KR101701522B1 - 부식 민감성 층과 상용성이 있는 접착제 - Google Patents

부식 민감성 층과 상용성이 있는 접착제 Download PDF

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Publication number
KR101701522B1
KR101701522B1 KR1020117005412A KR20117005412A KR101701522B1 KR 101701522 B1 KR101701522 B1 KR 101701522B1 KR 1020117005412 A KR1020117005412 A KR 1020117005412A KR 20117005412 A KR20117005412 A KR 20117005412A KR 101701522 B1 KR101701522 B1 KR 101701522B1
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South Korea
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adhesive
delete delete
corrosion
substrate
sensitive layer
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Expired - Fee Related
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Korean (ko)
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KR20110041565A (ko
Inventor
알버트 아이 에버레어츠
지안후이 시아
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쓰리엠 이노베이티브 프로퍼티즈 컴파니
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Publication of KR20110041565A publication Critical patent/KR20110041565A/ko
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    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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    • C—CHEMISTRY; METALLURGY
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C—CHEMISTRY; METALLURGY
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    • C—CHEMISTRY; METALLURGY
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    • C—CHEMISTRY; METALLURGY
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    • C—CHEMISTRY; METALLURGY
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    • C—CHEMISTRY; METALLURGY
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C—CHEMISTRY; METALLURGY
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
KR1020117005412A 2008-08-12 2009-08-11 부식 민감성 층과 상용성이 있는 접착제 Expired - Fee Related KR101701522B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US8820108P 2008-08-12 2008-08-12
US61/088,201 2008-08-12
PCT/US2009/053337 WO2010019528A2 (en) 2008-08-12 2009-08-11 Adhesives compatible with corrosion sensitive layers

Publications (2)

Publication Number Publication Date
KR20110041565A KR20110041565A (ko) 2011-04-21
KR101701522B1 true KR101701522B1 (ko) 2017-02-01

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KR1020117005412A Expired - Fee Related KR101701522B1 (ko) 2008-08-12 2009-08-11 부식 민감성 층과 상용성이 있는 접착제

Country Status (7)

Country Link
US (1) US20100040842A1 (enExample)
EP (1) EP2315663B1 (enExample)
JP (1) JP5499031B2 (enExample)
KR (1) KR101701522B1 (enExample)
CN (1) CN102123859B (enExample)
TW (1) TWI468296B (enExample)
WO (1) WO2010019528A2 (enExample)

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US20060057367A1 (en) * 2004-09-14 2006-03-16 Sherman Audrey A Optical film
DE102008037866A1 (de) * 2008-08-15 2010-02-18 Tesa Se Verfahren zur blasenfreien Verklebung von hochtransparenten Materialien
CN102422730B (zh) * 2009-05-13 2016-03-16 莱尔德电子材料(深圳)有限公司 用于emi屏蔽应用的导电膜
US8847908B2 (en) * 2010-04-22 2014-09-30 Sharp Kabushiki Kaisha Display device
JP2012046663A (ja) * 2010-08-27 2012-03-08 Three M Innovative Properties Co 部材の接合方法及び接合装置
US8933906B2 (en) 2011-02-02 2015-01-13 3M Innovative Properties Company Patterned substrates with non-linear conductor traces
US9736928B2 (en) 2011-02-02 2017-08-15 3M Innovative Properties Company Patterned substrates with darkened conductor traces
WO2012125324A1 (en) 2011-03-14 2012-09-20 3M Innovative Properties Company Nanostructured articles
JP6014057B2 (ja) 2011-03-14 2016-10-25 スリーエム イノベイティブ プロパティズ カンパニー 多層のナノ構造化物品
US10538690B2 (en) 2011-03-21 2020-01-21 Avery Dennison Corporation Non-flowing silicone adhesive
JP6199864B2 (ja) 2011-08-17 2017-09-20 スリーエム イノベイティブ プロパティズ カンパニー ナノ構造物品及びそれを製造するための方法
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