -15% of filler;
the epoxy resin comprises bisphenol A type epoxy resin and/or bisphenol F type epoxy resin and partially acrylic modified epoxy resin, wherein typical but non-limiting combinations comprise: a combination of a partially acrylic-modified epoxy resin and a bisphenol a-type epoxy resin, a combination of a partially acrylic-modified epoxy resin and a bisphenol F-type epoxy resin, a combination of a partially acrylic-modified epoxy resin and a bisphenol a-type epoxy resin and a bisphenol F-type epoxy resin, and the like.
According to the invention, the hyperbranched polyester acrylate has a highly branched three-dimensional structure, has the characteristics of less intermolecular winding, good solubility, low viscosity, excellent curing performance, hot water resistance, toughness and the like, and the adhesive composition formed by using the hyperbranched polyester acrylate has excellent high-temperature and high-humidity resistance, and meanwhile, the epoxy resin mixture system further enhances the coupling effect, improves the crosslinking density, and obviously improves the bonding performance, the moisture permeability and the hydrophobic performance of the whole adhesive system. Compared with the prior adhesive composition for liquid crystal display products, the adhesive composition has improved high-temperature and high-humidity resistance under severe environment, and has more excellent water resistance and moisture permeability.
In the invention, the epoxy resin modified by partial acrylic acid has dual curing effects of photocuring and thermocuring, and meanwhile, the polymer has higher polymerization degree, higher viscosity and higher crosslinking density after curing; the bisphenol A epoxy resin structure contains aromatic rings and side hydroxyl groups, so that the adhesive force of the adhesive can be improved; the bisphenol F epoxy resin structure has good heat resistance, water resistance and electrical properties; the cured product of the novolac epoxy resin has a high crosslinking density and is excellent in heat resistance, moisture resistance, and the like.
In the present invention, the modified methacrylate is 10 to 40 mass%, for example, 15%, 20%, 25%, 30%, 35%, or the like.
The mass percentage of the hyperbranched polyester acrylate is 10-40%, such as 15%, 20%, 25%, 30%, 35% and the like.
The mass percent of the epoxy resin is 30-70%, such as 35%, 40%, 45%, 50%, 55%, 60%, 65%, etc.
The mass percentage of the photoinitiator is 0.1-3%, such as 0.5%, 1%, 1.5%, 2%, 2.5% and the like.
The mass percentage of the thermal curing agent is 0.1-3%, such as 0.5%, 1%, 1.5%, 2%, 2.5% and the like.
The coupling agent is 0.1-3% by mass, such as 0.5%, 1%, 1.5%, 2%, 2.5%, etc.
The mass percentage of the filler is 1% -15%, such as 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, 11%, 12%, 13%, 14% and the like.
Preferably, the modified methacrylate comprises a fatty acid modified methacrylate.
Preferably, the fatty acid modified methacrylate comprises any one of or a combination of at least two of oleic acid modified methacrylate, linoleic acid modified methacrylate or linolenic acid modified methacrylate, wherein typical but non-limiting combinations include: combinations of oleic acid-modified methacrylate and linoleic acid-modified methacrylate, linoleic acid-modified methacrylate and linolenic acid-modified methacrylate, oleic acid-modified methacrylate, linoleic acid-modified methacrylate and linolenic acid-modified methacrylate, and the like.
Preferably, the hyperbranched polyester acrylate has a functionality of 6.
Preferably, the molecule of the partially acrylic modified epoxy resin contains at least one (for example, 2, 3, 4, etc.) or more epoxy groups and one or more acryloxy groups (for example, 2, 3, 4, etc.).
Preferably, the proportion of the partially acrylic modified epoxy resin is 40% to 80%, for example, 45%, 50%, 55%, 60%, 65%, 70%, 75%, etc., based on 100% of the total mass of the epoxy resin.
In the present invention, the reason why the proportion of the partially acrylic-modified epoxy resin is controlled here is that: the epoxy resin modified by partial acrylic acid has dual curing effects of photocuring and thermocuring, and meanwhile, the polymer has higher polymerization degree, higher viscosity and higher crosslinking density after curing; the proportion is too high, which can cause the viscosity of the whole system to be higher; if the proportion is too low, the proportion of bisphenol A or bisphenol F epoxy resin oligomers in the system is too high, the viscosity of the system is too low, and the crosslinking density is too low, so that the adhesive force, the moisture permeability and the like of the cured adhesive are influenced.
Preferably, the mass ratio of the hyperbranched polyester acrylate to the modified methacrylate is 1: (0.5-1.5), wherein 0.5-1.5 can be 0.6, 0.8, 1, 1.2, 1.4, etc.
Preferably, the photoinitiator comprises any one of benzophenone compounds, acetophenone compounds, acylphosphine oxide compounds, titanocene compounds or oxime ester compounds or a combination of at least two of the compounds, wherein a typical but non-limiting combination comprises: a combination of benzophenone compound and acetophenone compound, a combination of acyl phosphine oxide compound, titanocene compound and oxime ester compound, a combination of benzophenone compound, acetophenone compound, acyl phosphine oxide compound, titanocene compound and oxime ester compound, and the like.
Preferably, the thermal curing agent includes an amine-based curing agent.
The thermal curing agent has higher storage stability and lower toxicity.
Preferably, the aliphatic amine-based curing agent comprises any one of or a combination of at least two of a polyamide-based curing agent, a dicyandiamide-based curing agent, or an aromatic amine-based curing agent, wherein typical but non-limiting combinations include: a combination of a polyamide-based curing agent and a dicyandiamide-based curing agent, a combination of a dicyandiamide-based curing agent and an aromatic amine-based curing agent, a combination of a polyamide-based curing agent, a dicyandiamide-based curing agent and an aromatic amine-based curing agent, and the like.
Preferably, the coupling agent comprises a silane coupling agent.
The silane coupling agent includes any one of or a combination of at least two of dodecyltrimethoxysilane, hexadecyltrimethoxysilane, or octadecyltrimethoxysilane, wherein typical but non-limiting combinations include: combinations of dodecyltrimethoxysilane and hexadecyltrimethoxysilane, hexadecyltrimethoxysilane and octadecyltrimethoxysilane, dodecyltrimethoxysilane, hexadecyltrimethoxysilane and octadecyltrimethoxysilane, and the like.
The coupling agent of the present invention has hydrophobicity, thereby being capable of improving moisture permeation resistance of the adhesive composition.
Preferably, the filler comprises any one of silica, calcium carbonate or titanium dioxide or a combination of at least two of them, wherein typical but non-limiting combinations include: combinations of silica and calcium carbonate, calcium carbonate and titanium dioxide, silica, calcium carbonate and titanium dioxide, and the like.
In a second aspect, the present invention provides a method of adhesive sealing, the method comprising: and (3) applying the adhesive composition to the part to be bonded or sealed, and curing to complete bonding and sealing.
Preferably, the curing comprises ultraviolet light curing and thermal curing in this order.
In the invention, the adhesive composition can be cured by ultraviolet light and heat, and has simple use mode and easy operation.
In a third aspect, the present invention provides a liquid crystal adhesive composition comprising the adhesive composition of the first aspect.
Compared with the prior art, the invention has the following beneficial effects:
(1) The adhesive composition disclosed by the invention is excellent in bonding force, moisture permeability and hydrophobic property after being cured, and particularly under a severe environment, compared with the adhesive composition of the conventional liquid crystal display product, the adhesive composition has the advantages of improved high-temperature and high-humidity resistance, more excellent water resistance and moisture permeability, and is suitable for the liquid crystal display product.
(2) The adhesive composition has an adhesive strength in ITO glass of 4.0 MPa or more, an adhesive strength in PI glass of 3.9 MPa or more, a viscosity at 25 ℃ of 26.7-35.5 ten thousand mp · s, a moisture permeability in a cured film formed in a liquid crystal display element of 53.8% or less, and a water absorption of 3.7% or less.
Detailed Description
The technical solution of the present invention is further described below by way of specific embodiments. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
Example 1
The present embodiment provides an adhesive composition, which comprises the following components by taking the total mass of the adhesive composition as 100%:
hyperbranched polyester acrylate 20%
Modified methacrylate 20%
Bisphenol A epoxy resin 10%
Part of acrylic acid modified epoxy resin is 30 percent
0.5 percent of photoinitiator
5 percent of thermal curing agent
1.5 percent of coupling agent
Silicon dioxide 10%
3 percent of nano calcium carbonate.
In this example, the purchase information of each raw material is as follows:
hyperbranched polyester acrylate: the functionality is 6, and the product is purchased from Guangdong Boxing New Material science and technology Co., ltd, and the mark is B-574;
modified methacrylic acid ester: known under the name fatty acid-modified methacrylate, commercially available from Zhan Xin resins (China) Ltd, under the designation EP3700;
bisphenol a epoxy resin: purchased from Hensman, china, inc. under the designation GY2600;
coupling agent: hexadecyl trimethoxy silane;
photoinitiator (2): 2-hydroxy-2-methyl-1-phenylpropanone;
thermal curing agent: dicyandiamide curing agent, available from Guangdong New Dilute Metallurgical chemical Co., ltd, under the trade name SH300.
The preparation method of the adhesive composition comprises the following steps:
adding the raw materials of the components into a stirring tank according to the weight parts, putting the raw materials into a planetary stirrer, stirring for 30 minutes to uniformly mix the components, controlling the temperature to be below 28 ℃, then grinding by using a three-roll grinding machine, wherein the gap between the three-roll feeding hole and the roller is 10 mu m, and the gap between the discharging hole and the roller is below 5 mu m, and fully grinding. The adhesive composition was obtained.
Examples 2 to 4
Examples 2 to 4 differ from example 1 in the mass ratio of hyperbranched polyester acrylate and modified methacrylate being different, the total mass percentage being 40%, the mass ratios being 1.
Example 5
The difference between this example and example 1 is that the epoxy resin is a composition of a partially modified acrylic epoxy resin and a bisphenol F epoxy resin, wherein the mass percent of the partially modified acrylic epoxy resin is 30%, the mass percent of the bisphenol F epoxy resin is 10%, and the rest is the same as example 1.
In this example, bisphenol F epoxy resin was purchased from Hensman, china, inc. under the designation GY281, and the rest was the same as in example 1.
Example 6
The difference between this example and example 1 is that the epoxy resin is a composition of a part of acrylic modified epoxy resin, bisphenol a epoxy resin and bisphenol F epoxy resin, wherein the mass percent of the part of acrylic modified epoxy resin is 20%, the mass percent of bisphenol a epoxy resin is 10%, the mass percent of bisphenol F epoxy resin is 10%, and the rest is the same as example 1.
Examples 7 to 8
Examples 7 to 8 differ from example 1 in the mass ratio of hyperbranched polyester acrylate and modified methacrylate being different, the total mass percentage of both being 40%, the mass ratio being 1.3 (example 7) and 1.8 (example 8), respectively, and the rest being the same as in example 1.
Examples 9 to 10
Examples 9-10 differ from example 1 in that the proportion of the epoxy resin in part of the acrylic modified epoxy resin in the total amount of epoxy resin is different, the total mass fraction of epoxy resin in the adhesive composition is 40%, the proportion of the epoxy resin in part of the acrylic modified epoxy resin in the epoxy resin is 30% (example 9) and 90% (example 10), respectively, and correspondingly, the proportion of the bisphenol a epoxy resin in the epoxy resin is 70% (example 9) and 10% (example 10), respectively, and the rest is the same as example 1.
Comparative example 1
The present comparative example provides an adhesive composition comprising the following components, based on 100% of the total mass of the adhesive composition:
modified methacrylate 40%
Bisphenol A epoxy resin 10%
Part of acrylic acid modified epoxy resin is 30 percent
0.5 percent of photoinitiator
5 percent of thermal curing agent
1.5 percent of coupling agent
Silicon dioxide 10%
3 percent of nano calcium carbonate.
In this comparative example, the purchase information of each raw material was the same as in example 1, and the adhesive composition was prepared by the same method as in example 1.
Comparative example 2
The present comparative example provides an adhesive composition comprising the following components, based on 100% of the total mass of the adhesive composition:
hyperbranched polyester acrylate 40%
Bisphenol A epoxy resin 10%
Part of acrylic acid modified epoxy resin is 30 percent
0.5 percent of photoinitiator
5 percent of thermal curing agent
1.5 percent of coupling agent
Silicon dioxide 10%
3 percent of nano calcium carbonate.
In this comparative example, the purchase information of each raw material was the same as in example 1, and the adhesive composition was prepared by the same method as in example 1.
Comparative example 3
The present comparative example provides an adhesive composition comprising the following components, based on 100% of the total mass of the adhesive composition:
hyperbranched polyester acrylate 20%
Modified methacrylate 20%
40 percent of acrylic acid modified epoxy resin
0.5 percent of photoinitiator
5 percent of thermal curing agent
1.5 percent of coupling agent
Silicon dioxide 10%
3 percent of nano calcium carbonate.
In this comparative example, purchase information of each raw material was the same as in example 1, and a preparation method of the adhesive composition was the same as in example 1.
Comparative example 4
The present comparative example provides an adhesive composition comprising the following components, based on 100% of the total mass of the adhesive composition:
hyperbranched polyester acrylate 20%
Modified methacrylate 20%
Bisphenol A type epoxy resin 20%
Bisphenol F type resin 20%
0.5 percent of photoinitiator
5 percent of thermal curing agent
1.5 percent of coupling agent
Silicon dioxide 10%
3 percent of nano calcium carbonate.
In this comparative example, the purchase information of each raw material was the same as in examples 1 and 5, and the adhesive composition was prepared by the same method as in example 1.
Performance testing
The adhesive compositions described in examples 1-10 and comparative examples 1-4 were tested as follows:
(1) Adhesion: the adhesive composition was dropped in minute droplets onto one of two 30X 40mm glass sheets having an ITO film and a Polyimide (PI) film attached thereto, respectively, and the other glass sheet was bonded to the other glass sheet in a crisscross mannerThe glass test piece (2) was pressed to be completely bonded. Using 3000mJ/cm 2 The metal halide was irradiated with ultraviolet light and heated at 120 ℃ for 60 minutes to obtain an adhesive test piece, and a tensile test (2 mm/sec) was conducted using a jig prepared above and below the adhesive test piece. The obtained measurement value (N) was divided by the seal coating cross-sectional area (mm) 2 ) The value obtained is the adhesion of the adhesive.
(2) Moisture permeability: coating the adhesive composition into a smooth release film with a thickness of 200-300 μm by using a coater, and irradiating the film with a metal halide lamp for 30 seconds at a speed of 100mW/cm 2 After UV irradiation (wavelength: 365 nm), the cured film was heated at 120 ℃ to obtain a cured film for moisture permeability measurement. A cup for moisture permeability test was produced by the method of the moisture-proof packaging material penetration temperature test method (cup method) according to JIS Z0208, the obtained cured film for moisture permeability measurement was mounted, and the film was put into a constant-temperature and constant-humidity oven at a temperature of 60 ℃ and a humidity of 90% to measure the moisture permeability for 24 hours.
(3) Water absorption: coating the sealant for the adhesive composition into a smooth release film with a thickness of 200-300 μm by using a coater, and irradiating with a metal halide lamp for 30 seconds at a speed of 100mW/cm 2 After UV irradiation (wavelength: 365 nm), the cured film was heated at 120 ℃ to obtain a cured film for water absorption measurement. The cured film was placed in a PCT test chamber, autoclaved at 121 ℃ under 2atm atmospheric pressure for 2 hours, and the water absorption properties before and after retort were measured.
(4) And (3) viscosity testing: the viscosity of the cured product was measured by a cone and plate rotor viscometer under the conditions of No. 51 rotor, rotation speed: 1rpm, sample introduction amount: 0.5mL, test temperature: at 25 ℃.
The test results are summarized in table 1.
TABLE 1
Figure DEST_PATH_IMAGE001
As is clear from an analysis of the data in Table 1, the adhesive composition of the present invention has an adhesive strength in ITO glass of 4.0 MPa or more, an adhesive strength in PI glass of 3.9 MPa or more, a viscosity at 25 ℃ of 26.7 to 35.5 ten thousand mp · s, a moisture permeability of a cured film formed in a liquid crystal display element of 53.8% or less, and a water absorption of 3.7% or less; the adhesive composition disclosed by the invention has excellent bonding force, moisture permeability and hydrophobic property after being cured, and is suitable for liquid crystal display products. As can be seen from the analysis of comparative examples 1-2 and example 1, comparative examples 1-2 are inferior to example 1 in performance, and the adhesive composition formed by using the modified methacrylate and the hyperbranched polyester acrylate oligomer is proved to have better performance.
As can be seen from the analysis of comparative examples 3-4 and example 1, comparative examples 3-4 are inferior to example 1 in performance, and the adhesive composition formed by combining part of the acrylic modified epoxy resin and the bisphenol epoxy resin or the bisphenol F epoxy resin or the mixture of the two has better performance.
As can be seen from the analysis of examples 7 to 8 and example 1, examples 7 to 8 are inferior in performance to example 1, and the mass ratio of the polyester acrylate to the modified methacrylate was 1: (0.5-1.5) the adhesive composition has better performance.
As can be seen from an analysis of examples 9-10 and example 1, examples 9-10 are inferior to example 1 in performance, demonstrating that a portion of the acrylic modified epoxy resin in the epoxy resin mixture provides better performance in the adhesive composition than in the range of 40% to 80%.
The present invention is illustrated in detail by the examples described above, but the present invention is not limited to the details described above, i.e., it is not intended that the present invention be implemented by relying on the details described above. It should be understood by those skilled in the art that any modification of the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.

Claims (8)

1. An adhesive composition with high bonding and high moisture permeability characteristics is characterized by comprising the following components in percentage by mass based on 100% of the total mass of the adhesive composition:
10 to 40 percent of modified methacrylate
10 to 40 percent of hyperbranched polyester acrylate
30 to 70 percent of epoxy resin
0.1 to 3 percent of photoinitiator
0.1 to 3 percent of thermal curing agent
0.1 to 3 percent of coupling agent
1% -15% of filler;
the epoxy resin comprises bisphenol A epoxy resin and/or bisphenol F epoxy resin and partial acrylic acid modified epoxy resin; the modified methacrylate includes fatty acid modified methacrylate;
the fatty acid modified methacrylate comprises any one or a combination of at least two of oleic acid modified methacrylate, linoleic acid modified methacrylate or linolenic acid modified methacrylate;
the functionality of the hyperbranched polyester acrylate is 6;
the molecule of the partial acrylic modified epoxy resin contains at least more than one epoxy group and more than one acryloxy group;
the proportion of the part of the acrylic modified epoxy resin is 40-80% by taking the total mass of the epoxy resin as 100%.
2. The adhesive composition according to claim 1, wherein the mass ratio of the hyperbranched polyester acrylate to the modified methacrylate is 1: (0.5-1.5).
3. The adhesive composition as claimed in claim 1, wherein the photoinitiator comprises any one or a combination of at least two of benzophenone compounds, acetophenone compounds, acylphosphine oxide compounds, titanocene compounds, or oxime ester compounds.
4. The adhesive composition of claim 1, wherein the thermal curing agent comprises an amine curing agent;
the amine curing agent comprises one or the combination of at least two of polyamide curing agent, dicyandiamide curing agent or aromatic amine curing agent.
5. The adhesive composition of claim 1, wherein the coupling agent comprises a silane coupling agent;
the silane coupling agent comprises any one or the combination of at least two of dodecyl trimethoxy silane, hexadecyl trimethoxy silane and octadecyl trimethoxy silane.
6. The adhesive composition of claim 1 wherein the filler comprises any one of silica, calcium carbonate, or titanium dioxide, or a combination of at least two thereof.
7. A method of adhesively sealing, the method comprising: applying the adhesive composition of any one of claims 1 to 6 to the area to be bonded or sealed and curing to complete the bonded seal.
8. A liquid crystal adhesive composition comprising the adhesive composition according to any one of claims 1 to 6.
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