KR101621566B1 - 프라이밍 처리 방법 및 프라이밍 처리 장치 - Google Patents

프라이밍 처리 방법 및 프라이밍 처리 장치 Download PDF

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Publication number
KR101621566B1
KR101621566B1 KR1020100060476A KR20100060476A KR101621566B1 KR 101621566 B1 KR101621566 B1 KR 101621566B1 KR 1020100060476 A KR1020100060476 A KR 1020100060476A KR 20100060476 A KR20100060476 A KR 20100060476A KR 101621566 B1 KR101621566 B1 KR 101621566B1
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KR
South Korea
Prior art keywords
priming
priming roller
cleaning
roller
liquid
Prior art date
Application number
KR1020100060476A
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English (en)
Korean (ko)
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KR20110000530A (ko
Inventor
후미히로 미야자끼
다까시 나까미쯔
쯔요시 야마사끼
야스유끼 오니즈까
요시히사 나가따
Original Assignee
도쿄엘렉트론가부시키가이샤
히라따기꼬오 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 도쿄엘렉트론가부시키가이샤, 히라따기꼬오 가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20110000530A publication Critical patent/KR20110000530A/ko
Application granted granted Critical
Publication of KR101621566B1 publication Critical patent/KR101621566B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
KR1020100060476A 2009-06-26 2010-06-25 프라이밍 처리 방법 및 프라이밍 처리 장치 KR101621566B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009152244A JP5121778B2 (ja) 2009-06-26 2009-06-26 プライミング処理方法及びプライミング処理装置
JPJP-P-2009-152244 2009-06-26

Publications (2)

Publication Number Publication Date
KR20110000530A KR20110000530A (ko) 2011-01-03
KR101621566B1 true KR101621566B1 (ko) 2016-05-16

Family

ID=43366814

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100060476A KR101621566B1 (ko) 2009-06-26 2010-06-25 프라이밍 처리 방법 및 프라이밍 처리 장치

Country Status (4)

Country Link
JP (1) JP5121778B2 (zh)
KR (1) KR101621566B1 (zh)
CN (2) CN101927231B (zh)
TW (1) TWI478775B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD589322S1 (en) 2006-10-05 2009-03-31 Lowe's Companies, Inc. Tool handle
JP5340329B2 (ja) * 2011-02-08 2013-11-13 富士フイルム株式会社 塗布装置及びインクジェット記録装置
JP5757777B2 (ja) * 2011-04-15 2015-07-29 パナソニック株式会社 基板塗布方法及び基板塗布装置並びに同方法を用いた有機エレクトロルミネッセント素子の製造方法
JP2014176812A (ja) * 2013-03-15 2014-09-25 Dainippon Screen Mfg Co Ltd ノズル洗浄装置、塗布装置、ノズル洗浄方法、および塗布方法
CN104785418B (zh) * 2015-04-29 2017-12-01 京东方科技集团股份有限公司 一种涂布装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005252045A (ja) * 2004-03-05 2005-09-15 Tokyo Electron Ltd 塗布膜形成装置および塗布膜形成方法
JP2007167837A (ja) * 2005-11-24 2007-07-05 Chugai Ro Co Ltd 吐出ノズルの洗浄装置
JP2007237046A (ja) * 2006-03-07 2007-09-20 Tokyo Electron Ltd プライミング処理方法及びプライミング処理装置
JP2007268521A (ja) * 2006-03-08 2007-10-18 Sumitomo Chemical Co Ltd 塗布膜形成装置用前処理装置及び塗布膜形成装置用前処理方法、並びに、塗布膜形成装置及び塗布膜形成方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3877719B2 (ja) * 2002-11-07 2007-02-07 東京応化工業株式会社 スリットコータの予備吐出装置
JP4071183B2 (ja) * 2003-09-12 2008-04-02 東京エレクトロン株式会社 塗布方法及び塗布装置
JP4429073B2 (ja) * 2004-05-20 2010-03-10 東京応化工業株式会社 スリットコータの予備吐出装置
CN101032714A (zh) * 2006-03-08 2007-09-12 住友化学株式会社 涂敷膜形成装置用前处理装置及方法、涂敷膜形成装置及方法
JP2007283181A (ja) * 2006-04-14 2007-11-01 Toray Ind Inc 塗布方法と塗布装置並びに液晶ディスプレイ用部材の製造方法
JP2008049226A (ja) * 2006-08-22 2008-03-06 Tokyo Ohka Kogyo Co Ltd 予備吐出装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005252045A (ja) * 2004-03-05 2005-09-15 Tokyo Electron Ltd 塗布膜形成装置および塗布膜形成方法
JP2007167837A (ja) * 2005-11-24 2007-07-05 Chugai Ro Co Ltd 吐出ノズルの洗浄装置
JP2007237046A (ja) * 2006-03-07 2007-09-20 Tokyo Electron Ltd プライミング処理方法及びプライミング処理装置
JP2007268521A (ja) * 2006-03-08 2007-10-18 Sumitomo Chemical Co Ltd 塗布膜形成装置用前処理装置及び塗布膜形成装置用前処理方法、並びに、塗布膜形成装置及び塗布膜形成方法

Also Published As

Publication number Publication date
CN101927231B (zh) 2014-05-07
JP5121778B2 (ja) 2013-01-16
JP2011005432A (ja) 2011-01-13
KR20110000530A (ko) 2011-01-03
TWI478775B (zh) 2015-04-01
CN101927231A (zh) 2010-12-29
CN103466956A (zh) 2013-12-25
TW201116340A (en) 2011-05-16
CN103466956B (zh) 2016-01-20

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