JP6577915B2 - 粘着テープの貼着装置 - Google Patents

粘着テープの貼着装置 Download PDF

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Publication number
JP6577915B2
JP6577915B2 JP2016132723A JP2016132723A JP6577915B2 JP 6577915 B2 JP6577915 B2 JP 6577915B2 JP 2016132723 A JP2016132723 A JP 2016132723A JP 2016132723 A JP2016132723 A JP 2016132723A JP 6577915 B2 JP6577915 B2 JP 6577915B2
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JP
Japan
Prior art keywords
tape
adhesive tape
sticking
release
shaped member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016132723A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017021347A5 (zh
JP2017021347A (ja
Inventor
圭剛 広瀬
圭剛 広瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to KR1020160086048A priority Critical patent/KR101814925B1/ko
Publication of JP2017021347A publication Critical patent/JP2017021347A/ja
Publication of JP2017021347A5 publication Critical patent/JP2017021347A5/ja
Application granted granted Critical
Publication of JP6577915B2 publication Critical patent/JP6577915B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
    • B65H35/04—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with transverse cutters or perforators
    • B65H35/06—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with transverse cutters or perforators from or with blade, e.g. shear-blade, cutters or perforators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/048—Registering, tensioning, smoothing or guiding webs longitudinally by positively actuated movable bars or rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/26—Registering, tensioning, smoothing or guiding webs longitudinally by transverse stationary or adjustable bars or rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/002—Web delivery apparatus, the web serving as support for articles, material or another web
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/04—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching or stapling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H01L21/603—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of pressure, e.g. thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/50—Auxiliary process performed during handling process
    • B65H2301/51—Modifying a characteristic of handled material
    • B65H2301/516—Securing handled material to another material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/11—Dimensional aspect of article or web
    • B65H2701/113—Size
    • B65H2701/1133—Size of webs
    • B65H2701/11332—Size of webs strip, tape, narrow web
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/30—Handled filamentary material
    • B65H2701/37—Tapes
    • B65H2701/377—Adhesive tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tape Dispensing Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Coating Apparatus (AREA)
JP2016132723A 2015-07-07 2016-07-04 粘着テープの貼着装置 Active JP6577915B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020160086048A KR101814925B1 (ko) 2015-07-07 2016-07-07 점착 테이프의 접착 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015136428 2015-07-07
JP2015136428 2015-07-07

Publications (3)

Publication Number Publication Date
JP2017021347A JP2017021347A (ja) 2017-01-26
JP2017021347A5 JP2017021347A5 (zh) 2018-02-08
JP6577915B2 true JP6577915B2 (ja) 2019-09-18

Family

ID=57826955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016132723A Active JP6577915B2 (ja) 2015-07-07 2016-07-04 粘着テープの貼着装置

Country Status (4)

Country Link
JP (1) JP6577915B2 (zh)
KR (1) KR101814925B1 (zh)
CN (1) CN106335814B (zh)
TW (1) TWI608458B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220160589A (ko) 2020-03-31 2022-12-06 닛토덴코 가부시키가이샤 사상 점착제 첩부 장치 및 사상 점착제 첩부 방법
KR20220160587A (ko) 2020-03-31 2022-12-06 닛토덴코 가부시키가이샤 사상 점착제 첩부 장치 및 사상 점착제 첩부 방법

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109795737B (zh) * 2017-11-17 2021-08-17 陈子忠 电子元件的包装与涂布粘剂于载带上的并行方法及其机构
CN111801720A (zh) * 2018-03-12 2020-10-20 堺显示器制品株式会社 热压接装置
JP7175647B2 (ja) * 2018-06-28 2022-11-21 芝浦メカトロニクス株式会社 粘着テープの貼着装置及び粘着テープの貼着方法
CN110329835B (zh) * 2019-06-27 2024-04-05 深圳市世椿智能装备股份有限公司 一种单面胶自动贴胶机

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07270742A (ja) 1994-03-30 1995-10-20 Matsushita Electric Ind Co Ltd テープ圧着装置
JPH08187996A (ja) * 1995-01-09 1996-07-23 General Kk 転写具
JP3409560B2 (ja) * 1996-02-16 2003-05-26 松下電器産業株式会社 異方性導電テープの貼着装置
JP2000057660A (ja) * 1998-08-10 2000-02-25 Sony Corp テープガイド装置
JP3773751B2 (ja) * 2000-04-11 2006-05-10 松下電器産業株式会社 粘着テープ貼付装置及び部品実装機とディスプレイパネル
JP2003206067A (ja) * 2001-11-12 2003-07-22 Eijiro Namekawa 粘着テープカッター
JP3704502B2 (ja) * 2002-01-15 2005-10-12 松下電器産業株式会社 粘着シート貼付装置、粘着シート貼付方法、部品実装機、及びディスププレイパネルの製造方法。
CN2661658Y (zh) * 2003-11-05 2004-12-08 盛健安 胶带粘贴装置
JP4375040B2 (ja) * 2004-02-12 2009-12-02 セイコーエプソン株式会社 テープ印刷装置およびテープ印刷方法
KR100954242B1 (ko) * 2004-09-30 2010-04-23 시바우라 메카트로닉스 가부시키가이샤 접착막 첩부장치 및 접착막 테이프 이송기구
JP4317122B2 (ja) * 2004-12-22 2009-08-19 芝浦メカトロニクス株式会社 接着膜貼付装置
JP4868591B2 (ja) * 2007-02-23 2012-02-01 株式会社タカトリ 基板へのテープの貼付方法及び装置
JP4976320B2 (ja) * 2008-02-25 2012-07-18 日東電工株式会社 粘着テープ貼付け装置
JP2011048062A (ja) * 2009-08-26 2011-03-10 Shibaura Mechatronics Corp 粘着テープの貼着装置及び貼着方法
JP2011138041A (ja) * 2009-12-28 2011-07-14 Hitachi High-Technologies Corp Ａｃｆ貼付装置
JP5833959B2 (ja) * 2011-09-28 2015-12-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP5996241B2 (ja) * 2012-04-12 2016-09-21 デクセリアルズ株式会社 接着フィルムの貼着装置、接着フィルムの貼着方法、及び接続構造体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220160589A (ko) 2020-03-31 2022-12-06 닛토덴코 가부시키가이샤 사상 점착제 첩부 장치 및 사상 점착제 첩부 방법
KR20220160587A (ko) 2020-03-31 2022-12-06 닛토덴코 가부시키가이샤 사상 점착제 첩부 장치 및 사상 점착제 첩부 방법

Also Published As

Publication number Publication date
CN106335814A (zh) 2017-01-18
KR101814925B1 (ko) 2018-01-04
TWI608458B (zh) 2017-12-11
TW201715492A (zh) 2017-05-01
KR20170006284A (ko) 2017-01-17
CN106335814B (zh) 2017-09-15
JP2017021347A (ja) 2017-01-26

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