KR101793366B1 - 본딩 장치 및 본딩 방법 - Google Patents

본딩 장치 및 본딩 방법 Download PDF

Info

Publication number
KR101793366B1
KR101793366B1 KR1020160024620A KR20160024620A KR101793366B1 KR 101793366 B1 KR101793366 B1 KR 101793366B1 KR 1020160024620 A KR1020160024620 A KR 1020160024620A KR 20160024620 A KR20160024620 A KR 20160024620A KR 101793366 B1 KR101793366 B1 KR 101793366B1
Authority
KR
South Korea
Prior art keywords
die
imaging
pick
detecting
reference mark
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020160024620A
Other languages
English (en)
Korean (ko)
Other versions
KR20160110110A (ko
Inventor
히로시 마끼
히데아끼 사까모또
게이따 야마모또
Original Assignee
파스포드 테크놀로지 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 파스포드 테크놀로지 주식회사 filed Critical 파스포드 테크놀로지 주식회사
Publication of KR20160110110A publication Critical patent/KR20160110110A/ko
Application granted granted Critical
Publication of KR101793366B1 publication Critical patent/KR101793366B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020160024620A 2015-03-11 2016-02-29 본딩 장치 및 본딩 방법 Active KR101793366B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2015-048178 2015-03-11
JP2015048178A JP6510838B2 (ja) 2015-03-11 2015-03-11 ボンディング装置及びボンディング方法

Publications (2)

Publication Number Publication Date
KR20160110110A KR20160110110A (ko) 2016-09-21
KR101793366B1 true KR101793366B1 (ko) 2017-11-02

Family

ID=56984120

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160024620A Active KR101793366B1 (ko) 2015-03-11 2016-02-29 본딩 장치 및 본딩 방법

Country Status (4)

Country Link
JP (1) JP6510838B2 (enExample)
KR (1) KR101793366B1 (enExample)
CN (1) CN105977184B (enExample)
TW (1) TWI647767B (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6316340B2 (ja) * 2016-06-02 2018-04-25 株式会社カイジョー ボンディング装置、ボンディング方法及びボンディング制御プログラム
JP6705727B2 (ja) * 2016-09-26 2020-06-03 ファスフォードテクノロジ株式会社 フリップチップボンダおよび半導体装置の製造方法
US11031367B2 (en) * 2016-10-25 2021-06-08 Kulicke and Soffa Industries, In. Bond head assemblies including reflective optical elements, related bonding machines, and related methods
CN106373914B (zh) * 2016-11-10 2020-03-24 北京中电科电子装备有限公司 一种芯片键合装置
TWI662638B (zh) * 2017-04-21 2019-06-11 台灣愛司帝科技股份有限公司 半導體晶片修補方法以及半導體晶片修補裝置
JP7164314B2 (ja) 2017-04-28 2022-11-01 ベシ スウィッツァーランド エージー 部品を基板上に搭載する装置及び方法
KR102408524B1 (ko) * 2017-09-19 2022-06-14 삼성디스플레이 주식회사 표시 장치의 제조 장치 및 표시 장치의 제조 방법
JP7033878B2 (ja) * 2017-10-16 2022-03-11 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP7018341B2 (ja) 2018-03-26 2022-02-10 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
US11031368B2 (en) * 2018-05-14 2021-06-08 Panasonic Intellectual Property Management Co., Ltd. Bonding apparatus
US10861819B1 (en) * 2019-07-05 2020-12-08 Asm Technology Singapore Pte Ltd High-precision bond head positioning method and apparatus
JP7291586B2 (ja) * 2019-09-19 2023-06-15 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
KR102350557B1 (ko) * 2020-03-06 2022-01-14 세메스 주식회사 다이 본딩 방법 및 다이 본딩 장치
TWI792785B (zh) * 2020-12-31 2023-02-11 南韓商Ｔｅｓ股份有限公司 基板接合裝置及基板接合方法
KR102822141B1 (ko) 2021-09-24 2025-06-18 삼성전자주식회사 정렬 검사용 광학 어셈블리, 이를 포함한 광학 장치, 다이 본딩 시스템 및 이를 이용한 다이 본딩 방법
WO2023181346A1 (ja) * 2022-03-25 2023-09-28 株式会社Fuji 検査支援装置、生産管理システム、および検査支援方法
JP7292463B1 (ja) * 2022-03-29 2023-06-16 キヤノンマシナリー株式会社 位置合わせ装置、位置合わせ方法、ボンディング装置、ボンディング方法、および半導体装置製造方法
JPWO2024161507A1 (enExample) * 2023-01-31 2024-08-08

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000252303A (ja) * 1999-02-26 2000-09-14 Shibaura Mechatronics Corp ペレットボンディング方法
KR101303024B1 (ko) * 2012-02-23 2013-09-03 한미반도체 주식회사 플립칩 본딩장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1072398C (zh) * 1997-03-26 2001-10-03 财团法人工业技术研究院 芯片接合方法与装置
JP2003092313A (ja) * 2001-09-19 2003-03-28 Nec Machinery Corp チップ反転装置およびダイボンダ
JP2003249797A (ja) * 2002-02-25 2003-09-05 Toray Eng Co Ltd 実装装置および実装装置におけるアライメント方法
JP2007115851A (ja) * 2005-10-19 2007-05-10 Toshiba Corp 半導体部品の位置検査方法、位置検査装置および半導体装置の製造方法
CH698334B1 (de) * 2007-10-09 2011-07-29 Esec Ag Verfahren für die Entnahme und Montage von auf einem Wafertisch bereitgestellten Halbleiterchips auf einem Substrat.
JP5989313B2 (ja) * 2011-09-15 2016-09-07 ファスフォードテクノロジ株式会社 ダイボンダ及びボンディング方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000252303A (ja) * 1999-02-26 2000-09-14 Shibaura Mechatronics Corp ペレットボンディング方法
KR101303024B1 (ko) * 2012-02-23 2013-09-03 한미반도체 주식회사 플립칩 본딩장치

Also Published As

Publication number Publication date
TW201701379A (zh) 2017-01-01
JP2016171107A (ja) 2016-09-23
TWI647767B (zh) 2019-01-11
KR20160110110A (ko) 2016-09-21
JP6510838B2 (ja) 2019-05-08
CN105977184A (zh) 2016-09-28
CN105977184B (zh) 2019-02-15

Similar Documents

Publication Publication Date Title
KR101793366B1 (ko) 본딩 장치 및 본딩 방법
JP6470088B2 (ja) ボンディング装置及びボンディング方法
KR101353685B1 (ko) 다이 본더 및 반도체 제조 방법
JP7018341B2 (ja) ダイボンディング装置および半導体装置の製造方法
JP6510837B2 (ja) ボンディング装置及びボンディング方法
US20130055541A1 (en) Workpiece transfer apparatus, workpiece mounting apparatus and workpiece mounting method
KR20140022582A (ko) 플립칩 본딩장치 및 본딩장치의 교정방법
JP4596422B2 (ja) ダイボンダ用撮像装置
JP6438826B2 (ja) ボンディング装置及びボンディング方法
US20220181181A1 (en) Semiconductor manufacturing apparatus, method of reading position of carrier, and method of attaching semiconductor die on carrier using semiconductor manufacturing apparatus
JP6411663B2 (ja) 部品実装装置
JP5755502B2 (ja) 位置認識用カメラ及び位置認識装置
JP5104127B2 (ja) ウェハ移載装置と、これを有する半導体製造装置
JP5181383B2 (ja) ボンディング装置
JP5576219B2 (ja) ダイボンダおよびダイボンディング方法
WO2016092673A1 (ja) 部品実装機
TWI841852B (zh) 安裝裝置及安裝方法
JPH09232407A (ja) ワーク搬送装置およびそれを用いた半導体製造装置
KR20030092914A (ko) 플립 칩 폰더 및 그 정렬방법
JP6276553B2 (ja) ボンディングヘッドの回転軸の姿勢検出方法並びにダイボンダ及びボンディング方法
JP2009212165A (ja) 部品移載装置および部品移載装置の部品認識方法

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PX0901 Re-examination

St.27 status event code: A-2-3-E10-E12-rex-PX0901

PX0701 Decision of registration after re-examination

St.27 status event code: A-3-4-F10-F13-rex-PX0701

X701 Decision to grant (after re-examination)
GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9