KR101727774B1 - 이방 도전성 접착제 - Google Patents

이방 도전성 접착제 Download PDF

Info

Publication number
KR101727774B1
KR101727774B1 KR1020127018873A KR20127018873A KR101727774B1 KR 101727774 B1 KR101727774 B1 KR 101727774B1 KR 1020127018873 A KR1020127018873 A KR 1020127018873A KR 20127018873 A KR20127018873 A KR 20127018873A KR 101727774 B1 KR101727774 B1 KR 101727774B1
Authority
KR
South Korea
Prior art keywords
component
anisotropic conductive
conductive adhesive
mass
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020127018873A
Other languages
English (en)
Korean (ko)
Other versions
KR20120117832A (ko
Inventor
마사유키 오사다
도시후미 구보야마
마코토 가토
Original Assignee
쓰리본드 화인 케미칼 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리본드 화인 케미칼 가부시키가이샤 filed Critical 쓰리본드 화인 케미칼 가부시키가이샤
Publication of KR20120117832A publication Critical patent/KR20120117832A/ko
Application granted granted Critical
Publication of KR101727774B1 publication Critical patent/KR101727774B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/12—Polyester-amides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
KR1020127018873A 2009-12-22 2010-12-06 이방 도전성 접착제 Active KR101727774B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009291073A JP5825503B2 (ja) 2009-12-22 2009-12-22 異方導電性接着剤
JPJP-P-2009-291073 2009-12-22
PCT/JP2010/072307 WO2011077979A1 (ja) 2009-12-22 2010-12-06 異方導電性接着剤

Publications (2)

Publication Number Publication Date
KR20120117832A KR20120117832A (ko) 2012-10-24
KR101727774B1 true KR101727774B1 (ko) 2017-04-17

Family

ID=44195510

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127018873A Active KR101727774B1 (ko) 2009-12-22 2010-12-06 이방 도전성 접착제

Country Status (5)

Country Link
JP (1) JP5825503B2 (https=)
KR (1) KR101727774B1 (https=)
CN (1) CN102656244B (https=)
TW (1) TWI493013B (https=)
WO (1) WO2011077979A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5838674B2 (ja) * 2011-09-12 2016-01-06 住友電気工業株式会社 フィルム状異方導電性接着剤
JP5964187B2 (ja) 2012-09-18 2016-08-03 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
JP6164416B2 (ja) * 2013-09-25 2017-07-19 株式会社スリーボンド 導電性接着剤組成物
JP2017111978A (ja) * 2015-12-16 2017-06-22 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
CN106905889A (zh) * 2017-03-08 2017-06-30 上海腾烁电子材料有限公司 一种改性橡胶热硫化反应结合热塑性各向异性导电粘结剂
JP6969165B2 (ja) * 2017-06-02 2021-11-24 昭和電工マテリアルズ株式会社 異方導電性接着剤組成物、異方導電性フィルム、及び接続構造体
JP2020077645A (ja) * 2020-01-29 2020-05-21 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008222941A (ja) * 2007-03-15 2008-09-25 Toray Ind Inc 電子部品用接着剤組成物およびそれを用いた電子部品用接着シート

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6132085A (ja) * 1984-07-24 1986-02-14 富士通株式会社 表示素子の実装方法
JP4236856B2 (ja) * 2002-03-20 2009-03-11 信越ポリマー株式会社 異方導電性接着剤及びヒートシールコネクター
JP2007062126A (ja) * 2005-08-31 2007-03-15 Dainippon Printing Co Ltd インクジェットヘッド及びその製造方法
JP2008165034A (ja) * 2006-12-28 2008-07-17 Sony Corp 集積モジュール、表示装置、および電子機器
JP5226562B2 (ja) * 2008-03-27 2013-07-03 デクセリアルズ株式会社 異方性導電フィルム、並びに、接合体及びその製造方法
JP4580021B2 (ja) * 2009-01-26 2010-11-10 タツタ電線株式会社 接着剤組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008222941A (ja) * 2007-03-15 2008-09-25 Toray Ind Inc 電子部品用接着剤組成物およびそれを用いた電子部品用接着シート

Also Published As

Publication number Publication date
JP2011132304A (ja) 2011-07-07
WO2011077979A1 (ja) 2011-06-30
CN102656244A (zh) 2012-09-05
TWI493013B (zh) 2015-07-21
KR20120117832A (ko) 2012-10-24
CN102656244B (zh) 2014-06-04
TW201134916A (en) 2011-10-16
JP5825503B2 (ja) 2015-12-02

Similar Documents

Publication Publication Date Title
KR101727774B1 (ko) 이방 도전성 접착제
TWI491696B (zh) 各向異性導電黏著劑組合物
TWI415917B (zh) 低溫結合電子黏接劑
KR101355855B1 (ko) 이방성 도전 필름
JP5093482B2 (ja) 異方性導電材料、接続構造体及びその製造方法
JPWO2001014484A1 (ja) 接着剤、配線端子の接続方法及び配線構造体
KR101464353B1 (ko) 이방 도전성 필름용 조성물, 이방 도전성 필름, 및 이를 이용한 반도체 장치
TWI811444B (zh) 接著劑組合物
JP5002074B2 (ja) 導電性接着剤組成物及び導電性接着フィルム
KR20180044844A (ko) 다이머 함유 폴리아미드 수지 및 그 수지 조성물
JPH04323290A (ja) 異方導電性接着剤組成物
JP5675975B2 (ja) 接着剤組成物及び接着フィルム
JP2005290241A (ja) フィルム状接着剤
JP4888482B2 (ja) 異方導電性接着剤組成物、それを用いた回路端子の接続方法及び接続構造体
TW201807054A (zh) 含導電性粒子之樹脂組成物及含該樹脂組成物之電子裝置
JP6301366B2 (ja) 電子部品接着材料及び電子部品の接着方法
TW202239920A (zh) 膜狀接著劑及連接結構體之製造方法
US20240417606A1 (en) Electroconductive cured product
JP2005294086A (ja) フィルム状接着剤
JPH09176608A (ja) 導電性接着剤
CN109735270A (zh) 一种耐反翘导电胶粘剂及其制备方法
JP4626495B2 (ja) 回路接続用接着剤
JP6164416B2 (ja) 導電性接着剤組成物
JP2006028521A (ja) 回路接続用接着剤
JP4415905B2 (ja) 接着剤、配線端子の接続方法及び配線構造体

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

N231 Notification of change of applicant
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 10