TWI479583B - 光學檢驗的系統與方法 - Google Patents

光學檢驗的系統與方法 Download PDF

Info

Publication number
TWI479583B
TWI479583B TW098111147A TW98111147A TWI479583B TW I479583 B TWI479583 B TW I479583B TW 098111147 A TW098111147 A TW 098111147A TW 98111147 A TW98111147 A TW 98111147A TW I479583 B TWI479583 B TW I479583B
Authority
TW
Taiwan
Prior art keywords
plane
beam path
lens
imaging
optical system
Prior art date
Application number
TW098111147A
Other languages
English (en)
Chinese (zh)
Other versions
TW200952102A (en
Inventor
Lars Markwort
Rajeshwar Chhibber
Klaus Eckerl
Norbert Harendt
Original Assignee
Nanda Technologies Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanda Technologies Gmbh filed Critical Nanda Technologies Gmbh
Publication of TW200952102A publication Critical patent/TW200952102A/zh
Application granted granted Critical
Publication of TWI479583B publication Critical patent/TWI479583B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G01N2021/8825—Separate detection of dark field and bright field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW098111147A 2008-04-04 2009-04-03 光學檢驗的系統與方法 TWI479583B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US6494908P 2008-04-04 2008-04-04

Publications (2)

Publication Number Publication Date
TW200952102A TW200952102A (en) 2009-12-16
TWI479583B true TWI479583B (zh) 2015-04-01

Family

ID=41059655

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098111147A TWI479583B (zh) 2008-04-04 2009-04-03 光學檢驗的系統與方法

Country Status (7)

Country Link
US (4) US8072591B2 (enExample)
JP (1) JP5749641B2 (enExample)
KR (1) KR101697240B1 (enExample)
CN (1) CN102016554B (enExample)
DE (1) DE112009000832T5 (enExample)
TW (1) TWI479583B (enExample)
WO (1) WO2009121628A2 (enExample)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112009000832T5 (de) 2008-04-04 2011-07-28 Nanda Technologies GmbH, 85716 System und Verfahren zur optischen Inspektion
CN101963741B (zh) * 2009-07-23 2013-10-09 鸿富锦精密工业（深圳）有限公司 摄像模组及采用该摄像模组的便携式电子装置
EP2339331A1 (en) 2009-12-23 2011-06-29 Nanda Technologies GmbH Inspection and positioning systems and methods
JP2011203245A (ja) * 2010-03-02 2011-10-13 You-Na Tech Corp 半導体ウェハの表面検査システム及び表面検査方法
EP2378548A1 (en) 2010-04-19 2011-10-19 Nanda Technologies GmbH Methods of processing and inspecting semiconductor substrates
EP2381246A1 (en) * 2010-04-26 2011-10-26 Becton Dickinson France Device, kit and method for inspection of an article
CN102269858A (zh) * 2010-06-02 2011-12-07 北京智朗芯光科技有限公司 自动聚焦系统和自动聚焦方法
EP2609419A1 (en) 2010-08-24 2013-07-03 Nanda Technologies GmbH Methods and systems for inspecting bonded wafers
US8501503B2 (en) 2011-04-28 2013-08-06 Nanda Technologies Gmbh Methods of inspecting and manufacturing semiconductor wafers
DE102011051355A1 (de) 2011-06-27 2012-12-27 Hseb Dresden Gmbh Inspektionsvorrichtung
US9213156B2 (en) * 2011-08-17 2015-12-15 Source Photonics, Inc. Optical receiver with reduced cavity size and methods of making and using the same
WO2013070982A1 (en) * 2011-11-08 2013-05-16 The Trustees Of Columbia University In The City Of New York Systems and methods for simultaneous multi-directional imaging for capturing tomographic data
US10088413B2 (en) * 2011-11-21 2018-10-02 Kla-Tencor Corporation Spectral matching based calibration
WO2013120091A1 (en) * 2012-02-10 2013-08-15 The Board Of Trustees Of The Leland Stanford Junior University Optical device
TWI460394B (zh) * 2012-07-20 2014-11-11 Test Research Inc 三維影像量測裝置
US9279663B2 (en) * 2012-07-30 2016-03-08 Kla-Tencor Corporation Method and apparatus to fold optics in tools for measuring shape and/or thickness of a large and thin substrate
DE102012111835A1 (de) 2012-12-05 2014-06-05 Hseb Dresden Gmbh Inspektionsvorrichtung
WO2014150232A1 (en) 2013-03-15 2014-09-25 The Board Of Trustees Of The Leland Stanford Junior University Optical lens fabrication
US9696264B2 (en) * 2013-04-03 2017-07-04 Kla-Tencor Corporation Apparatus and methods for determining defect depths in vertical stack memory
US9176070B2 (en) 2014-04-07 2015-11-03 Hseb Dresden Gmbh Inspection assembly
US20170167986A1 (en) * 2014-04-25 2017-06-15 Gdt, Inc. Cosmetic Evaluation Box for Used Electronics
JP6670561B2 (ja) * 2014-07-17 2020-03-25 オルボテック リミテッド テレセントリック明視野および環状暗視野のシームレス融合型照明
US9377596B2 (en) * 2014-07-22 2016-06-28 Unimicron Technology Corp. Optical-electro circuit board, optical component and manufacturing method thereof
WO2016015734A1 (en) * 2014-08-01 2016-02-04 Dfm A/S A scatterometer apparatus
KR101741659B1 (ko) 2014-11-03 2017-05-31 주식회사 엠티엠 카메라 모듈 이물 검사를 위한 광원장치
IL243167B (en) * 2014-12-18 2021-02-28 Gordon Noam Multiple light sources that can be separated by optical inspection
IL243166B2 (en) * 2014-12-18 2023-10-01 Camtek Imaging Tech Suzhou Co Ltd Modification of the optical properties of line-scan illumination depending on the light angle along the line axis
JP6024056B2 (ja) * 2015-01-13 2016-11-09 新一 土坂 球面検査装置
US10309907B2 (en) * 2015-03-04 2019-06-04 Kla-Tencor Corporation All reflective wafer defect inspection and review systems and methods
EP3411694A4 (en) * 2016-02-03 2019-09-04 Kla-Tencor Corporation WAFER DEFECT INSPECTION AND TESTING SYSTEMS
EP4036852A1 (en) 2016-03-07 2022-08-03 Assurant, Inc. Screen damage detection for devices
EP3270144B1 (en) * 2016-04-12 2021-12-15 Nippon Steel Corporation Inspection object imaging apparatus, inspection object imaging method, surface inspection apparatus, and surface inspection method
KR102233196B1 (ko) * 2017-01-31 2021-03-26 제이에프이 스틸 가부시키가이샤 강재 형상 계측 장치 및 강재 형상 교정 장치
US10422984B2 (en) * 2017-05-12 2019-09-24 Applied Materials, Inc. Flexible mode scanning optical microscopy and inspection system
US11777603B2 (en) * 2019-01-16 2023-10-03 X Development Llc High magnification afocal telescope with high index field curvature corrector
JP7175214B2 (ja) * 2019-02-13 2022-11-18 リコーインダストリアルソリューションズ株式会社 検査装置
EP4032017B1 (en) 2019-09-16 2025-11-12 Assurant, Inc. Method, apparatus, and computer program product for utilizing machine learning to process an image of a mobile device to determine a mobile device integrity status
US11580627B2 (en) 2020-01-06 2023-02-14 Assurant, Inc. Systems and methods for automatically grading pre-owned electronic devices
WO2021216032A1 (en) * 2020-04-20 2021-10-28 Applied Materials, Inc. Methods and apparatus for correcting lithography systems
US12339235B2 (en) 2021-11-18 2025-06-24 Onto Innovation Inc. Simultaneous back and/or front and/or bulk defect detection
KR102830664B1 (ko) * 2023-11-08 2025-07-07 (주)뮤텍코리아 반도체 웨이퍼의 나노급 파티클 검사를 위한 광학 시스템

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5175652A (en) * 1990-08-06 1992-12-29 Nikon Corporation Imaging optical system
US6256144B1 (en) * 1997-06-02 2001-07-03 Olympus Optical Co., Ltd. Real image mode variable magnification finder
US6491836B1 (en) * 1998-11-06 2002-12-10 Shin-Etsu Handotai Co., Ltd. Semiconductor wafer and production method therefor
US20040207836A1 (en) * 2002-09-27 2004-10-21 Rajeshwar Chhibber High dynamic range optical inspection system and method
US20060219930A1 (en) * 2005-03-31 2006-10-05 Lange Steven R All-reflective optical systems for broadband wafer inspection
US20070013661A1 (en) * 2005-06-30 2007-01-18 Olivier Theytaz Optical displacement detection over varied surfaces
US7312432B2 (en) * 2002-07-08 2007-12-25 Dmetrix, Inc. Single axis illumination for multi-axis imaging system

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2313460A (en) 1940-01-23 1943-03-09 Kapella Ltd Compound microscope and lens system therefor
US2398276A (en) 1945-02-05 1946-04-09 Eastman Kodak Co Variable power telescope
US2441036A (en) 1945-02-14 1948-05-04 Eastman Kodak Co Lens system for telescopes
US2600805A (en) 1951-02-08 1952-06-17 Eastman Kodak Co Telecentric objective of the reversed telephoto type
DE1012763B (de) 1954-07-21 1957-07-25 Leitz Ernst Gmbh Mikroskopobjektiv fuer UEbersichtsbilder
US2952180A (en) 1958-06-02 1960-09-13 Eastman Kodak Co Visual optical instrument having a combined reticle and field flattening element
US3176563A (en) * 1962-02-02 1965-04-06 Better Packages Inc Tape serving machine
US4009945A (en) 1963-09-05 1977-03-01 Walter Klein Microscope objective
US3437395A (en) 1965-09-03 1969-04-08 Bausch & Lomb Optical system for inverted microscope
JPH07119888B2 (ja) 1987-05-08 1995-12-20 株式会社ニコン 再結像光学系
US5058982A (en) * 1989-06-21 1991-10-22 Orbot Systems Ltd. Illumination system and inspection apparatus including same
JPH0816765B2 (ja) 1989-07-10 1996-02-21 オリンパス光学工業株式会社 変倍ファインダー光学系
JPH03249550A (ja) * 1990-02-28 1991-11-07 Mitsubishi Electric Corp パターン欠陥検査装置
JPH07306150A (ja) * 1994-05-10 1995-11-21 Kobe Steel Ltd 逆反射スクリーンによる表面検査装置
JP3386269B2 (ja) * 1995-01-25 2003-03-17 株式会社ニュークリエイション 光学検査装置
US5804386A (en) * 1997-01-15 1998-09-08 Incyte Pharmaceuticals, Inc. Sets of labeled energy transfer fluorescent primers and their use in multi component analysis
JP4527205B2 (ja) * 1997-03-31 2010-08-18 リアル・タイム・メトロジー，インコーポレーテッド 光学検査モジュール、及び統合プロセス工具内で基板上の粒子及び欠陥を検出するための方法
JP3169857B2 (ja) * 1997-05-20 2001-05-28 島田理化工業株式会社 異物検出方法およびその装置
US6999183B2 (en) * 1998-11-18 2006-02-14 Kla-Tencor Corporation Detection system for nanometer scale topographic measurements of reflective surfaces
DE19903486C2 (de) * 1999-01-29 2003-03-06 Leica Microsystems Verfahren und Vorrichtung zur optischen Untersuchung von strukturierten Oberflächen von Objekten
JP2000338048A (ja) * 1999-05-31 2000-12-08 Hamamatsu Photonics Kk 表面検査方法及び検査装置
US6853446B1 (en) * 1999-08-16 2005-02-08 Applied Materials, Inc. Variable angle illumination wafer inspection system
JP5288672B2 (ja) * 2001-07-11 2013-09-11 株式会社ニコン 表面欠陥検査装置
US7130039B2 (en) * 2002-04-18 2006-10-31 Kla-Tencor Technologies Corporation Simultaneous multi-spot inspection and imaging
US6788404B2 (en) * 2002-07-17 2004-09-07 Kla-Tencor Technologies Corporation Inspection system with multiple illumination sources
DE10239548A1 (de) * 2002-08-23 2004-03-04 Leica Microsystems Semiconductor Gmbh Vorrichtung und Verfahren zur Inspektion eines Objekts
JP2004163240A (ja) * 2002-11-13 2004-06-10 Silicon Technology Co Ltd 表面評価装置
US6870949B2 (en) * 2003-02-26 2005-03-22 Electro Scientific Industries Coaxial narrow angle dark field lighting
US7130036B1 (en) * 2003-09-16 2006-10-31 Kla-Tencor Technologies Corp. Methods and systems for inspection of an entire wafer surface using multiple detection channels
US20050146719A1 (en) 2003-09-26 2005-07-07 Rajeshwar Chhibber Method and apparatus for illuminating a substrate during inspection
US7345825B2 (en) * 2005-06-30 2008-03-18 Kla-Tencor Technologies Corporation Beam delivery system for laser dark-field illumination in a catadioptric optical system
US7725024B2 (en) * 2005-07-08 2010-05-25 Electro Scientific Industries, Inc. Optimizing use and performance of optical systems implemented with telecentric on-axis dark field illumination
JP4723362B2 (ja) * 2005-11-29 2011-07-13 株式会社日立ハイテクノロジーズ 光学式検査装置及びその方法
JP4949928B2 (ja) * 2006-06-20 2012-06-13 Ｈｏｙａ株式会社 パターン欠陥検査方法、パターン欠陥検査装置、フォトマスク製品の製造方法、及び表示デバイス用基板の製造方法
DE102006042117A1 (de) * 2006-09-07 2008-03-27 Dr. Schenk Gmbh Industriemesstechnik Vorrichtung zur optischen Detektion eines Oberflächenfehlers eines Substrats
CN101021490B (zh) * 2007-03-12 2012-11-14 3i系统公司 平面基板自动检测系统及方法
US7782452B2 (en) * 2007-08-31 2010-08-24 Kla-Tencor Technologies Corp. Systems and method for simultaneously inspecting a specimen with two distinct channels
DE112009000832T5 (de) * 2008-04-04 2011-07-28 Nanda Technologies GmbH, 85716 System und Verfahren zur optischen Inspektion

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5175652A (en) * 1990-08-06 1992-12-29 Nikon Corporation Imaging optical system
US6256144B1 (en) * 1997-06-02 2001-07-03 Olympus Optical Co., Ltd. Real image mode variable magnification finder
US6491836B1 (en) * 1998-11-06 2002-12-10 Shin-Etsu Handotai Co., Ltd. Semiconductor wafer and production method therefor
US7312432B2 (en) * 2002-07-08 2007-12-25 Dmetrix, Inc. Single axis illumination for multi-axis imaging system
US20040207836A1 (en) * 2002-09-27 2004-10-21 Rajeshwar Chhibber High dynamic range optical inspection system and method
US20060219930A1 (en) * 2005-03-31 2006-10-05 Lange Steven R All-reflective optical systems for broadband wafer inspection
US20070013661A1 (en) * 2005-06-30 2007-01-18 Olivier Theytaz Optical displacement detection over varied surfaces

Also Published As

Publication number Publication date
US8072591B2 (en) 2011-12-06
US8368881B2 (en) 2013-02-05
KR101697240B1 (ko) 2017-01-17
US20110043798A1 (en) 2011-02-24
US20110043796A1 (en) 2011-02-24
US20120133760A1 (en) 2012-05-31
CN102016554B (zh) 2013-01-30
US8345232B2 (en) 2013-01-01
US20100231902A1 (en) 2010-09-16
US8102521B2 (en) 2012-01-24
TW200952102A (en) 2009-12-16
KR20110000560A (ko) 2011-01-03
CN102016554A (zh) 2011-04-13
JP5749641B2 (ja) 2015-07-15
JP2011516844A (ja) 2011-05-26
WO2009121628A2 (en) 2009-10-08
DE112009000832T5 (de) 2011-07-28
WO2009121628A9 (en) 2009-11-26

Similar Documents

Publication Publication Date Title
TWI479583B (zh) 光學檢驗的系統與方法
JP6324071B2 (ja) Ｅｕｖ結像のための装置およびその装置を用いた方法
JP5487196B2 (ja) 小さな反射屈折対物レンズを用いる分割視野検査システム
US9588421B2 (en) Pellicle inspection apparatus
KR102357638B1 (ko) 단일 빔을 이용한 암시야 웨이퍼 나노 결함 검사 시스템
US20070002465A1 (en) Beam delivery system for laser dark-field illumination in a catadioptric optical system
US20150192459A1 (en) Extreme ultra-violet (euv) inspection systems
EP2972226B1 (en) Segmented mirror apparatus for imaging and method of using the same
EP4524653A2 (en) Inspection system with non-circular pupil
JP2006518876A (ja) 高性能カタディオプトリックイメージングシステム
WO2008156812A2 (en) External beam delivery system for laser dark-field illumination in a catadioptric optical system
US9151718B2 (en) Illumination system with time multiplexed sources for reticle inspection

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees