JP3779601B2 - Mask sheet for semiconductor device assembly - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a masking sheet with which a semiconductor package of QFN, or the like, can be stably produced while controlling a failure in wire bonding, squeeze-out of a molding resin, and glue remainders of an adhesive when a semiconductor device is assembled. <P>SOLUTION: The masking sheet for assembling the semiconductor device comprises an adhesive layer formed on a heat resistant base, the layer comprising, per 100 parts by volume of the adhesive, 5-50 parts by volume of a filler being applied releasably to a lead frame. <P>COPYRIGHT: (C)2003,JPO

Description

【００２７】
なお、表１中の弾性率は１５０〜２５０℃における弾性率の最小値を示し、ワイヤーボンドはパッケージ1個分のリードピン８４本についてチップとワイヤーボンディングした時の発生した接続不良数を示し、モールドフラッシュは６４個のパッケージ中、モールド樹脂の漏れにより不良の発生した個数を示す。
表１から明らかなように、本発明のマスクシートは、金メッキの有無を問わず銅材への接着力が強く、ワイヤーボンドやモールドフラッシュにおける評価についても問題がなかった。また、リードフレーム及びモールド樹脂からマスクシートを剥離してもリードフレーム及びモールド樹脂に糊残りは生じていなかった。これに対して比較例１〜３の全てにおいて銅や金メッキに対して接着力が弱く、ワイヤーボンドにおける接続不良、モールドフラッシュにおけるモールド樹脂の漏れが発生していた。
【００２８】
【発明の効果】
本発明のマスクシートは、耐熱性に優れ、ワイヤーボンド時の弾性率が高いため不良が殆ど発生せず、またモールド時の粘着剤層の接着力が強いためモールド封止時の樹脂漏れを防ぐ事ができる。また粘着剤層が高分子樹脂を多く含有しており、粘着剤層の凝集力が強く、剥離時に糊残りを発生しにくく、そのためＱＦＮタイプの半導体装置のマスクシートとして好適である。
【図面の簡単な説明】
【図１】 リードフレームにマスクシートを貼着した状態を示す断面図である。
【図２】 半導体チップを搭載して金ワイヤーで接続した状態を示す断面図である。
【図３】 樹脂封止した状態を示す断面図である。
【図４】 マスクシートを剥がした状態を示す断面図である。
【図５】 半導体装置を個片化した状態を示す断面図である。
【符号の説明】
１ リードフレーム
２ 粘着剤層
３ 耐熱性基材
４ 金ワイヤー
５ 半導体チップ
６ モールド樹脂[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a mask sheet used for manufacturing a QFN (Quad Flat Non-lead) type semiconductor device. That is, the present invention relates to a mask sheet for assembling a semiconductor device used for masking a lead frame from a mold resin when a semiconductor device is assembled by mounting a semiconductor chip on a metal lead frame and sealing with resin.
[0002]
[Prior art]
With the spread of portable personal computers and mobile phones, electronic devices are required to be further reduced in size, thickness and functionality. In order to realize this requirement, it is indispensable to reduce the size and increase the integration of electronic components, but further requires a high-density mounting technology for electronic components. Therefore, instead of the conventional peripheral mounting types such as QFP (Quad Flat Package) and SOP (Small Outline Package), the surface mounting type called CSP (Chip Size Package) has been spotlighted as an IC package capable of high-density mounting. ing. Among them, in particular, the type called QFN (Quad Flat Non-lead) can be manufactured by conventional lead frame, wire bonding, and resin sealing (molding) technology and equipment, and is mainly less than 100 pins. Used to make small terminal type packages. This QFN is manufactured as follows. That is, as shown in FIG. 1, a mask sheet in which the pressure-sensitive adhesive layer 2 is formed on the heat-resistant substrate 3 is bonded to one surface of the lead frame 1 by, for example, pressing under heat. Next, the semiconductor chip 5 is mounted on the opposite surface of the lead frame, and the lead and the semiconductor chip are connected by the gold wire 4 (FIG. 2). Next, after sealing with the mold resin 6 (FIG. 3), the mask sheet is peeled off from the lead frame (FIG. 4), and finally cut into individual pieces (FIG. 5). As described above, the manufacturing process of QFN includes a “die attach process” in which a semiconductor chip is mounted on a lead frame, a “wire bond process” in which the semiconductor chip and the lead frame are bonded with a gold wire, and an epoxy resin for protecting the semiconductor chip. It is divided into a “resin sealing (molding) step” for sealing with a “peeling step” for peeling off the mask sheet from the lead frame, and a “dicing step” for separating the above-mentioned sealing material into pieces with a blade cutter.
[0003]
[Problems to be solved by the invention]
Conventionally, as the mask sheet for QFN production, a heat-resistant film coated with an acrylic pressure-sensitive adhesive or a rubber pressure-sensitive adhesive mainly composed of natural rubber or SBR is used. However, in the case of an acrylic adhesive, since it is processed at a high temperature in the die attach process for joining the semiconductor chip to the lead frame, the adhesive starts to decompose by heat, and the decomposed product contaminates the lead frame and joins the gold wire. In the resin sealing (molding) process, the adhesive force between the adhesive and the lead frame is weakened, and “mold flash”, a phenomenon in which the mold resin protrudes from the external connection lead portion, occurs. There was a problem. In the case of a rubber-based adhesive, the adhesive force between the adhesive and the mold resin and / or the lead frame is strong, making it difficult to remove the mask sheet from the package, so that the rubber-based adhesive remains on the lead frame. There was a problem that some “glue residue” was generated and a problem that the lead frame was deformed. In the past, silicone adhesives have also been used. However, the silicone pressure-sensitive adhesive tends to have a low elastic modulus and adhesive force in the wire bonding and resin sealing process processed at high temperature. In the wire bonding step, heat of 150 to 250 ° C. and ultrasonic waves of 60 to 120 kHz are used in combination to fuse the gold wire to the pad portion of the semiconductor chip and the lead frame, respectively. However, since the silicone adhesive in contact with the lead frame has a low elasticity at a temperature of 150 to 250 ° C., it becomes easy to absorb ultrasonic waves, resulting in poor connection between the lead frame and the gold wire. In addition, in the resin sealing process where heat of 150 to 200 ° C. and pressure of 5 to 10 GPa are applied, the silicone adhesive has a significant decrease in adhesive strength with the lead frame, and the adhesive is lead by the pressure of resin sealing. Peeling from the frame and mold flashing occurred, which resulted in poor connection between the singulated package and the substrate on which it was mounted.
[0004]
The present invention has been made for the purpose of solving the above-described problems in the prior art. That is, an object of the present invention is to provide a mask sheet capable of stably producing a semiconductor package such as QFN by suppressing wire bonding failure, protrusion of mold resin, adhesive residue of an adhesive during assembly of a semiconductor device. There is to do.
[0005]
[Means for Solving the Problems]
As a result of intensive studies, the present inventor has found that the above problem can be solved by preparing a mask sheet using a specific pressure-sensitive adhesive, and has completed the present invention.
That is, the mask sheet for assembling a semiconductor device of the present invention comprises a pressure-sensitive adhesive layer on a heat-resistant substrate, and the pressure-sensitive adhesive layer contains 5 to 50 parts by volume of filler with respect to 100 parts by volume of the pressure-sensitive adhesive. It is characterized by.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
The semiconductor device assembly mask sheet of the present invention (hereinafter abbreviated as “mask sheet”) is obtained by laminating an adhesive layer on a heat-resistant substrate serving as a support. When manufacturing a semiconductor device such as QFN, the mask sheet is exposed to an atmosphere of 150 to 250 ° C. in a die attach process, a wire bonding process, a resin sealing process, etc., and the linear expansion coefficient of the heat-resistant substrate increases rapidly. Therefore, the difference in thermal expansion from the lead frame made of metal increases. In that case, warpage occurs due to the difference in thermal expansion between the heat-resistant substrate and the lead frame when the temperature is returned to room temperature, and this causes warpage after the die attach process, which is a post-process resin. In the sealing process, the lead frame cannot be set on the positioning pins of the mold, and there is a problem that a misalignment is caused. Therefore, the linear expansion coefficient at 150 to 250 ° C. of the heat resistant substrate is preferably 5 to 50 ppm / ° C., particularly preferably 10 to 40 ppm / ° C.
[0007]
In addition, the mask sheet of the present invention is peeled off from the mold resin and the lead frame after the molding process, but in order to prevent the adhesive layer from remaining on the mold resin and the lead frame at that time, the heat resistant substrate and the adhesive layer It is preferable that Sa / Sb ≧ 1.5, where Sa is the adhesive strength between and the mold resin and the lead frame and the adhesive layer is Sb. When Sa / Sb is smaller than 1.5, the adhesive layer remains on the lead frame side when peeled, and adhesive residue tends to occur. Before forming the pressure-sensitive adhesive layer on the heat-resistant substrate, the adhesive strength between the heat-resistant substrate and the pressure-sensitive adhesive layer such as corona treatment, plasma treatment, and primer treatment on the surface of the heat-resistant substrate where the pressure-sensitive adhesive layer is provided It is preferable to perform in advance a process for increasing Sa.
Examples of such a heat-resistant substrate include a heat-resistant film and a metal foil.
When a heat resistant film is used as the heat resistant substrate, the glass transition temperature (hereinafter referred to as Tg) of the heat resistant film is used in order to prevent the problem of misalignment with the lead frame due to the difference in thermal expansion from the lead frame. (Abbreviated) is preferably 150 ° C. or higher. Specific examples of the heat resistant film satisfying these heat resistance include films of polyimide, polyamide, polyether sulfone, polyphenylene sulfide, polyether ketone, polyether ether ketone, triacetyl cellulose and the like.
[0008]
In addition, when a metal foil is used as a heat-resistant substrate, it is preferable because a problem caused by a difference in thermal expansion from the lead frame is less likely to occur. As such a metal foil, gold, silver, copper, platinum, aluminum, Magnesium, titanium, chromium, manganese, iron, cobalt, nickel, zinc, palladium, cadmium, indium, tin, lead, etc., and alloys based on these metals can be used, either rolled metal foil or electrolytic metal foil Good. Moreover, what plated these metals and alloys can also be used. Among these, copper foil is particularly preferable in order to satisfy the linear expansion coefficient. As the copper foil, an electrolytic copper foil is preferable because of particularly high adhesive strength with the pressure-sensitive adhesive layer, and it is preferable to provide the pressure-sensitive adhesive layer on the roughened surface side of the electrolytic copper foil.
[0009]
The linear expansion coefficient of the heat resistant substrate in the present invention can be determined as follows. That is, after the heat-resistant substrate is heated at 250 ° C. for 1 hour, the heated heat-resistant substrate is cut into 5 × 25 mm, and mounted on TMA (Thermal Mechanical AnnaryZer, manufactured by Vacuum Riko Co., Ltd .; TM9300). Next, the elongation of the sample when the temperature is increased from 150 to 250 ° C. at a temperature increase rate of 3 ° C./min with a load of 1 g can be obtained by the following formula.
Linear expansion coefficient = ΔL / L · Δt
[ΔL: Length of sample stretched (length at 250 ° C.−length at 150 ° C.), L: Original length of sample, Δt: Measurement temperature difference (250 ° C.-150 ° C.)]
[0010]
The pressure-sensitive adhesive layer in the mask sheet of the present invention is stable with little change in decomposition, deterioration, etc., with respect to the thermal history in the die attach process, wire bond process, and resin sealing process, as in the heat resistant substrate. It is necessary to have adhesive strength. Further, in order for the mask sheet to be peelable from the lead frame, the adhesive force of the pressure-sensitive adhesive layer on the mask sheet to the heat-resistant substrate needs to be larger than the adhesive force to the mold resin and the lead frame. The pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer satisfying such conditions may be an acrylic pressure-sensitive adhesive or a rubber-based pressure-sensitive adhesive mainly composed of natural rubber, SBR, or the like. It is preferable because it is excellent.
[0011]
Silicone adhesives are divided into organic peroxide curing types that use peroxides and addition reaction types that use platinum catalysts, depending on the type of curing reaction. Since a certain low molecular weight organic substance is generated and the lead frame is contaminated, an addition reaction type silicone adhesive is preferably used in the present invention. Specific examples of the silicone-based pressure-sensitive adhesive include those having polydimethylsiloxane as a main component and those having polyalkylalkenylsiloxane and polyalkylhydrogensiloxane as main components. Furthermore, for example, there can be mentioned those obtained by bonding a silicone raw rubber mainly composed of polyorganosiloxane and a silicone resin mainly composed of trimethylsiloxysilicic acid.
[0012]
Moreover, in this invention, 5-50 volume parts filler is contained in an adhesive layer with respect to 100 volume parts of adhesives. Furthermore, the content of the filler is preferably 10 to 40 parts by volume. When the content is less than 5 parts by volume, there is little improvement in the elastic modulus and adhesive force, so that wire bond failure and mold flash occur. On the other hand, when it exceeds 50 parts by volume, the cohesive force of the pressure-sensitive adhesive layer is lowered, the adhesive force is lowered, and mold flash occurs.
Examples of the filler include inorganic or organic fillers. Inorganic fillers include silica, alumina, titanium oxide, beryllium oxide, magnesium oxide, calcium carbonate, titanium nitride, silicon nitride, silicon nitride, titanium boride, tungsten boride, silicon carbide, titanium carbide, zirconium carbide, molybdenum carbide , Mica, zinc oxide, carbon black, aluminum hydroxide, calcium hydroxide, magnesium hydroxide, antimony trioxide or those whose surfaces are treated with a trimethylsiloxyl group, etc. , Polyamideimide, polyetheretherketone, polyetherimide, polyesterimide, nylon, silicone and the like. Among these fillers, silica is particularly preferable because it can control the elastic modulus of the pressure-sensitive adhesive and prevent the occurrence of wire bond failure and mold flash.
[0013]
The adhesive layer in the mask sheet of the present invention has an elastic modulus at 150 to 250 ° C. of 0.05 MPa or more, preferably 0.07 MPa or more, more preferably 0.1 MPa or more. When the pressure is lower than 0.05 MPa, there is a tendency that a connection failure of the gold wire occurs in the wire bonding step. The measurement of the elastic modulus in this case is a value measured with an elastic modulus measuring device (trade name: Leo Stress, manufactured by Haake Co., Ltd.) under the conditions of Examples described later.
[0014]
As a method of laminating the pressure-sensitive adhesive layer on the heat-resistant substrate, a method of casting by directly applying the pressure-sensitive adhesive solution on the heat-resistant substrate and drying, and once the pressure-sensitive adhesive solution on the release film A laminating method is used in which the pressure-sensitive adhesive layer that has been applied and dried is transferred onto a heat-resistant substrate. The thickness of the pressure-sensitive adhesive layer is preferably 3 to 30 μm.
[0015]
A protective film can be provided on the pressure-sensitive adhesive layer as necessary in order to protect it. As the protective film, a film having releasability, for example, a film of polyester, polyethylene, polypropylene, polyethylene terephthalate, or the like, and a film whose surface is subjected to a release treatment with a silicone resin or a fluorine compound can be used. The protective film is peeled off when attached to the lead frame.
[0016]
【Example】
EXAMPLES Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited by these Examples.
[Example 1]
(Preparation of adhesive layer forming coating solution)
Polyalkylalkenyl siloxane (trade name: TSR-1512, manufactured by GE Toshiba Silicone Co., Ltd., weight average molecular weight 500000, solid content concentration 60%) and polyalkyl hydrogen siloxane (trade name: CR-51 manufactured by GE Toshiba Silicone Co., Ltd., weight average molecular weight 1300) ) Was mixed at a weight ratio of 100: 1 to obtain an adhesive. Next, 20 parts by volume of silica (trade name: Nipsil LP, manufactured by Nippon Silica Kogyo Co., Ltd.) as a filler was added to 100 parts by volume of the above-mentioned pressure-sensitive adhesive, and dispersed with a sand mill to obtain a coating solution for forming a pressure-sensitive adhesive layer.
(Manufacture of mask sheet)
A polyimide film (thickness 25 μm) having a linear expansion coefficient of 16 ppm / ° C. at 490 ° C. and 150 to 250 ° C. is used as the heat-resistant substrate, and the pressure-sensitive adhesive layer-forming coating solution is dried thereon. It was applied to a thickness of 8 μm, dried at 160 ° C. for 15 minutes, and then cured at 140 ° C. for 24 hours to obtain a mask sheet of the present invention.
[0017]
[Example 2]
(Preparation of adhesive layer forming coating solution)
Polyalkylalkenyl siloxane (trade name: TSR-1512, manufactured by GE Toshiba Silicone Co., Ltd., weight average molecular weight 500000, solid content concentration 60%) and polyalkyl hydrogen siloxane (trade name: CR-51 manufactured by GE Toshiba Silicone Co., Ltd., weight average molecular weight 1300) ) Was mixed at a weight ratio of 100: 1 to obtain an adhesive. Next, 20 parts by volume of alumina as a filler was added to 100 parts by volume of the above-mentioned pressure-sensitive adhesive, and dispersed with a sand mill to obtain a coating solution for forming a pressure-sensitive adhesive layer.
(Manufacture of mask sheet)
A polyimide film (thickness 25 μm) having a linear expansion coefficient of 16 ppm / ° C. at 490 ° C. and 150 to 250 ° C. is used as the heat-resistant substrate, and the pressure-sensitive adhesive layer-forming coating solution is dried thereon. It was applied to a thickness of 8 μm, dried at 160 ° C. for 15 minutes, and then cured at 140 ° C. for 24 hours to obtain a mask sheet of the present invention.
[0018]
[Example 3]
(Preparation of adhesive layer forming coating solution)
Polyalkylalkenyl siloxane (trade name: TSR-1512, manufactured by GE Toshiba Silicone Co., Ltd., weight average molecular weight 500000, solid content concentration 60%) and polyalkyl hydrogen siloxane (trade name: CR-51 manufactured by GE Toshiba Silicone Co., Ltd., weight average molecular weight 1300) ) Was mixed at a weight ratio of 100: 1 to obtain an adhesive. Next, 20 parts by volume of silica (trade name: Nipsil LP, manufactured by Nippon Silica Kogyo Co., Ltd.) as a filler was added to 100 parts by volume of the above-mentioned pressure-sensitive adhesive, and dispersed with a sand mill to obtain a coating solution for forming a pressure-sensitive adhesive layer.
(Manufacture of mask sheet)
3/4 oz electrolytic copper foil (trade name: 3EC-VLP, manufactured by Mitsui Kinzoku Mining Co., Ltd., thickness: 25 μm) was used as the heat-resistant substrate, and the adhesive layer was placed on the roughened surface side of the electrolytic copper foil. The forming coating solution was applied so that the thickness after drying was 8 μm, dried at 160 ° C. for 15 minutes, and then cured at 140 ° C. for 24 hours to obtain a mask sheet of the present invention.
[0019]
[Comparative Example 1]
A mask sheet for comparison was obtained in the same manner as in Example 1 except that no filler was contained.
[0020]
[Comparative Example 2]
(Preparation of adhesive layer forming coating solution)
Epoxy resin (Dainippon Ink Co., Ltd., trade name: Epicron HP-7200), Epoxy curing agent (Nippon Kayaku Co., Ltd., trade name: Kayahard TPM), Acrylonitrile-butadiene copolymer (Nihon Synthetic Rubber Co., Ltd., trade name: PNR- 1H) was mixed at a weight ratio of 45:15:40 to obtain a coating solution for forming an adhesive layer containing no filler.
(Manufacture of mask sheet)
A polyimide film (thickness 25 μm) having a linear expansion coefficient of 16 ppm / ° C. at 490 ° C. and 150 to 250 ° C. is used as the heat-resistant substrate, and the pressure-sensitive adhesive layer-forming coating solution is dried thereon. The film was applied to a thickness of 8 μm and dried at 130 ° C. for 5 minutes to prepare a comparative mask sheet.
[0021]
[Comparative Example 3]
A mask sheet for comparison was obtained in the same manner as in Example 1 except that the filler content was 55 parts by volume with respect to 100 parts by volume of the adhesive.
[0022]
Next, the mask sheets prepared in Examples 1 to 3 and Comparative Examples 1 to 3 were evaluated as follows.
[Measurement of elastic modulus]
The adhesive layer forming coating solutions obtained in Examples 1 to 3 and Comparative Examples 1 to 3 were coated on a releasable film, dried under the same drying conditions as in the above Examples and Comparative Examples, and then 1 mm in thickness. It laminated | stacked so that it might become, and obtained the adhesive layer. Next, it heat-processed for 2 hours at 175 degreeC which is the adhesion conditions of a die-attach process. The sample was cut to 7 mmφ, and the release film was peeled off. Then, the frequency was 1 Hz, the heating rate was 3 ° C./min, and the temperature range was 150 to 300 using an elastic modulus measuring device (trade name: rheostress manufactured by Haake). It measured on the conditions of (degreeC) and load: 10N.
[0023]
[Measurement of adhesive strength]
The mask sheets prepared in Examples 1 to 3 and Comparative Examples 1 to 3 were cut to a width of 1 cm, a copper material (trade name: MF-202 manufactured by Mitsubishi Metex), and a gold-plated 50 mm × 100 mm × 0.25 mmt flat plate Crimped to. And the adhesive force when one side was peeled off to the 90 degree direction with respect to the flat plate about the sample crimped | bonded in 180 degreeC atmosphere was measured. In this case, the adhesive force to the copper material that is practically required is 10 g / cm or more regardless of the presence or absence of gold plating.
[0024]
[Wire bond]
The QFN lead frame (Au-Pd-Ni plated Cu lead frame of 4 × 16, 64 matrix arrangement, package) with the mask sheets prepared in Examples 1 to 3 and Comparative Examples 1 to 3 having an outer size of 200 × 60 mm (Size 10 × 10 mm, 84 pins). Then, an aluminum vapor-deposited dummy chip (3 mm square, thickness 0.4 mm) was bonded to the die pad part of the lead frame with an epoxy die attach material, and the temperature: 210 ° C., frequency with a wire bonder (trade name: FB131, manufactured by Kaijo Corporation) : 100 kHz, load: 150 gf, time: 10 msec / pin Under the conditions of the lead pin tip and the dummy chip, the number of defective connections on the lead side was confirmed.
[0025]
[Mold flash]
The wire-bonded lead frame was transfer molded (molded) with an epoxy mold resin (biphenyl epoxy, filler amount: 88 wt%) under the conditions of temperature: 180 ° C., pressure: 10 MPa, time: 3 minutes. Thereafter, the mask sheet surface was observed with a microscope, and the number of packages in which the molding material leaked to the lead pins and die pads was measured.
[0026]
[Table 1]

[0027]
The elastic modulus in Table 1 indicates the minimum value of the elastic modulus at 150 to 250 ° C., and the wire bond indicates the number of defective connections generated when wire bonding is performed with the chip for 84 lead pins for one package. The flash indicates the number of defects in 64 packages due to mold resin leakage.
As is clear from Table 1, the mask sheet of the present invention has a strong adhesive force to a copper material regardless of the presence or absence of gold plating, and there was no problem with the evaluation in wire bonding or mold flash. Further, even if the mask sheet was peeled from the lead frame and the mold resin, no adhesive residue was generated on the lead frame and the mold resin. On the other hand, in all of Comparative Examples 1 to 3, the adhesive strength with respect to copper and gold plating was weak, and connection failure in wire bonding and mold resin leakage in mold flash occurred.
[0028]
【The invention's effect】
The mask sheet of the present invention is excellent in heat resistance, has almost no defect because of its high elastic modulus at the time of wire bonding, and prevents the resin leakage at the time of mold sealing due to the strong adhesive force of the adhesive layer at the time of molding. I can do things. In addition, the pressure-sensitive adhesive layer contains a large amount of polymer resin, and the pressure-sensitive adhesive layer has a strong cohesive force and hardly generates adhesive residue at the time of peeling. Therefore, it is suitable as a mask sheet for a QFN type semiconductor device.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a state in which a mask sheet is attached to a lead frame.
FIG. 2 is a cross-sectional view showing a state in which semiconductor chips are mounted and connected by gold wires.
FIG. 3 is a cross-sectional view showing a resin-sealed state.
FIG. 4 is a cross-sectional view showing a state where a mask sheet is peeled off.
FIG. 5 is a cross-sectional view showing a state where a semiconductor device is separated into pieces.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Lead frame 2 Adhesive layer 3 Heat resistant base material 4 Gold wire 5 Semiconductor chip 6 Mold resin

Claims (8)

A pressure-sensitive adhesive layer is provided on a heat-resistant substrate, and the pressure-sensitive adhesive layer contains 5 to 50 parts by volume of filler with respect to 100 parts by volume of the pressure-sensitive adhesive. Mask sheet for semiconductor device assembly. 2. The mask sheet for assembling a semiconductor device according to claim 1, wherein a linear expansion coefficient of the heat-resistant substrate at 150 to 250 ° C. is 5 to 50 ppm / ° C. 3. The mask sheet for assembling a semiconductor device according to claim 1, wherein the heat resistant substrate is a heat resistant film, and the glass transition temperature of the heat resistant film is 150 ° C. or higher. The mask sheet for assembling a semiconductor device according to claim 1, wherein the heat-resistant substrate is a metal foil. 2. The mask sheet for assembling a semiconductor device according to claim 1, wherein the heat-resistant substrate is an electrolytic copper foil having a roughened surface, and an adhesive layer is provided on the roughened surface side. The mask sheet for assembling a semiconductor device according to claim 1, wherein the filler is silica. 2. The mask sheet for assembling a semiconductor device according to claim 1, wherein the adhesive layer has an elastic modulus at 150 to 250 [deg.] C. of 0.05 MPa or more. The mask sheet for assembling a semiconductor device according to claim 1, wherein the pressure-sensitive adhesive layer has a thickness of 3 to 30 μm.

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