KR101799598B1 - 쿨런트 회수 방법 - Google Patents

쿨런트 회수 방법 Download PDF

Info

Publication number
KR101799598B1
KR101799598B1 KR1020110058125A KR20110058125A KR101799598B1 KR 101799598 B1 KR101799598 B1 KR 101799598B1 KR 1020110058125 A KR1020110058125 A KR 1020110058125A KR 20110058125 A KR20110058125 A KR 20110058125A KR 101799598 B1 KR101799598 B1 KR 101799598B1
Authority
KR
South Korea
Prior art keywords
coolant
filtration
thickener
ingot
ceramic film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020110058125A
Other languages
English (en)
Korean (ko)
Other versions
KR20120000502A (ko
Inventor
히데오 아마이케
신이티 고사카
가투후미 구보타
Original Assignee
엔지케이 인슐레이터 엘티디
엔지케이 필테크 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엔지케이 인슐레이터 엘티디, 엔지케이 필테크 가부시키가이샤 filed Critical 엔지케이 인슐레이터 엘티디
Publication of KR20120000502A publication Critical patent/KR20120000502A/ko
Application granted granted Critical
Publication of KR101799598B1 publication Critical patent/KR101799598B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
KR1020110058125A 2010-06-25 2011-06-15 쿨런트 회수 방법 Active KR101799598B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010144448A JP5640260B2 (ja) 2010-06-25 2010-06-25 クーラント回収方法
JPJP-P-2010-144448 2010-06-25

Publications (2)

Publication Number Publication Date
KR20120000502A KR20120000502A (ko) 2012-01-02
KR101799598B1 true KR101799598B1 (ko) 2017-11-20

Family

ID=45355551

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110058125A Active KR101799598B1 (ko) 2010-06-25 2011-06-15 쿨런트 회수 방법

Country Status (4)

Country Link
JP (1) JP5640260B2 (https=)
KR (1) KR101799598B1 (https=)
CN (1) CN102294758B (https=)
TW (1) TWI501838B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013248707A (ja) * 2012-05-31 2013-12-12 Panasonic Corp クーラント廃液の再生方法、クーラント廃液の処理方法、クーラント廃液の処理システム、及び再生クーラント液の製造方法
JP6331474B2 (ja) * 2014-02-28 2018-05-30 ブラザー工業株式会社 工作機械の洗浄液濾過装置
CN105174522B (zh) * 2015-10-09 2017-11-17 浙江瑞翌新材料科技股份有限公司 一种金刚线切割废冷却液的回收方法及系统
CN117774150A (zh) 2022-09-22 2024-03-29 内蒙古中环光伏材料有限公司 一种去除硅单晶金刚线切片用冷却液中硅粉的方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100441648B1 (ko) * 1996-02-21 2004-10-06 미마스 한도타이 고교 가부시키가이샤 수용성슬러리폐액의재이용시스템
WO2010071873A2 (en) * 2008-12-20 2010-06-24 Cabot Microelectronics Corporation Wiresaw cutting method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5664990A (en) * 1996-07-29 1997-09-09 Integrated Process Equipment Corp. Slurry recycling in CMP apparatus
JP3816200B2 (ja) * 1997-07-18 2006-08-30 東芝セラミックス株式会社 微細粒子を含む液体の処理方法および処理装置
JP3389141B2 (ja) * 1999-04-26 2003-03-24 株式会社スーパーシリコン研究所 スライシング用スラリーの評価方法及びスラリー
JP3314921B2 (ja) * 1999-06-08 2002-08-19 三菱住友シリコン株式会社 半導体材料の切断・加工方法
JP4369054B2 (ja) * 1999-07-01 2009-11-18 エムイーエムシー・エレクトロニック・マテリアルズ・ソシエタ・ペル・アチオニ 使用済グリコール系スラリーの分離、再生および再使用法
JP4609675B2 (ja) * 2007-08-16 2011-01-12 オルガノ株式会社 メタル研磨cmp工程排水処理装置及び方法
JP5173945B2 (ja) * 2008-07-02 2013-04-03 シャープ株式会社 クーラント再生方法およびスラリー再生方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100441648B1 (ko) * 1996-02-21 2004-10-06 미마스 한도타이 고교 가부시키가이샤 수용성슬러리폐액의재이용시스템
WO2010071873A2 (en) * 2008-12-20 2010-06-24 Cabot Microelectronics Corporation Wiresaw cutting method

Also Published As

Publication number Publication date
CN102294758A (zh) 2011-12-28
JP5640260B2 (ja) 2014-12-17
TWI501838B (zh) 2015-10-01
CN102294758B (zh) 2015-08-05
KR20120000502A (ko) 2012-01-02
TW201208814A (en) 2012-03-01
JP2012006115A (ja) 2012-01-12

Similar Documents

Publication Publication Date Title
US8056551B2 (en) Method and system for manufacturing wafer-like slices from a substrate material
KR20010071680A (ko) 소모된 글리콜-기재의 슬러리를 분리, 재생, 및재사용하기 위한 방법
KR101799598B1 (ko) 쿨런트 회수 방법
KR101019032B1 (ko) 웨이퍼 가공폐수 처리장치 및 처리방법
JP5261090B2 (ja) シリコン含有排水の処理方法及び装置
EP2094441B1 (en) Process and apparatus for treating exhausted abrasive slurries from the lapping process for the recovery of their reusable abrasive component
KR20140001954A (ko) 연마제의 회수방법 및 연마제의 회수장치
JP2013066994A (ja) クーラント再生方法
US12195342B2 (en) Treatment process for recycling silicon ingot cutting waste
JP6085500B2 (ja) ワイヤソースラリのクーラント回収装置
WO2007097046A1 (ja) シリコン粒子の処理方法及び装置
JP5941995B2 (ja) クーラント再生方法、及びクーラント再生装置
JP2013004896A (ja) 使用済み冷却液の回収方法及び回収装置
JP2013237130A (ja) クーラントを回収する方法
JP2000288935A (ja) 非コロイド状研磨材の回収方法及び装置
JP2001121421A (ja) 用水回収装置
CN101244847B (zh) 废水处理系统和方法
JP2005334992A (ja) 廃液処理装置及び廃液処理方法、半導体装置の製造システム
CN223837215U (zh) 一种半导体芯片生产制造中研磨切割液废水再利用装置
JPH11138162A (ja) 研磨排水処理装置
JP2014189448A (ja) 固定砥粒方式による廃液からの金属シリコン及び冷却剤の回収方法
TWI546160B (zh) 冷卻劑再生方法
JP2013248707A (ja) クーラント廃液の再生方法、クーラント廃液の処理方法、クーラント廃液の処理システム、及び再生クーラント液の製造方法
JP2014189449A (ja) 脱水ケーキの製造方法
JP2010260730A (ja) シリコンスラッジの濃縮、洗浄方法

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

A201 Request for examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20201029

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20211027

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20221017

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

R11 Change to the name of applicant or owner or transfer of ownership requested

Free format text: ST27 STATUS EVENT CODE: A-5-5-R10-R11-ASN-PN2301 (AS PROVIDED BY THE NATIONAL OFFICE)

R13 Change to the name of applicant or owner recorded

Free format text: ST27 STATUS EVENT CODE: A-5-5-R10-R13-ASN-PN2301 (AS PROVIDED BY THE NATIONAL OFFICE)