KR101726114B1 - 알칼리 현상형 감광성 수지 조성물, 그의 드라이 필름 및 그의 경화물, 및 그들을 사용하여 형성된 프린트 배선판 - Google Patents

알칼리 현상형 감광성 수지 조성물, 그의 드라이 필름 및 그의 경화물, 및 그들을 사용하여 형성된 프린트 배선판 Download PDF

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KR101726114B1
KR101726114B1 KR1020157020481A KR20157020481A KR101726114B1 KR 101726114 B1 KR101726114 B1 KR 101726114B1 KR 1020157020481 A KR1020157020481 A KR 1020157020481A KR 20157020481 A KR20157020481 A KR 20157020481A KR 101726114 B1 KR101726114 B1 KR 101726114B1
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South Korea
Prior art keywords
photosensitive resin
solder resist
resin composition
resist composition
compound
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KR1020157020481A
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English (en)
Korean (ko)
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KR20150102105A (ko
Inventor
겐지 가토
후아민 구
창홍 우
Original Assignee
타이요 잉크 (쑤저우) 컴퍼니 리미티드
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Publication of KR20150102105A publication Critical patent/KR20150102105A/ko
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Laminated Bodies (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020157020481A 2013-01-31 2013-08-09 알칼리 현상형 감광성 수지 조성물, 그의 드라이 필름 및 그의 경화물, 및 그들을 사용하여 형성된 프린트 배선판 KR101726114B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201310038669.5 2013-01-31
CN201310038669.5A CN103969947B (zh) 2013-01-31 2013-01-31 碱显影型感光性树脂组合物、其干膜及其固化物以及使用其而形成的印刷电路板
PCT/CN2013/081148 WO2014117496A1 (zh) 2013-01-31 2013-08-09 碱显影型感光性树脂组合物、其干膜及其固化物以及使用其而形成的印刷电路板

Publications (2)

Publication Number Publication Date
KR20150102105A KR20150102105A (ko) 2015-09-04
KR101726114B1 true KR101726114B1 (ko) 2017-04-11

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KR1020157020481A KR101726114B1 (ko) 2013-01-31 2013-08-09 알칼리 현상형 감광성 수지 조성물, 그의 드라이 필름 및 그의 경화물, 및 그들을 사용하여 형성된 프린트 배선판

Country Status (5)

Country Link
JP (1) JP6118426B2 (zh)
KR (1) KR101726114B1 (zh)
CN (1) CN103969947B (zh)
TW (1) TWI516869B (zh)
WO (1) WO2014117496A1 (zh)

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WO2016058551A1 (zh) * 2014-10-15 2016-04-21 奇美实业股份有限公司 感光性树脂组成物、彩色滤光片的制造方法、彩色滤光片以及液晶显示装置
KR102329943B1 (ko) * 2016-03-16 2021-11-22 동우 화인켐 주식회사 네가티브 감광형 수지 조성물 및 이로부터 제조된 광경화 패턴
CN107490936A (zh) * 2016-06-09 2017-12-19 株式会社田村制作所 固化涂膜的形成方法
JP6995469B2 (ja) * 2016-09-02 2022-01-14 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
KR101952865B1 (ko) 2016-10-10 2019-02-27 삼성전기주식회사 팬-아웃 반도체 패키지 및 감광성 수지 조성물
KR102189000B1 (ko) * 2017-08-09 2020-12-09 고오 가가쿠고교 가부시키가이샤 다층 프린트 배선판의 제조 방법 및 다층 프린트 배선판
CN109976092B (zh) * 2017-12-27 2022-04-01 太阳油墨（苏州）有限公司 固化性树脂组合物、干膜、固化物、及印刷电路板
CN111417901A (zh) * 2018-10-30 2020-07-14 互应化学工业株式会社 绝缘膜形成用树脂组合物、绝缘膜形成用树脂组合物的制造方法、干膜、印刷配线板和印刷配线板的制造方法
EP3901699A4 (en) * 2018-12-19 2022-09-21 Taiyo Ink Mfg. Co., Ltd. CURABLE RESIN COMPOSITION, DRY FILM, CURED ARTICLE AND ELECTRONIC COMPONENT

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JP2011231257A (ja) * 2010-04-28 2011-11-17 Kyocera Chemical Corp 感光性樹脂組成物及びそれを用いたフレキシブルプリント配線板

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JP5466522B2 (ja) * 2010-02-08 2014-04-09 太陽ホールディングス株式会社 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
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Publication number Priority date Publication date Assignee Title
JP2005152736A (ja) 2003-11-25 2005-06-16 Mitsui Chemicals Inc 配線基板の塗布方法
JP2007128059A (ja) 2005-10-04 2007-05-24 Hitachi Chem Co Ltd 感光性樹脂組成物及び感光性フィルム
JP2010250127A (ja) 2009-04-16 2010-11-04 Goo Chemical Co Ltd アルカリ現像可能な硬化性組成物及びその硬化物
JP2011231257A (ja) * 2010-04-28 2011-11-17 Kyocera Chemical Corp 感光性樹脂組成物及びそれを用いたフレキシブルプリント配線板

Also Published As

Publication number Publication date
WO2014117496A1 (zh) 2014-08-07
KR20150102105A (ko) 2015-09-04
JP2016513268A (ja) 2016-05-12
CN103969947B (zh) 2016-05-04
TWI516869B (zh) 2016-01-11
JP6118426B2 (ja) 2017-04-19
TW201430492A (zh) 2014-08-01
CN103969947A (zh) 2014-08-06

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