CN102016554B - 光学检验系统及方法 - Google Patents

光学检验系统及方法 Download PDF

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Publication number
CN102016554B
CN102016554B CN2009801160931A CN200980116093A CN102016554B CN 102016554 B CN102016554 B CN 102016554B CN 2009801160931 A CN2009801160931 A CN 2009801160931A CN 200980116093 A CN200980116093 A CN 200980116093A CN 102016554 B CN102016554 B CN 102016554B
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CN
China
Prior art keywords
beam path
light
wafer
inspection system
imaging
Prior art date
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Expired - Fee Related
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CN2009801160931A
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English (en)
Chinese (zh)
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CN102016554A (zh
Inventor
拉尔斯·马克沃特
拉吉斯瓦·切贝尔
克劳斯·埃克勒
诺伯特·哈伦特
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Nanda Technologies GmbH
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Nanda Technologies GmbH
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G01N2021/8825—Separate detection of dark field and bright field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CN2009801160931A 2008-04-04 2009-04-03 光学检验系统及方法 Expired - Fee Related CN102016554B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US6494908P 2008-04-04 2008-04-04
US61/064,949 2008-04-04
PCT/EP2009/002482 WO2009121628A2 (en) 2008-04-04 2009-04-03 Optical inspection system and method

Publications (2)

Publication Number Publication Date
CN102016554A CN102016554A (zh) 2011-04-13
CN102016554B true CN102016554B (zh) 2013-01-30

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CN2009801160931A Expired - Fee Related CN102016554B (zh) 2008-04-04 2009-04-03 光学检验系统及方法

Country Status (7)

Country Link
US (4) US8072591B2 (enExample)
JP (1) JP5749641B2 (enExample)
KR (1) KR101697240B1 (enExample)
CN (1) CN102016554B (enExample)
DE (1) DE112009000832T5 (enExample)
TW (1) TWI479583B (enExample)
WO (1) WO2009121628A2 (enExample)

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EP2609419A1 (en) 2010-08-24 2013-07-03 Nanda Technologies GmbH Methods and systems for inspecting bonded wafers
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US9377596B2 (en) * 2014-07-22 2016-06-28 Unimicron Technology Corp. Optical-electro circuit board, optical component and manufacturing method thereof
WO2016015734A1 (en) * 2014-08-01 2016-02-04 Dfm A/S A scatterometer apparatus
KR101741659B1 (ko) 2014-11-03 2017-05-31 주식회사 엠티엠 카메라 모듈 이물 검사를 위한 광원장치
IL243167B (en) * 2014-12-18 2021-02-28 Gordon Noam Multiple light sources that can be separated by optical inspection
IL243166B2 (en) * 2014-12-18 2023-10-01 Camtek Imaging Tech Suzhou Co Ltd Modification of the optical properties of line-scan illumination depending on the light angle along the line axis
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US10309907B2 (en) * 2015-03-04 2019-06-04 Kla-Tencor Corporation All reflective wafer defect inspection and review systems and methods
EP3411694A4 (en) * 2016-02-03 2019-09-04 Kla-Tencor Corporation WAFER DEFECT INSPECTION AND TESTING SYSTEMS
EP4036852A1 (en) 2016-03-07 2022-08-03 Assurant, Inc. Screen damage detection for devices
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KR102233196B1 (ko) * 2017-01-31 2021-03-26 제이에프이 스틸 가부시키가이샤 강재 형상 계측 장치 및 강재 형상 교정 장치
US10422984B2 (en) * 2017-05-12 2019-09-24 Applied Materials, Inc. Flexible mode scanning optical microscopy and inspection system
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JP7175214B2 (ja) * 2019-02-13 2022-11-18 リコーインダストリアルソリューションズ株式会社 検査装置
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Publication number Priority date Publication date Assignee Title
US5909276A (en) * 1997-03-31 1999-06-01 Microtherm, Llc Optical inspection module and method for detecting particles and defects on substrates in integrated process tools
DE19903486C2 (de) * 1999-01-29 2003-03-06 Leica Microsystems Verfahren und Vorrichtung zur optischen Untersuchung von strukturierten Oberflächen von Objekten
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Also Published As

Publication number Publication date
US8072591B2 (en) 2011-12-06
US8368881B2 (en) 2013-02-05
KR101697240B1 (ko) 2017-01-17
US20110043798A1 (en) 2011-02-24
US20110043796A1 (en) 2011-02-24
US20120133760A1 (en) 2012-05-31
US8345232B2 (en) 2013-01-01
US20100231902A1 (en) 2010-09-16
US8102521B2 (en) 2012-01-24
TWI479583B (zh) 2015-04-01
TW200952102A (en) 2009-12-16
KR20110000560A (ko) 2011-01-03
CN102016554A (zh) 2011-04-13
JP5749641B2 (ja) 2015-07-15
JP2011516844A (ja) 2011-05-26
WO2009121628A2 (en) 2009-10-08
DE112009000832T5 (de) 2011-07-28
WO2009121628A9 (en) 2009-11-26

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