KR101697240B1 - 광학 검사 시스템 및 방법 - Google Patents
광학 검사 시스템 및 방법 Download PDFInfo
- Publication number
- KR101697240B1 KR101697240B1 KR1020107022152A KR20107022152A KR101697240B1 KR 101697240 B1 KR101697240 B1 KR 101697240B1 KR 1020107022152 A KR1020107022152 A KR 1020107022152A KR 20107022152 A KR20107022152 A KR 20107022152A KR 101697240 B1 KR101697240 B1 KR 101697240B1
- Authority
- KR
- South Korea
- Prior art keywords
- delete delete
- image
- beam path
- wafer
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8822—Dark field detection
- G01N2021/8825—Separate detection of dark field and bright field
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US6494908P | 2008-04-04 | 2008-04-04 | |
| US61/064,949 | 2008-04-04 | ||
| PCT/EP2009/002482 WO2009121628A2 (en) | 2008-04-04 | 2009-04-03 | Optical inspection system and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20110000560A KR20110000560A (ko) | 2011-01-03 |
| KR101697240B1 true KR101697240B1 (ko) | 2017-01-17 |
Family
ID=41059655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020107022152A Expired - Fee Related KR101697240B1 (ko) | 2008-04-04 | 2009-04-03 | 광학 검사 시스템 및 방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (4) | US8072591B2 (enExample) |
| JP (1) | JP5749641B2 (enExample) |
| KR (1) | KR101697240B1 (enExample) |
| CN (1) | CN102016554B (enExample) |
| DE (1) | DE112009000832T5 (enExample) |
| TW (1) | TWI479583B (enExample) |
| WO (1) | WO2009121628A2 (enExample) |
Families Citing this family (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112009000832T5 (de) | 2008-04-04 | 2011-07-28 | Nanda Technologies GmbH, 85716 | System und Verfahren zur optischen Inspektion |
| CN101963741B (zh) * | 2009-07-23 | 2013-10-09 | 鸿富锦精密工业(深圳)有限公司 | 摄像模组及采用该摄像模组的便携式电子装置 |
| EP2339331A1 (en) | 2009-12-23 | 2011-06-29 | Nanda Technologies GmbH | Inspection and positioning systems and methods |
| JP2011203245A (ja) * | 2010-03-02 | 2011-10-13 | You-Na Tech Corp | 半導体ウェハの表面検査システム及び表面検査方法 |
| EP2378548A1 (en) | 2010-04-19 | 2011-10-19 | Nanda Technologies GmbH | Methods of processing and inspecting semiconductor substrates |
| EP2381246A1 (en) * | 2010-04-26 | 2011-10-26 | Becton Dickinson France | Device, kit and method for inspection of an article |
| CN102269858A (zh) * | 2010-06-02 | 2011-12-07 | 北京智朗芯光科技有限公司 | 自动聚焦系统和自动聚焦方法 |
| EP2609419A1 (en) | 2010-08-24 | 2013-07-03 | Nanda Technologies GmbH | Methods and systems for inspecting bonded wafers |
| US8501503B2 (en) | 2011-04-28 | 2013-08-06 | Nanda Technologies Gmbh | Methods of inspecting and manufacturing semiconductor wafers |
| DE102011051355A1 (de) | 2011-06-27 | 2012-12-27 | Hseb Dresden Gmbh | Inspektionsvorrichtung |
| US9213156B2 (en) * | 2011-08-17 | 2015-12-15 | Source Photonics, Inc. | Optical receiver with reduced cavity size and methods of making and using the same |
| WO2013070982A1 (en) * | 2011-11-08 | 2013-05-16 | The Trustees Of Columbia University In The City Of New York | Systems and methods for simultaneous multi-directional imaging for capturing tomographic data |
| US10088413B2 (en) * | 2011-11-21 | 2018-10-02 | Kla-Tencor Corporation | Spectral matching based calibration |
| WO2013120091A1 (en) * | 2012-02-10 | 2013-08-15 | The Board Of Trustees Of The Leland Stanford Junior University | Optical device |
| TWI460394B (zh) * | 2012-07-20 | 2014-11-11 | Test Research Inc | 三維影像量測裝置 |
| US9279663B2 (en) * | 2012-07-30 | 2016-03-08 | Kla-Tencor Corporation | Method and apparatus to fold optics in tools for measuring shape and/or thickness of a large and thin substrate |
| DE102012111835A1 (de) | 2012-12-05 | 2014-06-05 | Hseb Dresden Gmbh | Inspektionsvorrichtung |
| WO2014150232A1 (en) | 2013-03-15 | 2014-09-25 | The Board Of Trustees Of The Leland Stanford Junior University | Optical lens fabrication |
| US9696264B2 (en) * | 2013-04-03 | 2017-07-04 | Kla-Tencor Corporation | Apparatus and methods for determining defect depths in vertical stack memory |
| US9176070B2 (en) | 2014-04-07 | 2015-11-03 | Hseb Dresden Gmbh | Inspection assembly |
| US20170167986A1 (en) * | 2014-04-25 | 2017-06-15 | Gdt, Inc. | Cosmetic Evaluation Box for Used Electronics |
| JP6670561B2 (ja) * | 2014-07-17 | 2020-03-25 | オルボテック リミテッド | テレセントリック明視野および環状暗視野のシームレス融合型照明 |
| US9377596B2 (en) * | 2014-07-22 | 2016-06-28 | Unimicron Technology Corp. | Optical-electro circuit board, optical component and manufacturing method thereof |
| WO2016015734A1 (en) * | 2014-08-01 | 2016-02-04 | Dfm A/S | A scatterometer apparatus |
| KR101741659B1 (ko) | 2014-11-03 | 2017-05-31 | 주식회사 엠티엠 | 카메라 모듈 이물 검사를 위한 광원장치 |
| IL243167B (en) * | 2014-12-18 | 2021-02-28 | Gordon Noam | Multiple light sources that can be separated by optical inspection |
| IL243166B2 (en) * | 2014-12-18 | 2023-10-01 | Camtek Imaging Tech Suzhou Co Ltd | Modification of the optical properties of line-scan illumination depending on the light angle along the line axis |
| JP6024056B2 (ja) * | 2015-01-13 | 2016-11-09 | 新一 土坂 | 球面検査装置 |
| US10309907B2 (en) * | 2015-03-04 | 2019-06-04 | Kla-Tencor Corporation | All reflective wafer defect inspection and review systems and methods |
| EP3411694A4 (en) * | 2016-02-03 | 2019-09-04 | Kla-Tencor Corporation | WAFER DEFECT INSPECTION AND TESTING SYSTEMS |
| EP4036852A1 (en) | 2016-03-07 | 2022-08-03 | Assurant, Inc. | Screen damage detection for devices |
| EP3270144B1 (en) * | 2016-04-12 | 2021-12-15 | Nippon Steel Corporation | Inspection object imaging apparatus, inspection object imaging method, surface inspection apparatus, and surface inspection method |
| KR102233196B1 (ko) * | 2017-01-31 | 2021-03-26 | 제이에프이 스틸 가부시키가이샤 | 강재 형상 계측 장치 및 강재 형상 교정 장치 |
| US10422984B2 (en) * | 2017-05-12 | 2019-09-24 | Applied Materials, Inc. | Flexible mode scanning optical microscopy and inspection system |
| US11777603B2 (en) * | 2019-01-16 | 2023-10-03 | X Development Llc | High magnification afocal telescope with high index field curvature corrector |
| JP7175214B2 (ja) * | 2019-02-13 | 2022-11-18 | リコーインダストリアルソリューションズ株式会社 | 検査装置 |
| EP4032017B1 (en) | 2019-09-16 | 2025-11-12 | Assurant, Inc. | Method, apparatus, and computer program product for utilizing machine learning to process an image of a mobile device to determine a mobile device integrity status |
| US11580627B2 (en) | 2020-01-06 | 2023-02-14 | Assurant, Inc. | Systems and methods for automatically grading pre-owned electronic devices |
| WO2021216032A1 (en) * | 2020-04-20 | 2021-10-28 | Applied Materials, Inc. | Methods and apparatus for correcting lithography systems |
| US12339235B2 (en) | 2021-11-18 | 2025-06-24 | Onto Innovation Inc. | Simultaneous back and/or front and/or bulk defect detection |
| KR102830664B1 (ko) * | 2023-11-08 | 2025-07-07 | (주)뮤텍코리아 | 반도체 웨이퍼의 나노급 파티클 검사를 위한 광학 시스템 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003028621A (ja) | 2001-07-11 | 2003-01-29 | Nikon Corp | 表面欠陥検査装置 |
| JP2006514308A (ja) | 2003-02-26 | 2006-04-27 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | 同軸狭角暗視野照明 |
| JP2008026306A (ja) | 2006-06-20 | 2008-02-07 | Hoya Corp | パターン欠陥検査方法、パターン欠陥検査装置、フォトマスク製品の製造方法、及び表示デバイス用基板の製造方法 |
| JP2008064759A (ja) | 2006-09-07 | 2008-03-21 | Dr Schenk Gmbh Industriemesstechnik | 基板の表面エラーを光学的に検出する装置および方法 |
Family Cites Families (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2313460A (en) | 1940-01-23 | 1943-03-09 | Kapella Ltd | Compound microscope and lens system therefor |
| US2398276A (en) | 1945-02-05 | 1946-04-09 | Eastman Kodak Co | Variable power telescope |
| US2441036A (en) | 1945-02-14 | 1948-05-04 | Eastman Kodak Co | Lens system for telescopes |
| US2600805A (en) | 1951-02-08 | 1952-06-17 | Eastman Kodak Co | Telecentric objective of the reversed telephoto type |
| DE1012763B (de) | 1954-07-21 | 1957-07-25 | Leitz Ernst Gmbh | Mikroskopobjektiv fuer UEbersichtsbilder |
| US2952180A (en) | 1958-06-02 | 1960-09-13 | Eastman Kodak Co | Visual optical instrument having a combined reticle and field flattening element |
| US3176563A (en) * | 1962-02-02 | 1965-04-06 | Better Packages Inc | Tape serving machine |
| US4009945A (en) | 1963-09-05 | 1977-03-01 | Walter Klein | Microscope objective |
| US3437395A (en) | 1965-09-03 | 1969-04-08 | Bausch & Lomb | Optical system for inverted microscope |
| JPH07119888B2 (ja) | 1987-05-08 | 1995-12-20 | 株式会社ニコン | 再結像光学系 |
| US5058982A (en) * | 1989-06-21 | 1991-10-22 | Orbot Systems Ltd. | Illumination system and inspection apparatus including same |
| JPH0816765B2 (ja) | 1989-07-10 | 1996-02-21 | オリンパス光学工業株式会社 | 変倍ファインダー光学系 |
| JPH03249550A (ja) * | 1990-02-28 | 1991-11-07 | Mitsubishi Electric Corp | パターン欠陥検査装置 |
| JPH0493911A (ja) * | 1990-08-06 | 1992-03-26 | Nikon Corp | 無限系結像光学系 |
| JPH07306150A (ja) * | 1994-05-10 | 1995-11-21 | Kobe Steel Ltd | 逆反射スクリーンによる表面検査装置 |
| JP3386269B2 (ja) * | 1995-01-25 | 2003-03-17 | 株式会社ニュークリエイション | 光学検査装置 |
| US5804386A (en) * | 1997-01-15 | 1998-09-08 | Incyte Pharmaceuticals, Inc. | Sets of labeled energy transfer fluorescent primers and their use in multi component analysis |
| JP4527205B2 (ja) * | 1997-03-31 | 2010-08-18 | リアル・タイム・メトロジー,インコーポレーテッド | 光学検査モジュール、及び統合プロセス工具内で基板上の粒子及び欠陥を検出するための方法 |
| JP3169857B2 (ja) * | 1997-05-20 | 2001-05-28 | 島田理化工業株式会社 | 異物検出方法およびその装置 |
| JPH10333033A (ja) * | 1997-06-02 | 1998-12-18 | Olympus Optical Co Ltd | 実像式変倍ファインダー |
| JP3664593B2 (ja) * | 1998-11-06 | 2005-06-29 | 信越半導体株式会社 | 半導体ウエーハおよびその製造方法 |
| US6999183B2 (en) * | 1998-11-18 | 2006-02-14 | Kla-Tencor Corporation | Detection system for nanometer scale topographic measurements of reflective surfaces |
| DE19903486C2 (de) * | 1999-01-29 | 2003-03-06 | Leica Microsystems | Verfahren und Vorrichtung zur optischen Untersuchung von strukturierten Oberflächen von Objekten |
| JP2000338048A (ja) * | 1999-05-31 | 2000-12-08 | Hamamatsu Photonics Kk | 表面検査方法及び検査装置 |
| US6853446B1 (en) * | 1999-08-16 | 2005-02-08 | Applied Materials, Inc. | Variable angle illumination wafer inspection system |
| US7130039B2 (en) * | 2002-04-18 | 2006-10-31 | Kla-Tencor Technologies Corporation | Simultaneous multi-spot inspection and imaging |
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| US6788404B2 (en) * | 2002-07-17 | 2004-09-07 | Kla-Tencor Technologies Corporation | Inspection system with multiple illumination sources |
| DE10239548A1 (de) * | 2002-08-23 | 2004-03-04 | Leica Microsystems Semiconductor Gmbh | Vorrichtung und Verfahren zur Inspektion eines Objekts |
| US20040207836A1 (en) * | 2002-09-27 | 2004-10-21 | Rajeshwar Chhibber | High dynamic range optical inspection system and method |
| JP2004163240A (ja) * | 2002-11-13 | 2004-06-10 | Silicon Technology Co Ltd | 表面評価装置 |
| US7130036B1 (en) * | 2003-09-16 | 2006-10-31 | Kla-Tencor Technologies Corp. | Methods and systems for inspection of an entire wafer surface using multiple detection channels |
| US20050146719A1 (en) | 2003-09-26 | 2005-07-07 | Rajeshwar Chhibber | Method and apparatus for illuminating a substrate during inspection |
| US7351980B2 (en) * | 2005-03-31 | 2008-04-01 | Kla-Tencor Technologies Corp. | All-reflective optical systems for broadband wafer inspection |
| US7898524B2 (en) * | 2005-06-30 | 2011-03-01 | Logitech Europe S.A. | Optical displacement detection over varied surfaces |
| US7345825B2 (en) * | 2005-06-30 | 2008-03-18 | Kla-Tencor Technologies Corporation | Beam delivery system for laser dark-field illumination in a catadioptric optical system |
| US7725024B2 (en) * | 2005-07-08 | 2010-05-25 | Electro Scientific Industries, Inc. | Optimizing use and performance of optical systems implemented with telecentric on-axis dark field illumination |
| JP4723362B2 (ja) * | 2005-11-29 | 2011-07-13 | 株式会社日立ハイテクノロジーズ | 光学式検査装置及びその方法 |
| CN101021490B (zh) * | 2007-03-12 | 2012-11-14 | 3i系统公司 | 平面基板自动检测系统及方法 |
| US7782452B2 (en) * | 2007-08-31 | 2010-08-24 | Kla-Tencor Technologies Corp. | Systems and method for simultaneously inspecting a specimen with two distinct channels |
| DE112009000832T5 (de) * | 2008-04-04 | 2011-07-28 | Nanda Technologies GmbH, 85716 | System und Verfahren zur optischen Inspektion |
-
2009
- 2009-04-03 DE DE112009000832T patent/DE112009000832T5/de not_active Withdrawn
- 2009-04-03 KR KR1020107022152A patent/KR101697240B1/ko not_active Expired - Fee Related
- 2009-04-03 WO PCT/EP2009/002482 patent/WO2009121628A2/en not_active Ceased
- 2009-04-03 CN CN2009801160931A patent/CN102016554B/zh not_active Expired - Fee Related
- 2009-04-03 JP JP2011502299A patent/JP5749641B2/ja not_active Expired - Fee Related
- 2009-04-03 TW TW098111147A patent/TWI479583B/zh not_active IP Right Cessation
-
2010
- 2010-03-01 US US12/715,246 patent/US8072591B2/en active Active
- 2010-10-29 US US12/916,315 patent/US8345232B2/en not_active Expired - Fee Related
- 2010-10-29 US US12/916,336 patent/US8102521B2/en not_active Expired - Fee Related
-
2011
- 2011-10-20 US US13/277,986 patent/US8368881B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003028621A (ja) | 2001-07-11 | 2003-01-29 | Nikon Corp | 表面欠陥検査装置 |
| JP2006514308A (ja) | 2003-02-26 | 2006-04-27 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | 同軸狭角暗視野照明 |
| JP2008026306A (ja) | 2006-06-20 | 2008-02-07 | Hoya Corp | パターン欠陥検査方法、パターン欠陥検査装置、フォトマスク製品の製造方法、及び表示デバイス用基板の製造方法 |
| JP2008064759A (ja) | 2006-09-07 | 2008-03-21 | Dr Schenk Gmbh Industriemesstechnik | 基板の表面エラーを光学的に検出する装置および方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US8072591B2 (en) | 2011-12-06 |
| US8368881B2 (en) | 2013-02-05 |
| US20110043798A1 (en) | 2011-02-24 |
| US20110043796A1 (en) | 2011-02-24 |
| US20120133760A1 (en) | 2012-05-31 |
| CN102016554B (zh) | 2013-01-30 |
| US8345232B2 (en) | 2013-01-01 |
| US20100231902A1 (en) | 2010-09-16 |
| US8102521B2 (en) | 2012-01-24 |
| TWI479583B (zh) | 2015-04-01 |
| TW200952102A (en) | 2009-12-16 |
| KR20110000560A (ko) | 2011-01-03 |
| CN102016554A (zh) | 2011-04-13 |
| JP5749641B2 (ja) | 2015-07-15 |
| JP2011516844A (ja) | 2011-05-26 |
| WO2009121628A2 (en) | 2009-10-08 |
| DE112009000832T5 (de) | 2011-07-28 |
| WO2009121628A9 (en) | 2009-11-26 |
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