KR101664532B1 - 기판의 연마 이상 검출 방법 및 연마 장치 - Google Patents

기판의 연마 이상 검출 방법 및 연마 장치 Download PDF

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KR101664532B1
KR101664532B1 KR1020130110994A KR20130110994A KR101664532B1 KR 101664532 B1 KR101664532 B1 KR 101664532B1 KR 1020130110994 A KR1020130110994 A KR 1020130110994A KR 20130110994 A KR20130110994 A KR 20130110994A KR 101664532 B1 KR101664532 B1 KR 101664532B1
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South Korea
Prior art keywords
polishing
substrate
wafer
tape
edge portion
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KR1020130110994A
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English (en)
Korean (ko)
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KR20140040012A (ko
Inventor
데츠지 도가와
마사야 세키
히로유키 다케나카
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가부시키가이샤 에바라 세이사꾸쇼
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/002—Machines or devices using grinding or polishing belts; Accessories therefor for grinding edges or bevels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
KR1020130110994A 2012-09-24 2013-09-16 기판의 연마 이상 검출 방법 및 연마 장치 Active KR101664532B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-209499 2012-09-24
JP2012209499A JP5889760B2 (ja) 2012-09-24 2012-09-24 基板の研磨異常検出方法および研磨装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020160126049A Division KR101810331B1 (ko) 2012-09-24 2016-09-30 연마 장치

Publications (2)

Publication Number Publication Date
KR20140040012A KR20140040012A (ko) 2014-04-02
KR101664532B1 true KR101664532B1 (ko) 2016-10-10

Family

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KR1020130110994A Active KR101664532B1 (ko) 2012-09-24 2013-09-16 기판의 연마 이상 검출 방법 및 연마 장치
KR1020160126049A Active KR101810331B1 (ko) 2012-09-24 2016-09-30 연마 장치

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Country Status (4)

Country Link
US (3) US9248543B2 (https=)
JP (2) JP5889760B2 (https=)
KR (2) KR101664532B1 (https=)
TW (2) TWI584915B (https=)

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KR101810331B1 (ko) * 2012-09-24 2017-12-18 가부시키가이샤 에바라 세이사꾸쇼 연마 장치

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US9457447B2 (en) * 2011-03-28 2016-10-04 Ebara Corporation Polishing apparatus and polishing method
JP2015006709A (ja) * 2013-06-25 2015-01-15 株式会社ディスコ ウエーハの研削方法及び研削装置
JP2016058675A (ja) 2014-09-12 2016-04-21 株式会社東芝 研磨装置および半導体ウェハの研磨方法
JP6532884B2 (ja) * 2014-10-31 2019-06-19 株式会社荏原製作所 ワークピースを研磨するための化学機械研磨装置
JP2017148931A (ja) * 2016-02-19 2017-08-31 株式会社荏原製作所 研磨装置および研磨方法
JP2018114580A (ja) * 2017-01-17 2018-07-26 株式会社ディスコ ウエーハの加工方法及び切削装置
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
CN108255129B (zh) * 2018-01-15 2020-08-28 中国工程物理研究院机械制造工艺研究所 一种工件抛光检测方法
US11131541B2 (en) * 2018-06-29 2021-09-28 Taiwan Semiconductor Manufacturing Co., Ltd. Shutter monitoring system
JP7121572B2 (ja) * 2018-07-20 2022-08-18 株式会社荏原製作所 研磨装置および研磨方法
JP7047797B2 (ja) * 2019-02-25 2022-04-05 株式会社Sumco 貼り合わせウェーハのテラス加工方法及びテラス加工装置
IT201900003011A1 (it) * 2019-03-01 2020-09-01 Soltek S R L Macchina per la rettifica di elementi lastriformi e relativo metodo
IT201900003001A1 (it) * 2019-03-01 2020-09-01 Soltek S R L Macchina per la rettifica di elementi lastriformi e relativo metodo
JP7278153B2 (ja) * 2019-06-04 2023-05-19 東京エレクトロン株式会社 基板加工装置、および基板加工方法
CN111761420B (zh) * 2020-06-16 2021-10-15 上海中欣晶圆半导体科技有限公司 一种提高硅片倒角宽幅精度的方法
US20250178149A1 (en) * 2022-02-25 2025-06-05 Ebara Corporation Substrate polishing apparatus
US12519020B2 (en) * 2022-06-17 2026-01-06 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing tool and methods of operation
JP2024070925A (ja) * 2022-11-14 2024-05-24 株式会社荏原製作所 研磨装置
CN119369244B (zh) * 2024-12-30 2025-04-15 华海清科股份有限公司 晶圆边缘抛光方法和抛光装置

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Also Published As

Publication number Publication date
TW201726322A (zh) 2017-08-01
TWI584915B (zh) 2017-06-01
US20160114455A1 (en) 2016-04-28
KR101810331B1 (ko) 2017-12-18
US20170312879A1 (en) 2017-11-02
US9782869B2 (en) 2017-10-10
US9248543B2 (en) 2016-02-02
JP6077152B2 (ja) 2017-02-08
US20140087627A1 (en) 2014-03-27
KR20160119019A (ko) 2016-10-12
JP5889760B2 (ja) 2016-03-22
KR20140040012A (ko) 2014-04-02
TWI611871B (zh) 2018-01-21
JP2014061580A (ja) 2014-04-10
JP2016112683A (ja) 2016-06-23
US10343252B2 (en) 2019-07-09
TW201417952A (zh) 2014-05-16

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