WO2014117496A1 - 碱显影型感光性树脂组合物、其干膜及其固化物以及使用其而形成的印刷电路板 - Google Patents
碱显影型感光性树脂组合物、其干膜及其固化物以及使用其而形成的印刷电路板 Download PDFInfo
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- WO2014117496A1 WO2014117496A1 PCT/CN2013/081148 CN2013081148W WO2014117496A1 WO 2014117496 A1 WO2014117496 A1 WO 2014117496A1 CN 2013081148 W CN2013081148 W CN 2013081148W WO 2014117496 A1 WO2014117496 A1 WO 2014117496A1
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- photosensitive resin
- resin composition
- alkali
- coating film
- carboxyl group
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
Definitions
- Alkali development type photosensitive resin composition dry film thereof and cured product thereof, and printed circuit board formed using the same
- the present invention relates to an alkali-developable photosensitive resin composition and a cured product thereof which are suitable for use in formation of a solder resist of a printed circuit board, and more particularly to an image which can be formed by ultraviolet exposure and development with a dilute aqueous alkali solution, particularly blast-resistant
- An alkali-developable photosensitive resin composition which is excellent in adhesion, foam resistance, and adhesion to copper in TH (through hole) and crack resistance, and a cured coating film, and a cured product thereof, and a printed circuit board.
- an alkali-developing type liquid solder resist using a dilute aqueous alkali solution as a developing solution is, for example, an activity obtained by adding a polybasic acid anhydride to a reaction product of a novolac type epoxy compound and an unsaturated monocarboxylic acid as described in Patent Document 1.
- a liquid solder resist composition formed of an energy ray curable resin, a photopolymerization initiator, a diluent, and an epoxy compound is widely used.
- solder leveler solder leveller
- air bubble the phenomenon of overflow of the coating film filled in TH during post-cure and solder leveling
- a circuit board in which all the through holes of a circuit board such as a copper TH circuit board are filled with a liquid solder resist composition is in the mainstream, and it is necessary to develop a response to the bubble.
- a solder mask composition for the problem of blasting holes is used in combination, as described in Patent Document 2 or Patent Document 3.
- the printed circuit board uses a printed circuit board which is thinner and younger and has various apertures.
- a solder resist composition having the space resistance and blast resistance is used for a printed circuit board having a hole diameter of ⁇ 500 or more
- the adhesion between the copper and the solder resist composition in the TH may be insufficient. Bad condition of the crack.
- Figure 1 shows the shape of the problem.
- Such an unfavorable situation may cause the following new problems:
- the flux When the flux is applied, the flux easily enters the TH, the flux reflows to the opposite side of the flux coated surface, and the surface of the substrate is contaminated, and the residual flux in the TH is behind. Since the treatment causes expansion at the time of leveling, it is desired to develop a solder resist composition which is excellent in blast resistance, cavitation resistance, and adhesion to copper in TH and crack resistance.
- Patent Document 1 Japanese Special Open No. 61-243869
- Patent Document 2 Japanese Special Open 2008-116813
- Patent Document 3 International Publication No. 2003-059975
- Patent Document 4 Japanese Patent Publication No. 2002-256060 SUMMARY OF THE INVENTION
- An object of the present invention is to provide an alkali-developing photosensitive resin composition which is excellent in blast resistance, cavitation resistance, adhesion to copper in TH, and crack resistance, and which can obtain a cured coating film, and a cured product thereof And a printed circuit board.
- a main object of the present invention is to provide an alkali-developable photosensitive resin composition which is excellent in adhesion to copper in TH and crack resistance and which is suitable for a solder resist composition for a printed circuit board.
- the alkali-developing photosensitive resin composition As described below can solve the above problems, and the present invention, the alkali-developing photosensitive resin composition It is characterized by containing (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) a diluent solvent, (D) a compound having two or more ethylenically unsaturated groups in one molecule, and (E)
- the talc as the (A) carboxyl group-containing resin, contains an esterified product of an epoxy group formed by esterification of at least one bisphenol epoxy compound (a) with an unsaturated carboxylic acid (b), and saturated or
- the alkali-developable photosensitive resin composition of the present invention contains (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) a diluent solvent, and (D) two or more in one molecule.
- a compound of an ethylenically unsaturated group and (E) talc as (A) a carboxyl group-containing resin, comprising esterification of at least one bisphenol epoxy compound (a) with an unsaturated carboxylic acid (b)
- thermosetting component (G) a thermosetting component
- the dry film of the present invention is obtained by applying the alkali-developable photosensitive resin composition onto a carrier film and drying it.
- the cured product of the present invention is obtained by photocuring a coating film obtained by applying the alkali-developing photosensitive resin composition onto copper and drying it. Coating the film or coating the photosensitive resin composition on a carrier film and drying the resulting photocurable A coating film obtained by laminating a dry film on copper.
- the printed wiring board of the present invention is obtained by photocuring a coating film obtained by thermally curing the coating film, and applying the alkali developing type photosensitive resin composition to a substrate.
- the most technical feature of the photosensitive resin composition of the present invention is that the (A) carboxyl group-containing resin contains at least one bisphenol epoxy compound (a) and an unsaturated carboxylic acid (b).
- the carboxyl group-containing resin (A-1) obtained by reacting the esterified product of the epoxy group with the saturated or unsaturated polybasic acid anhydride (c), and the content of the (E) talc is 10% by weight or more based on the total amount. 60% by weight or less.
- the carboxyl group-containing resin (A-1) having flexibility is used as the (A) carboxyl group-containing resin, and the content of the (E) talc is 10% by weight or more based on the total amount.
- the amount is 60% by weight or less, the hardness of the cured product can be made soft, and the photosensitive resin composition can be imparted with flexibility.
- the curing shrinkage at the time of curing of the photosensitive resin composition at the time of post-curing can be alleviated, and the photosensitive resin composition can satisfactorily follow the unevenness of the copper surface in TH due to the flexibility of the photosensitive resin composition.
- Curing is performed, whereby cracks at the interface between the copper in the TH and the photosensitive resin composition can be prevented. Further, the fluidity of the alkali-developable photosensitive resin composition is improved, and the embedding property into the TH during printing becomes good.
- the conventional solder resist composition having cavitation resistance, although the foam resistance is obtained, the adhesion to copper in TH cannot be sufficiently obtained.
- the conventional solder resist composition contains the carboxyl group-containing resin (A-1) and (F) filler, but the (F) filler generally uses barium sulfate having a high Mohs hardness as a measure of the hardness of the mineral. (Mohs hardness: 3), silica (Mohs hardness: 7).
- the scale of the hardness of the Mohs hardness is an integer value of 1 to 10, and the larger the number, the higher the hardness of the mineral.
- the conventional photosensitive resin composition is insufficient in sufficient flexibility, and it is difficult to impart adhesion to copper in the TH. Therefore, in the present invention, the above problem is solved by using (E) talc having a Mohs hardness of 1 and one of the softest minerals in minerals.
- Fig. 1 a is a view showing that the copper of the TH and the coating film are not peeled off.
- b is a graph showing the peeling of the copper and the coating film of TH.
- the alkali-developable photosensitive resin composition of the present invention is characterized in that (E) talc is contained as a necessary component, and therefore, (E) talc will be described first.
- the (E) talc used in the alkali-developable photosensitive resin composition of the present invention is used for improving the adhesion to copper in the TH and the crack resistance.
- the mother rock is magnesium carbonate, serpentine, silica/silicon dioxide- Any one of alumina and magnesium deposits may be one of the so-called silicate minerals, and the shape may be in the form of a block or a fine powder. It may or may not be surface treated.
- the compounding ratio of these (E) talc is suitably 10% by weight or more and 60% by weight or less based on the total amount.
- the amount is less than 10% by weight, the adhesion to the copper in the TH and the crack resistance are not sufficiently obtained.
- the amount is more than 60% by weight, the fluidity of the alkali-developable photosensitive resin composition is deteriorated, and the film is buried in the TH during printing. Incompatibility is deteriorated, so it is not preferable.
- At least one bisphenol type epoxy compound (a) used in the production of such a carboxyl group-containing resin (A-1) is used on an alcoholic hydroxyl group of a bisphenol A type or a bisphenol F type with respect to an alcohol A compound obtained by adding an epihalohydrin such as epichlorohydrin to an equivalent amount of 1 equivalent or more of the hydroxyl group.
- Examples of the unsaturated carboxylic acid (b) to be added to the epoxy group of the bisphenol epoxy compound include acrylic acid, a dimer of acrylic acid, methacrylic acid, and hydroxyethyl (meth)acrylate. Hydroxypropyl acrylate (meth) acrylate, hydroxybutyl (meth) acrylate, phenyl glycidyl (meth) acrylate, caprolactone (meth) acrylate lactone, etc. a meta-anhydride adduct and the like. Among them, acrylic acid and methacrylic acid are particularly preferable. These unsaturated group-containing monocarboxylic acids may be used singly or in combination.
- the saturated or unsaturated polybasic acid anhydride (c) which reacts with an alcoholic hydroxyl group in the esterified product formed by the esterification reaction of the bisphenol type epoxy compound and the unsaturated carboxylic acid may, for example, be a methyl group.
- Such a saturated or unsaturated polybasic acid anhydride is preferably used in the obtained carboxyl group-containing resin.
- the acid value of (A-l) is added in the range of 45 to 120 mgKOH/g.
- the compounds listed below (which may be any of an oligomer and a polymer) are preferable.
- a carboxyl group-containing copolymer resin obtained by copolymerizing an unsaturated carboxylic acid such as (meth)acrylic acid with one or more compounds having an unsaturated double bond,
- a glycidyl (meth)acrylate or a (meth)acrylic acid 3 is used.
- a photosensitive carboxyl group obtained by adding an ethylenically unsaturated group such as a compound having an epoxy group to an unsaturated double bond or a (meth)acrylic acid chloride or the like as a side chain such as 4-epoxycyclohexylmethyl ester.
- a carboxyl group-containing photosensitive resin obtained by reacting a polyfunctional epoxy compound with an unsaturated monocarboxylic acid to react a generated hydroxyl group with a saturated or unsaturated polybasic acid anhydride
- the carboxyl group-containing resin obtained by reacting the polybasic acid anhydride is further reacted with a compound having an epoxyethylene ring and one or more ethylenically unsaturated groups in the molecule.
- the obtained carboxyl group-containing photosensitive resin or the like is not limited to these.
- (meth) acrylate is a term collectively referred to as acrylate, methacrylate, and a mixture thereof, and the same applies to other similar expressions.
- the carboxyl group-containing resin (A) as described above has a plurality of free carboxyl groups in the side chain of the main chain polymer, and thus can be developed by using a dilute aqueous alkali solution.
- the acid value of the carboxyl group-containing resin (A) is preferably in the range of 40 to 200 mgKOH/g, and more preferably in the range of 45 to 120 mgKOH/g.
- the acid value of the carboxyl group-containing resin is less than 40 mgKOH/g, it is difficult to develop alkali.
- it exceeds 200 mgKOH/g the developer is dissolved in the exposed portion, so that the line becomes finer than necessary, and sometimes the exposure is performed. The portion and the unexposed portion are dissolved and peeled off by the developer without distinction, and it is difficult to draw a normal resist pattern, which is not preferable.
- the weight average molecular weight of the carboxyl group-containing resin (A) varies depending on the resin skeleton, and is usually preferably in the range of 2,000 to 150,000, more preferably 5,000 to 100,000.
- the weight average molecular weight is less than 2,000, the non-sticking property after application to the substrate and drying may be deteriorated, and the moisture resistance of the coating film after exposure may be deteriorated, the film may be reduced during development, and the resolution may be greatly deteriorated.
- the weight average molecular weight exceeds 150,000, the developability may be remarkably deteriorated, and the storage stability may be deteriorated.
- the compounding amount of the carboxyl group-containing resin (A) is desirably 20 to 60% by mass of the total composition.
- the range is preferably 30 to 50% by mass.
- the compounding amount of the carboxyl group-containing resin (A) is less than the above range, the coating film strength is lowered, which is not preferable.
- the viscosity of the composition becomes high, or the coatability and the like are lowered, which is not preferable.
- the photopolymerization initiator (B) which can be suitably used in the alkali-developable photosensitive resin composition of the present invention is exemplified by:
- Acetophenone 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone, 1- Acetophenones such as [4-(4-benzoylphenylsulfonyl)-2-methyl-2-(4-methylphenylsulfonyl)]propan-1-one;
- Anthraquinones such as 2-methylhydrazine, 2-ethylhydrazine, 2-tert-butylhydrazine, 1-chloroindole;
- a thioxanthone such as 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone or 2,4-diisopropylthioxanthone;
- ketal such as acetophenone dimethyl ketal or benzil dimethyl ketal
- Benzophenones such as benzophenone or xanthone
- An acylphosphine oxide such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide or ethyl 2,4,6-trimethylbenzoylphenylphosphonate;
- 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinoacetone-1 is used as a commercial product, and examples thereof include: Manufactured by Ciba-Geigy Company IRGACURE 907 and so on.
- the compounding ratio of the photopolymerization initiator (B) is preferably 0.01 to 30 parts by mass, preferably 5 to 25 parts by mass, per 100 parts by mass of the carboxyl group-containing resin (A).
- the amount of the photopolymerization initiator used is less than the above range, the photocurability of the composition is deteriorated. On the other hand, when the amount is too large, the properties of the solder resist are lowered, which is not preferable.
- the organic solvent (C) used in the alkali-developable photosensitive resin composition of the present invention may be prepared by synthesizing the carboxyl group-containing resin (A), preparing a composition, or adjusting the viscosity so as to be coated on a substrate or a carrier film. Use an organic solvent.
- organic solvent examples include ketones, aromatic hydrocarbons, glycol ethers, glycol ether acetates, esters, alcohols, aliphatic hydrocarbons, petroleum solvents, and the like. More specifically, it is a ketone such as methyl ethyl ketone or cyclohexanone; an aromatic hydrocarbon such as toluene, xylene or tetramethylbenzene; cellosolve, methyl cellosolve, butyl cellosolve, carbitol, and methyl carbene.
- ketone such as methyl ethyl ketone or cyclohexanone
- aromatic hydrocarbon such as toluene, xylene or tetramethylbenzene
- cellosolve methyl cellosolve, butyl cellosolve, carbitol, and methyl carbene.
- the above organic solvents may be used singly or in the form of a mixture of two or more.
- the compound (D) having two or more ethylenically unsaturated groups in the molecule used in the alkali-developable photosensitive resin composition of the present invention is photocured by irradiation with an active energy ray to render the carboxyl group-containing resin (A) insoluble.
- Specific examples of such a compound include:
- a monoacrylate or a diol of a glycol such as ethylene glycol, methoxytetraethylene glycol, polyethylene glycol or propylene glycol Acrylates;
- Anthraquinones such as hydrazine, hydrazine-dimethyl acrylamide, hydrazine-hydroxymethyl acrylamide, hydrazine, hydrazine-dimethylaminopropyl acrylamide;
- Acrylic acid aminoguanidino esters such as hydrazine, hydrazine-dimethylaminoethyl ester, hydrazine acrylate, hydrazine-dimethylaminopropyl acrylate;
- a polyhydric alcohol such as a diol such as hexanediol, trimethylolpropene, pentaerythritol, dipentaerythritol or trishydroxyethyl isocyanurate or an epoxy oxime adduct or a propylene oxide adduct thereof.
- An acrylate of a glycidyl ether such as glycerol diglycidyl ether, glycerol triglycidyl ether, trimethylol propyl triglycidyl ether or triglycidyl isocyanurate;
- an epoxy acrylate resin obtained by reacting a polyfunctional epoxy resin such as a cresol novolak epoxy resin with acrylic acid, a hydroxyl group of the epoxy acrylate resin, and pentaerythritol triacrylate may be used.
- the compounding amount of the compound (D) having two or more ethylenically unsaturated groups in the molecule is desirably from 5 to 100 parts by mass, more preferably 10, based on 100 parts by mass of the carboxyl group-containing resin (A). ⁇ 70 parts by mass ratio.
- the compounding amount is less than 5 parts by mass based on 100 parts by mass of the carboxyl group-containing resin (A)
- the photocurability of the obtained alkali-developable photosensitive resin composition is lowered, and it is difficult to pass the active energy ray after irradiation.
- the alkali development forms a pattern and is therefore not preferred.
- it exceeds 100 parts by mass the solubility in the aqueous alkali solution is lowered, and the cured coating film becomes brittle, which is not preferable.
- the (F) filler can be used for the alkali-developable photosensitive resin composition of the present invention.
- Examples of such (F) fillers include barium sulfate, barium titanate, silica powder, spherical silica, clay, magnesium carbonate, calcium carbonate, aluminum oxide, aluminum hydroxide, glass fiber, carbon fiber, and mica powder. Etc. commonly known inorganic or organic fillers. Such (F) fillers may or may not be surface treated.
- the compounding ratio of such a (F) filler is suitably 0.01% by weight or more and 50% by weight or less based on the total amount.
- the amount is less than 0.01% by weight, the adhesion to the copper in the TH and the heat resistance are not sufficiently obtained.
- the amount is more than 50% by weight, the fluidity of the alkali-developable photosensitive resin composition is deteriorated, and it is in the TH during printing. The embedding property is deteriorated, which is not preferable.
- the alkali-developing photosensitive resin composition has at least one of two or more reactive groups (a cyclic ether group and a cyclic thioether group) in order to impart heat resistance and crack resistance.
- a thermosetting component (G) of the above hereinafter referred to as a cyclic (thio)ether group).
- the thermosetting component (G) is a compound having one or two or more of a cyclic ether group or a cyclic thioether group having a three-membered ring, a four-membered ring or a five-membered ring in the molecule, for example, Examples of the compound having at least two epoxy groups in the molecule, that is, a polyfunctional epoxy compound (G-1), and a compound having at least two or more oxetanyl groups in the molecule, that is, a polyfunctional oxetane
- the compound (G-2) is a compound having at least two or more thioether groups in the molecule, that is, an episulfide resin (G-3).
- polyfunctional epoxy compound (G-1) for example, EPICOAT828, EPICOAT834, EPICOAT100K EPICOAT1004 manufactured by Mitsubishi Chemical Corporation, Epiclon 840, Epiclon 850, Epiclon 050, Epiclon 2055 manufactured by DIC, manufactured by Dongdu Chemical Co., Ltd. Epotote YD-011, YD-013, YD-127, YD-128, DER317, DER33K DER661, DER664 manufactured by Dow Chemical Company, manufactured by Sumitomo Chemical Industries Sumiepoxy ESA-011, ESA-014, ELA-115, ELA-128, AER330, AER33K AER661, AER664, etc.
- ELM-120, etc. Glycidylamine type epoxy resin; Hydantoin type epoxy resin; Cel OX ide2021 manufactured by DAICEL CHEMICAL INDUSTRIES, LTD.
- Epoxy epoxy Resin YL-933 manufactured by Mitsubishi Chemical Corporation, ⁇ , ⁇ -50 ⁇ EPPN-502, manufactured by Dow Chemical Company, etc.
- Epoxy epoxy Resin YL-933 manufactured by Mitsubishi Chemical Corporation, ⁇ , ⁇ -50 ⁇ EPPN-502, manufactured by Dow Chemical Company, etc.
- trihydroxyphenylformamidine type epoxy resin Mitsubishi Chemical Ethyl xylenol type or bisphenol type epoxy resin such as YL-6056, YX-4000, YL-6121 (all trade names) manufactured by the company, or a mixture thereof; EBPS-200 manufactured by Nippon Kayaku Co., Ltd.
- Electrochemical industry company The EPX-30, EXA-1514 (trade name) manufactured by DIC bisphenol S type epoxy resin; manufactured by Mitsubishi Chemical Corporation Bisphenol A novolac type epoxy resin such as EPICOAT157S (trade name); EPICOAT YL-931 (all are trade names) manufactured by Mitsubishi Chemical Corporation, tetrakis phenyl acetonitrile type epoxy resin; Nissan Chemical Industry Co., Ltd. TEPIC, etc. (all are trade names) Heterocyclic epoxy resin; Blemmer DGT and other phthalic acid diglycidyl ester resins manufactured by Nippon Oil & Fats Co., Ltd.; Zw-1063 and other tetraglycidyl 2 manufactured by Dongdu Chemical Co., Ltd.
- Tetraglycidyl xylenoyl ethane resin ESN-190, ESN-360 manufactured by Nippon Steel Chemical Co., Ltd., HP-4032, EXA-4750, EXA-4700 and other naphthalene-based epoxy resins manufactured by DIC; Epoxy resin having a dicyclopentadiene skeleton such as HP-7200 or HP-7200H; glycidyl methacrylate copolymer epoxy resin such as CP-50S and CP-50M manufactured by Nippon Oil Co., Ltd.; and cyclohexylma Copolymerized epoxy resin of imide and glycidyl methacrylate; epoxy modified polybutadiene rubber derivative (such as PB-3600 manufactured by DAICEL CHEMICAL INDUSTRIES, LTD.), CTBN modified epoxy resin (E.g Manufactured by Kasei YR-102, YR-450, etc.) and the like, but is not limited thereto.
- the polyfunctional oxetane compound (G-2) may, for example, be bis[(3-methyl-3-oxetanylmethoxy)methyl]ether or bis[(3-ethyl) 3-oxetanylmethoxy)methyl]ether, 1,4-bis[(3-methyl-3-oxetanylmethoxy)methyl]benzene, 1,4-bis[( 3-ethyl-3-oxetanylmethoxy)methyl]benzene, (3-methyl-3-oxetanyl)methyl acrylate, acrylic acid (3-ethyl-3-oxetanyl) Methyl ester, methyl (3-methyl-3-oxetanyl) methacrylate, methyl ( 3 -ethyl- 3 -oxetanyl) methacrylate, oligomers or copolymers thereof
- polyfunctional oxetane, and oxetane with novolac resin poly(p-hydroxystyren
- the compound (G-3) having two or more cyclic thioether groups in the molecule for example, : bisphenol A type episulfide resin YL7000 manufactured by Mitsubishi Chemical Corporation. Further, an episulfide resin obtained by replacing the oxygen atom of the epoxy group of the novolac type epoxy resin with a sulfur atom by the same synthesis method may be used.
- the compounding amount of the (G) thermosetting component having two or more cyclic (thio)ether groups in the molecule is preferably a cyclic (thio)ether with respect to 1 equivalent of the carboxyl group of the carboxyl group-containing resin (A).
- the base is in the range of 0.6 to 2.0 equivalents, more preferably in the range of 0.8 to 1.5 equivalents.
- the amount of the thermosetting component (G) having two or more cyclic (thio)ether groups in the molecule is less than 0.6, the carboxyl group remains in the solder resist film, and heat resistance, alkali resistance, electrical insulation, and the like are left. It is lowered, so it is not preferable.
- the amount is more than 2.0 equivalents, since a low molecular weight cyclic (thio)ether group remains in the dried coating film, the strength of the coating film or the like is lowered, which is not preferable.
- thermosetting component (G) having two or more cyclic (thio)ether groups in the molecule it is preferred to contain a thermosetting catalyst.
- a thermosetting catalyst include imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 4-phenylimidazole, and 1 -Imidazole derivatives such as cyanoethyl-2-phenylimidazole, 1-(2-cyanoethyl)-2-ethyl-4-methylimidazole; dicyandiamide, benzyldimethylamine, 4- (two Methylamino)-N,N-dimethylbenzylamine, 4-methoxy-N,N-dimethylbenzylamine, 4-methyl-N,N-dimethylbenzylamine and other amine compounds; a hydrazide compound such as an acid dihydrazide or azelaic acid
- thermosetting catalyst for an epoxy resin a thermosetting catalyst for an oxetane compound, or a catalyst for promoting the reaction of at least one of an epoxy group and an oxetan group with a carboxyl group.
- it may be used alone or in combination of two or more.
- guanamine, methyl decylamine, benzoguanamine, melamine, 2,4-diamino-6-methacryloyloxyethyl-s-triazine, 2-vinyl-2,4 can also be used.
- a triazine derivative such as a triazine-isocyanuric acid adduct is preferably used in combination with the above-mentioned thermosetting catalyst.
- the alkali-developable photosensitive resin composition of the present invention may further contain, as needed, phthalocyanine blue, phthalocyanine green, iodine green, disazo yellow, crystal violet, titanium oxide, carbon black, naphthalene blue black, and the like.
- colorants hydroquinone, hydroquinone monomethyl ether, tert-butyl catechol, pyrogallol, phenothiazine and other commonly used thermal polymerization inhibitors, fine powder silica, organic bentonite, montmorillonite A known thickener, a defoaming agent such as a silicone-based, a fluorine-based or a polymer-based compound, and a flow-through agent, and an adhesion-imparting agent such as an imidazole-based, a thiazole-based or a triazole-based, or a silicon-germanium coupler.
- Commonly used additives such as a crosslinking agent.
- the alkali-developing photosensitive resin composition of the present invention When used in forming a solder resist of a printed circuit board, it is adjusted to a viscosity suitable for the coating method as needed, and then subjected to screen printing, curtain printing, and spraying.
- a method such as a method or a roll coating method, for example, it is applied to a printed circuit board on which a circuit is formed in advance, and if necessary, for example, by drying at a temperature of about 60 to 100 ° C, a coating film which is not sticky can be formed.
- a resist pattern can be formed, and further, for example, by heating to about 140 to 180°.
- the temperature of C is thermally cured, whereby the curing reaction of the thermosetting component and the polymerization of the photosensitive resin component can be promoted, and the heat resistance, solvent resistance, acid resistance, and moisture absorption resistance of the obtained resist film can be improved. , PCT tolerance, adhesion, electrical properties and other characteristics.
- an aqueous alkali solution such as potassium hydroxide, sodium hydroxide, sodium carbonate, potassium carbonate, sodium phosphate, sodium silicate, ammonia or an amine can be used.
- a low pressure mercury lamp, a medium pressure mercury lamp, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a semiconductor laser, a solid laser, a xenon lamp or a metal halide lamp or the like is suitable.
- Example 1 The present invention will be described in more detail based on examples and comparative examples, but the scope of the invention and the embodiments thereof are not limited thereto.
- the "parts” or “%” in the examples and comparative examples are based on weight unless otherwise specified.
- the property value test of the composition of the present example was carried out by the method described below.
- the reaction product was cooled to 80 to 90 ° C, and 190 parts of tetrahydrophthalic anhydride was added to carry out a reaction for 8 hours.
- the carboxyl group-containing photosensitive resin obtained in this manner had a nonvolatile content of 65%, and the solid content had an acid value of 100 mgKOH/g.
- the resin solution is referred to as varnish A.
- the obtained reaction product was cooled to 80 to 90 ° C, and 91.2 parts of tetrahydrophthalic anhydride was added thereto to carry out a reaction for 8 hours, and after cooling, it was taken out.
- the carboxyl group-containing photopolymerizable unsaturated compound thus obtained had a nonvolatile content of 65% and an acid value of a solid component of 87.5 mgKOH/g. Following, the counter The solution of the product to be produced is called varnish B.
- Each of the alkali-developable photosensitive resin compositions of the above Examples 1-4 and Comparative Examples 1-3 was filled in a substrate of ⁇ 0.5 and 0.8 mm, and then cured by photocuring and thermal curing to obtain a cured coating film according to JIS.
- the above coating film was immersed in a solder bath at 288 ° C for 3 seconds 3 times using a rosin-based and water-soluble flux. Then, the state of the coating film of the TH portion was visually observed.
- the evaluation criteria are as follows.
- ⁇ The protrusion of the coating film in the TH500 hole of ⁇ 500 is less than 5
- the protrusion of the coating film in the TH500 hole of ⁇ 500 is more than 5
- Each of the alkali developing types of the above Examples 1-4 and Comparative Examples 1-3 was filled into the substrates of ⁇ 0.5 and 0.8 mmt.
- photosensitive resin composition photocuring and thermal curing were carried out to obtain a cured coating film, and the coating film was immersed in a solder bath at 288 ° C for 10 seconds using a rosin-based and water-soluble flux according to the test method of JIS C6481. Times. Then, the tape was peeled off, and the peeling state around the TH was confirmed.
- the evaluation criteria are as follows.
- ⁇ : ⁇ 500 produces less than 5 vacuoles in the TH500 hole
- Each of the alkali-developable photosensitive resin compositions of the above Examples 1-4 and Comparative Examples 1-3 was filled in a substrate of ⁇ 0.5 and 0.8 mmt, and then photocured and thermally cured to form a cured coating film. Then, the cross-sectional state of the substrate was confirmed by an optical microscope.
- the evaluation criteria are as follows. A schematic view of the cross-sectional shape is shown.
- ⁇ The copper of TH and the coating film are not peeled off, etc.
- Each of the alkali-developable photosensitive resin compositions of Examples 1-4 and Comparative Examples 1-3 was filled in a substrate of ⁇ 0.5 and 0.8 mmt, and then photocured and thermally cured to form a cured coating film. Then, the state of the coating film of the TH portion was observed with an optical microscope.
- the evaluation criteria are as follows.
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KR102329943B1 (ko) * | 2016-03-16 | 2021-11-22 | 동우 화인켐 주식회사 | 네가티브 감광형 수지 조성물 및 이로부터 제조된 광경화 패턴 |
CN107490936A (zh) * | 2016-06-09 | 2017-12-19 | 株式会社田村制作所 | 固化涂膜的形成方法 |
JP6995469B2 (ja) * | 2016-09-02 | 2022-01-14 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
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KR102189000B1 (ko) * | 2017-08-09 | 2020-12-09 | 고오 가가쿠고교 가부시키가이샤 | 다층 프린트 배선판의 제조 방법 및 다층 프린트 배선판 |
CN109976092B (zh) * | 2017-12-27 | 2022-04-01 | 太阳油墨(苏州)有限公司 | 固化性树脂组合物、干膜、固化物、及印刷电路板 |
CN111417901A (zh) * | 2018-10-30 | 2020-07-14 | 互应化学工业株式会社 | 绝缘膜形成用树脂组合物、绝缘膜形成用树脂组合物的制造方法、干膜、印刷配线板和印刷配线板的制造方法 |
EP3901699A4 (en) * | 2018-12-19 | 2022-09-21 | Taiyo Ink Mfg. Co., Ltd. | CURABLE RESIN COMPOSITION, DRY FILM, CURED ARTICLE AND ELECTRONIC COMPONENT |
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JP6118426B2 (ja) | 2017-04-19 |
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CN103969947A (zh) | 2014-08-06 |
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