JP5749641B2 - 光学検査システム及び方法 - Google Patents
光学検査システム及び方法 Download PDFInfo
- Publication number
- JP5749641B2 JP5749641B2 JP2011502299A JP2011502299A JP5749641B2 JP 5749641 B2 JP5749641 B2 JP 5749641B2 JP 2011502299 A JP2011502299 A JP 2011502299A JP 2011502299 A JP2011502299 A JP 2011502299A JP 5749641 B2 JP5749641 B2 JP 5749641B2
- Authority
- JP
- Japan
- Prior art keywords
- beam path
- light
- dark field
- inspection system
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003287 optical effect Effects 0.000 title claims description 80
- 238000007689 inspection Methods 0.000 title claims description 78
- 238000000034 method Methods 0.000 title description 15
- 238000003384 imaging method Methods 0.000 claims description 100
- 238000005286 illumination Methods 0.000 claims description 61
- 230000005855 radiation Effects 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 18
- 239000004065 semiconductor Substances 0.000 claims description 16
- 239000011358 absorbing material Substances 0.000 claims description 7
- 230000008859 change Effects 0.000 claims description 5
- 230000031700 light absorption Effects 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000002834 transmittance Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 118
- 230000007547 defect Effects 0.000 description 23
- 238000010586 diagram Methods 0.000 description 11
- 238000005452 bending Methods 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 230000000737 periodic effect Effects 0.000 description 8
- 230000008901 benefit Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000013307 optical fiber Substances 0.000 description 4
- 239000006096 absorbing agent Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 210000001747 pupil Anatomy 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 230000001154 acute effect Effects 0.000 description 2
- 239000006117 anti-reflective coating Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000012472 biological sample Substances 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8822—Dark field detection
- G01N2021/8825—Separate detection of dark field and bright field
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US6494908P | 2008-04-04 | 2008-04-04 | |
| US61/064,949 | 2008-04-04 | ||
| PCT/EP2009/002482 WO2009121628A2 (en) | 2008-04-04 | 2009-04-03 | Optical inspection system and method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011516844A JP2011516844A (ja) | 2011-05-26 |
| JP2011516844A5 JP2011516844A5 (enExample) | 2012-05-24 |
| JP5749641B2 true JP5749641B2 (ja) | 2015-07-15 |
Family
ID=41059655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011502299A Expired - Fee Related JP5749641B2 (ja) | 2008-04-04 | 2009-04-03 | 光学検査システム及び方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (4) | US8072591B2 (enExample) |
| JP (1) | JP5749641B2 (enExample) |
| KR (1) | KR101697240B1 (enExample) |
| CN (1) | CN102016554B (enExample) |
| DE (1) | DE112009000832T5 (enExample) |
| TW (1) | TWI479583B (enExample) |
| WO (1) | WO2009121628A2 (enExample) |
Families Citing this family (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112009000832T5 (de) | 2008-04-04 | 2011-07-28 | Nanda Technologies GmbH, 85716 | System und Verfahren zur optischen Inspektion |
| CN101963741B (zh) * | 2009-07-23 | 2013-10-09 | 鸿富锦精密工业(深圳)有限公司 | 摄像模组及采用该摄像模组的便携式电子装置 |
| EP2339331A1 (en) | 2009-12-23 | 2011-06-29 | Nanda Technologies GmbH | Inspection and positioning systems and methods |
| JP2011203245A (ja) * | 2010-03-02 | 2011-10-13 | You-Na Tech Corp | 半導体ウェハの表面検査システム及び表面検査方法 |
| EP2378548A1 (en) | 2010-04-19 | 2011-10-19 | Nanda Technologies GmbH | Methods of processing and inspecting semiconductor substrates |
| EP2381246A1 (en) * | 2010-04-26 | 2011-10-26 | Becton Dickinson France | Device, kit and method for inspection of an article |
| CN102269858A (zh) * | 2010-06-02 | 2011-12-07 | 北京智朗芯光科技有限公司 | 自动聚焦系统和自动聚焦方法 |
| EP2609419A1 (en) | 2010-08-24 | 2013-07-03 | Nanda Technologies GmbH | Methods and systems for inspecting bonded wafers |
| US8501503B2 (en) | 2011-04-28 | 2013-08-06 | Nanda Technologies Gmbh | Methods of inspecting and manufacturing semiconductor wafers |
| DE102011051355A1 (de) | 2011-06-27 | 2012-12-27 | Hseb Dresden Gmbh | Inspektionsvorrichtung |
| US9213156B2 (en) * | 2011-08-17 | 2015-12-15 | Source Photonics, Inc. | Optical receiver with reduced cavity size and methods of making and using the same |
| WO2013070982A1 (en) * | 2011-11-08 | 2013-05-16 | The Trustees Of Columbia University In The City Of New York | Systems and methods for simultaneous multi-directional imaging for capturing tomographic data |
| US10088413B2 (en) * | 2011-11-21 | 2018-10-02 | Kla-Tencor Corporation | Spectral matching based calibration |
| WO2013120091A1 (en) * | 2012-02-10 | 2013-08-15 | The Board Of Trustees Of The Leland Stanford Junior University | Optical device |
| TWI460394B (zh) * | 2012-07-20 | 2014-11-11 | Test Research Inc | 三維影像量測裝置 |
| US9279663B2 (en) * | 2012-07-30 | 2016-03-08 | Kla-Tencor Corporation | Method and apparatus to fold optics in tools for measuring shape and/or thickness of a large and thin substrate |
| DE102012111835A1 (de) | 2012-12-05 | 2014-06-05 | Hseb Dresden Gmbh | Inspektionsvorrichtung |
| WO2014150232A1 (en) | 2013-03-15 | 2014-09-25 | The Board Of Trustees Of The Leland Stanford Junior University | Optical lens fabrication |
| US9696264B2 (en) * | 2013-04-03 | 2017-07-04 | Kla-Tencor Corporation | Apparatus and methods for determining defect depths in vertical stack memory |
| US9176070B2 (en) | 2014-04-07 | 2015-11-03 | Hseb Dresden Gmbh | Inspection assembly |
| US20170167986A1 (en) * | 2014-04-25 | 2017-06-15 | Gdt, Inc. | Cosmetic Evaluation Box for Used Electronics |
| JP6670561B2 (ja) * | 2014-07-17 | 2020-03-25 | オルボテック リミテッド | テレセントリック明視野および環状暗視野のシームレス融合型照明 |
| US9377596B2 (en) * | 2014-07-22 | 2016-06-28 | Unimicron Technology Corp. | Optical-electro circuit board, optical component and manufacturing method thereof |
| WO2016015734A1 (en) * | 2014-08-01 | 2016-02-04 | Dfm A/S | A scatterometer apparatus |
| KR101741659B1 (ko) | 2014-11-03 | 2017-05-31 | 주식회사 엠티엠 | 카메라 모듈 이물 검사를 위한 광원장치 |
| IL243167B (en) * | 2014-12-18 | 2021-02-28 | Gordon Noam | Multiple light sources that can be separated by optical inspection |
| IL243166B2 (en) * | 2014-12-18 | 2023-10-01 | Camtek Imaging Tech Suzhou Co Ltd | Modification of the optical properties of line-scan illumination depending on the light angle along the line axis |
| JP6024056B2 (ja) * | 2015-01-13 | 2016-11-09 | 新一 土坂 | 球面検査装置 |
| US10309907B2 (en) * | 2015-03-04 | 2019-06-04 | Kla-Tencor Corporation | All reflective wafer defect inspection and review systems and methods |
| EP3411694A4 (en) * | 2016-02-03 | 2019-09-04 | Kla-Tencor Corporation | WAFER DEFECT INSPECTION AND TESTING SYSTEMS |
| EP4036852A1 (en) | 2016-03-07 | 2022-08-03 | Assurant, Inc. | Screen damage detection for devices |
| EP3270144B1 (en) * | 2016-04-12 | 2021-12-15 | Nippon Steel Corporation | Inspection object imaging apparatus, inspection object imaging method, surface inspection apparatus, and surface inspection method |
| KR102233196B1 (ko) * | 2017-01-31 | 2021-03-26 | 제이에프이 스틸 가부시키가이샤 | 강재 형상 계측 장치 및 강재 형상 교정 장치 |
| US10422984B2 (en) * | 2017-05-12 | 2019-09-24 | Applied Materials, Inc. | Flexible mode scanning optical microscopy and inspection system |
| US11777603B2 (en) * | 2019-01-16 | 2023-10-03 | X Development Llc | High magnification afocal telescope with high index field curvature corrector |
| JP7175214B2 (ja) * | 2019-02-13 | 2022-11-18 | リコーインダストリアルソリューションズ株式会社 | 検査装置 |
| EP4032017B1 (en) | 2019-09-16 | 2025-11-12 | Assurant, Inc. | Method, apparatus, and computer program product for utilizing machine learning to process an image of a mobile device to determine a mobile device integrity status |
| US11580627B2 (en) | 2020-01-06 | 2023-02-14 | Assurant, Inc. | Systems and methods for automatically grading pre-owned electronic devices |
| WO2021216032A1 (en) * | 2020-04-20 | 2021-10-28 | Applied Materials, Inc. | Methods and apparatus for correcting lithography systems |
| US12339235B2 (en) | 2021-11-18 | 2025-06-24 | Onto Innovation Inc. | Simultaneous back and/or front and/or bulk defect detection |
| KR102830664B1 (ko) * | 2023-11-08 | 2025-07-07 | (주)뮤텍코리아 | 반도체 웨이퍼의 나노급 파티클 검사를 위한 광학 시스템 |
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| US2600805A (en) | 1951-02-08 | 1952-06-17 | Eastman Kodak Co | Telecentric objective of the reversed telephoto type |
| DE1012763B (de) | 1954-07-21 | 1957-07-25 | Leitz Ernst Gmbh | Mikroskopobjektiv fuer UEbersichtsbilder |
| US2952180A (en) | 1958-06-02 | 1960-09-13 | Eastman Kodak Co | Visual optical instrument having a combined reticle and field flattening element |
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| JPH03249550A (ja) * | 1990-02-28 | 1991-11-07 | Mitsubishi Electric Corp | パターン欠陥検査装置 |
| JPH0493911A (ja) * | 1990-08-06 | 1992-03-26 | Nikon Corp | 無限系結像光学系 |
| JPH07306150A (ja) * | 1994-05-10 | 1995-11-21 | Kobe Steel Ltd | 逆反射スクリーンによる表面検査装置 |
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| JP5288672B2 (ja) * | 2001-07-11 | 2013-09-11 | 株式会社ニコン | 表面欠陥検査装置 |
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| US6788404B2 (en) * | 2002-07-17 | 2004-09-07 | Kla-Tencor Technologies Corporation | Inspection system with multiple illumination sources |
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| JP2004163240A (ja) * | 2002-11-13 | 2004-06-10 | Silicon Technology Co Ltd | 表面評価装置 |
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| US7130036B1 (en) * | 2003-09-16 | 2006-10-31 | Kla-Tencor Technologies Corp. | Methods and systems for inspection of an entire wafer surface using multiple detection channels |
| US20050146719A1 (en) | 2003-09-26 | 2005-07-07 | Rajeshwar Chhibber | Method and apparatus for illuminating a substrate during inspection |
| US7351980B2 (en) * | 2005-03-31 | 2008-04-01 | Kla-Tencor Technologies Corp. | All-reflective optical systems for broadband wafer inspection |
| US7898524B2 (en) * | 2005-06-30 | 2011-03-01 | Logitech Europe S.A. | Optical displacement detection over varied surfaces |
| US7345825B2 (en) * | 2005-06-30 | 2008-03-18 | Kla-Tencor Technologies Corporation | Beam delivery system for laser dark-field illumination in a catadioptric optical system |
| US7725024B2 (en) * | 2005-07-08 | 2010-05-25 | Electro Scientific Industries, Inc. | Optimizing use and performance of optical systems implemented with telecentric on-axis dark field illumination |
| JP4723362B2 (ja) * | 2005-11-29 | 2011-07-13 | 株式会社日立ハイテクノロジーズ | 光学式検査装置及びその方法 |
| JP4949928B2 (ja) * | 2006-06-20 | 2012-06-13 | Hoya株式会社 | パターン欠陥検査方法、パターン欠陥検査装置、フォトマスク製品の製造方法、及び表示デバイス用基板の製造方法 |
| DE102006042117A1 (de) * | 2006-09-07 | 2008-03-27 | Dr. Schenk Gmbh Industriemesstechnik | Vorrichtung zur optischen Detektion eines Oberflächenfehlers eines Substrats |
| CN101021490B (zh) * | 2007-03-12 | 2012-11-14 | 3i系统公司 | 平面基板自动检测系统及方法 |
| US7782452B2 (en) * | 2007-08-31 | 2010-08-24 | Kla-Tencor Technologies Corp. | Systems and method for simultaneously inspecting a specimen with two distinct channels |
| DE112009000832T5 (de) * | 2008-04-04 | 2011-07-28 | Nanda Technologies GmbH, 85716 | System und Verfahren zur optischen Inspektion |
-
2009
- 2009-04-03 DE DE112009000832T patent/DE112009000832T5/de not_active Withdrawn
- 2009-04-03 KR KR1020107022152A patent/KR101697240B1/ko not_active Expired - Fee Related
- 2009-04-03 WO PCT/EP2009/002482 patent/WO2009121628A2/en not_active Ceased
- 2009-04-03 CN CN2009801160931A patent/CN102016554B/zh not_active Expired - Fee Related
- 2009-04-03 JP JP2011502299A patent/JP5749641B2/ja not_active Expired - Fee Related
- 2009-04-03 TW TW098111147A patent/TWI479583B/zh not_active IP Right Cessation
-
2010
- 2010-03-01 US US12/715,246 patent/US8072591B2/en active Active
- 2010-10-29 US US12/916,315 patent/US8345232B2/en not_active Expired - Fee Related
- 2010-10-29 US US12/916,336 patent/US8102521B2/en not_active Expired - Fee Related
-
2011
- 2011-10-20 US US13/277,986 patent/US8368881B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US8072591B2 (en) | 2011-12-06 |
| US8368881B2 (en) | 2013-02-05 |
| KR101697240B1 (ko) | 2017-01-17 |
| US20110043798A1 (en) | 2011-02-24 |
| US20110043796A1 (en) | 2011-02-24 |
| US20120133760A1 (en) | 2012-05-31 |
| CN102016554B (zh) | 2013-01-30 |
| US8345232B2 (en) | 2013-01-01 |
| US20100231902A1 (en) | 2010-09-16 |
| US8102521B2 (en) | 2012-01-24 |
| TWI479583B (zh) | 2015-04-01 |
| TW200952102A (en) | 2009-12-16 |
| KR20110000560A (ko) | 2011-01-03 |
| CN102016554A (zh) | 2011-04-13 |
| JP2011516844A (ja) | 2011-05-26 |
| WO2009121628A2 (en) | 2009-10-08 |
| DE112009000832T5 (de) | 2011-07-28 |
| WO2009121628A9 (en) | 2009-11-26 |
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Legal Events
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