DE112009000832T5 - System und Verfahren zur optischen Inspektion - Google Patents

System und Verfahren zur optischen Inspektion Download PDF

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Publication number
DE112009000832T5
DE112009000832T5 DE112009000832T DE112009000832T DE112009000832T5 DE 112009000832 T5 DE112009000832 T5 DE 112009000832T5 DE 112009000832 T DE112009000832 T DE 112009000832T DE 112009000832 T DE112009000832 T DE 112009000832T DE 112009000832 T5 DE112009000832 T5 DE 112009000832T5
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DE
Germany
Prior art keywords
beam path
lens
plane
object plane
imaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112009000832T
Other languages
German (de)
English (en)
Inventor
Lars Dr. 85778 Markwort
Rajeshwar Calif. Chhibber
Klaus 94116 Eckerl
Norbert Dr. 94116 Harendt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanda Technologies GmbH
Original Assignee
Nanda Technologies GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanda Technologies GmbH filed Critical Nanda Technologies GmbH
Publication of DE112009000832T5 publication Critical patent/DE112009000832T5/de
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G01N2021/8825—Separate detection of dark field and bright field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE112009000832T 2008-04-04 2009-04-03 System und Verfahren zur optischen Inspektion Withdrawn DE112009000832T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US6494908P 2008-04-04 2008-04-04
US61/064,949 2008-04-04
PCT/EP2009/002482 WO2009121628A2 (en) 2008-04-04 2009-04-03 Optical inspection system and method

Publications (1)

Publication Number Publication Date
DE112009000832T5 true DE112009000832T5 (de) 2011-07-28

Family

ID=41059655

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112009000832T Withdrawn DE112009000832T5 (de) 2008-04-04 2009-04-03 System und Verfahren zur optischen Inspektion

Country Status (7)

Country Link
US (4) US8072591B2 (enExample)
JP (1) JP5749641B2 (enExample)
KR (1) KR101697240B1 (enExample)
CN (1) CN102016554B (enExample)
DE (1) DE112009000832T5 (enExample)
TW (1) TWI479583B (enExample)
WO (1) WO2009121628A2 (enExample)

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JP2011203245A (ja) * 2010-03-02 2011-10-13 You-Na Tech Corp 半導体ウェハの表面検査システム及び表面検査方法
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EP2381246A1 (en) * 2010-04-26 2011-10-26 Becton Dickinson France Device, kit and method for inspection of an article
CN102269858A (zh) * 2010-06-02 2011-12-07 北京智朗芯光科技有限公司 自动聚焦系统和自动聚焦方法
EP2609419A1 (en) 2010-08-24 2013-07-03 Nanda Technologies GmbH Methods and systems for inspecting bonded wafers
US8501503B2 (en) 2011-04-28 2013-08-06 Nanda Technologies Gmbh Methods of inspecting and manufacturing semiconductor wafers
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US9213156B2 (en) 2011-08-17 2015-12-15 Source Photonics, Inc. Optical receiver with reduced cavity size and methods of making and using the same
JP2014535056A (ja) * 2011-11-08 2014-12-25 ザ・トラスティーズ・オブ・コロンビア・ユニバーシティ・イン・ザ・シティ・オブ・ニューヨーク トモグラフィのデータを取り込むための同時多方向イメージングに向けたシステムと方法
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US9279663B2 (en) * 2012-07-30 2016-03-08 Kla-Tencor Corporation Method and apparatus to fold optics in tools for measuring shape and/or thickness of a large and thin substrate
DE102012111835A1 (de) 2012-12-05 2014-06-05 Hseb Dresden Gmbh Inspektionsvorrichtung
US9810892B2 (en) 2013-03-15 2017-11-07 The Board Of Trustees Of The Leland Stanford Junior University Optical lens fabrication
US9696264B2 (en) * 2013-04-03 2017-07-04 Kla-Tencor Corporation Apparatus and methods for determining defect depths in vertical stack memory
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JP6670561B2 (ja) * 2014-07-17 2020-03-25 オルボテック リミテッド テレセントリック明視野および環状暗視野のシームレス融合型照明
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IL243166B2 (en) * 2014-12-18 2023-10-01 Camtek Imaging Tech Suzhou Co Ltd Modification of the optical properties of line-scan illumination depending on the light angle along the line axis
JP6024056B2 (ja) * 2015-01-13 2016-11-09 新一 土坂 球面検査装置
US10309907B2 (en) * 2015-03-04 2019-06-04 Kla-Tencor Corporation All reflective wafer defect inspection and review systems and methods
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WO2017156046A1 (en) 2016-03-07 2017-09-14 Hyla, Inc. Screen damage detection for devices
US10281408B2 (en) * 2016-04-12 2019-05-07 Nippon Steel & Sumitomo Metal Corporation Inspection object imaging apparatus, inspection object imaging method, surface inspection apparatus, and surface inspection method
KR102233196B1 (ko) 2017-01-31 2021-03-26 제이에프이 스틸 가부시키가이샤 강재 형상 계측 장치 및 강재 형상 교정 장치
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JP7175214B2 (ja) * 2019-02-13 2022-11-18 リコーインダストリアルソリューションズ株式会社 検査装置
JP7665601B2 (ja) 2019-09-16 2025-04-21 アシュラント インコーポレイテッド モバイルデバイスの完全性状態を判断するために機械学習を利用してモバイルデバイスの画像を処理するためのシステム、方法、装置、および持続性コンピュータ可読記憶媒体
US11580627B2 (en) 2020-01-06 2023-02-14 Assurant, Inc. Systems and methods for automatically grading pre-owned electronic devices
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Also Published As

Publication number Publication date
WO2009121628A9 (en) 2009-11-26
KR20110000560A (ko) 2011-01-03
TW200952102A (en) 2009-12-16
US8368881B2 (en) 2013-02-05
US8102521B2 (en) 2012-01-24
WO2009121628A2 (en) 2009-10-08
US20110043796A1 (en) 2011-02-24
US20100231902A1 (en) 2010-09-16
US8345232B2 (en) 2013-01-01
CN102016554B (zh) 2013-01-30
JP5749641B2 (ja) 2015-07-15
US8072591B2 (en) 2011-12-06
CN102016554A (zh) 2011-04-13
KR101697240B1 (ko) 2017-01-17
JP2011516844A (ja) 2011-05-26
US20110043798A1 (en) 2011-02-24
TWI479583B (zh) 2015-04-01
US20120133760A1 (en) 2012-05-31

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Date Code Title Description
R012 Request for examination validly filed
R005 Application deemed withdrawn due to failure to request examination
R409 Internal rectification of the legal status completed
R409 Internal rectification of the legal status completed
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee