KR101814925B1 - 점착 테이프의 접착 장치 - Google Patents

점착 테이프의 접착 장치 Download PDF

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Publication number
KR101814925B1
KR101814925B1 KR1020160086048A KR20160086048A KR101814925B1 KR 101814925 B1 KR101814925 B1 KR 101814925B1 KR 1020160086048 A KR1020160086048 A KR 1020160086048A KR 20160086048 A KR20160086048 A KR 20160086048A KR 101814925 B1 KR101814925 B1 KR 101814925B1
Authority
KR
South Korea
Prior art keywords
tape
adhesive
adhesive tape
release
adhered
Prior art date
Application number
KR1020160086048A
Other languages
English (en)
Korean (ko)
Other versions
KR20170006284A (ko
Inventor
게이고우 히로세
Original Assignee
시바우라 메카트로닉스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 시바우라 메카트로닉스 가부시끼가이샤 filed Critical 시바우라 메카트로닉스 가부시끼가이샤
Publication of KR20170006284A publication Critical patent/KR20170006284A/ko
Application granted granted Critical
Publication of KR101814925B1 publication Critical patent/KR101814925B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
    • B65H35/04—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with transverse cutters or perforators
    • B65H35/06—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with transverse cutters or perforators from or with blade, e.g. shear-blade, cutters or perforators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/048—Registering, tensioning, smoothing or guiding webs longitudinally by positively actuated movable bars or rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/26—Registering, tensioning, smoothing or guiding webs longitudinally by transverse stationary or adjustable bars or rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/002—Web delivery apparatus, the web serving as support for articles, material or another web
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/04—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching or stapling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H01L21/603—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of pressure, e.g. thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/50—Auxiliary process performed during handling process
    • B65H2301/51—Modifying a characteristic of handled material
    • B65H2301/516—Securing handled material to another material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/11—Dimensional aspect of article or web
    • B65H2701/113—Size
    • B65H2701/1133—Size of webs
    • B65H2701/11332—Size of webs strip, tape, narrow web
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/30—Handled filamentary material
    • B65H2701/37—Tapes
    • B65H2701/377—Adhesive tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tape Dispensing Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Coating Apparatus (AREA)
KR1020160086048A 2015-07-07 2016-07-07 점착 테이프의 접착 장치 KR101814925B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015136428 2015-07-07
JPJP-P-2015-136428 2015-07-07
JP2016132723A JP6577915B2 (ja) 2015-07-07 2016-07-04 粘着テープの貼着装置
JPJP-P-2016-132723 2016-07-04

Publications (2)

Publication Number Publication Date
KR20170006284A KR20170006284A (ko) 2017-01-17
KR101814925B1 true KR101814925B1 (ko) 2018-01-04

Family

ID=57826955

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160086048A KR101814925B1 (ko) 2015-07-07 2016-07-07 점착 테이프의 접착 장치

Country Status (4)

Country Link
JP (1) JP6577915B2 (zh)
KR (1) KR101814925B1 (zh)
CN (1) CN106335814B (zh)
TW (1) TWI608458B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109795737B (zh) * 2017-11-17 2021-08-17 陈子忠 电子元件的包装与涂布粘剂于载带上的并行方法及其机构
US20200411466A1 (en) * 2018-03-12 2020-12-31 Sakai Display Products Corporation Thermocompression bonding device
JP7175647B2 (ja) * 2018-06-28 2022-11-21 芝浦メカトロニクス株式会社 粘着テープの貼着装置及び粘着テープの貼着方法
CN110329835B (zh) * 2019-06-27 2024-04-05 深圳市世椿智能装备股份有限公司 一种单面胶自动贴胶机
KR20220160589A (ko) 2020-03-31 2022-12-06 닛토덴코 가부시키가이샤 사상 점착제 첩부 장치 및 사상 점착제 첩부 방법
CN115335307A (zh) 2020-03-31 2022-11-11 日东电工株式会社 丝状粘合剂贴附装置及丝状粘合剂贴附方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000057660A (ja) * 1998-08-10 2000-02-25 Sony Corp テープガイド装置
JP3409560B2 (ja) * 1996-02-16 2003-05-26 松下電器産業株式会社 異方性導電テープの貼着装置
KR100966168B1 (ko) * 2004-09-30 2010-06-25 시바우라 메카트로닉스 가부시키가이샤 접착막 테이프 이송기구

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07270742A (ja) 1994-03-30 1995-10-20 Matsushita Electric Ind Co Ltd テープ圧着装置
JPH08187996A (ja) * 1995-01-09 1996-07-23 General Kk 転写具
JP3773751B2 (ja) * 2000-04-11 2006-05-10 松下電器産業株式会社 粘着テープ貼付装置及び部品実装機とディスプレイパネル
JP2003206067A (ja) * 2001-11-12 2003-07-22 Eijiro Namekawa 粘着テープカッター
JP3704502B2 (ja) * 2002-01-15 2005-10-12 松下電器産業株式会社 粘着シート貼付装置、粘着シート貼付方法、部品実装機、及びディスププレイパネルの製造方法。
CN2661658Y (zh) * 2003-11-05 2004-12-08 盛健安 胶带粘贴装置
JP4375040B2 (ja) * 2004-02-12 2009-12-02 セイコーエプソン株式会社 テープ印刷装置およびテープ印刷方法
JP4317122B2 (ja) * 2004-12-22 2009-08-19 芝浦メカトロニクス株式会社 接着膜貼付装置
JP4868591B2 (ja) * 2007-02-23 2012-02-01 株式会社タカトリ 基板へのテープの貼付方法及び装置
JP4976320B2 (ja) * 2008-02-25 2012-07-18 日東電工株式会社 粘着テープ貼付け装置
JP2011048062A (ja) * 2009-08-26 2011-03-10 Shibaura Mechatronics Corp 粘着テープの貼着装置及び貼着方法
JP2011138041A (ja) * 2009-12-28 2011-07-14 Hitachi High-Technologies Corp Ａｃｆ貼付装置
JP5833959B2 (ja) * 2011-09-28 2015-12-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP5996241B2 (ja) * 2012-04-12 2016-09-21 デクセリアルズ株式会社 接着フィルムの貼着装置、接着フィルムの貼着方法、及び接続構造体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3409560B2 (ja) * 1996-02-16 2003-05-26 松下電器産業株式会社 異方性導電テープの貼着装置
JP2000057660A (ja) * 1998-08-10 2000-02-25 Sony Corp テープガイド装置
KR100966168B1 (ko) * 2004-09-30 2010-06-25 시바우라 메카트로닉스 가부시키가이샤 접착막 테이프 이송기구

Also Published As

Publication number Publication date
CN106335814A (zh) 2017-01-18
TW201715492A (zh) 2017-05-01
CN106335814B (zh) 2017-09-15
KR20170006284A (ko) 2017-01-17
JP2017021347A (ja) 2017-01-26
JP6577915B2 (ja) 2019-09-18
TWI608458B (zh) 2017-12-11

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