JP5121778B2 - プライミング処理方法及びプライミング処理装置 - Google Patents

プライミング処理方法及びプライミング処理装置 Download PDF

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Publication number
JP5121778B2
JP5121778B2 JP2009152244A JP2009152244A JP5121778B2 JP 5121778 B2 JP5121778 B2 JP 5121778B2 JP 2009152244 A JP2009152244 A JP 2009152244A JP 2009152244 A JP2009152244 A JP 2009152244A JP 5121778 B2 JP5121778 B2 JP 5121778B2
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JP
Japan
Prior art keywords
cleaning
priming
priming roller
outer peripheral
peripheral surface
Prior art date
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Application number
JP2009152244A
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English (en)
Japanese (ja)
Other versions
JP2011005432A (ja
Inventor
文宏 宮崎
孝志 中満
剛 山崎
靖之 鬼塚
義寿 永田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Hirata Corp
Original Assignee
Tokyo Electron Ltd
Hirata Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Hirata Corp filed Critical Tokyo Electron Ltd
Priority to JP2009152244A priority Critical patent/JP5121778B2/ja
Priority to TW099120644A priority patent/TWI478775B/zh
Priority to KR1020100060476A priority patent/KR101621566B1/ko
Priority to CN201310376565.5A priority patent/CN103466956B/zh
Priority to CN201010212346.XA priority patent/CN101927231B/zh
Publication of JP2011005432A publication Critical patent/JP2011005432A/ja
Application granted granted Critical
Publication of JP5121778B2 publication Critical patent/JP5121778B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
JP2009152244A 2009-06-26 2009-06-26 プライミング処理方法及びプライミング処理装置 Active JP5121778B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009152244A JP5121778B2 (ja) 2009-06-26 2009-06-26 プライミング処理方法及びプライミング処理装置
TW099120644A TWI478775B (zh) 2009-06-26 2010-06-24 預塗處理方法及預塗處理裝置
KR1020100060476A KR101621566B1 (ko) 2009-06-26 2010-06-25 프라이밍 처리 방법 및 프라이밍 처리 장치
CN201310376565.5A CN103466956B (zh) 2009-06-26 2010-06-28 启动加注处理方法以及启动加注处理装置
CN201010212346.XA CN101927231B (zh) 2009-06-26 2010-06-28 启动加注处理方法以及启动加注处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009152244A JP5121778B2 (ja) 2009-06-26 2009-06-26 プライミング処理方法及びプライミング処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011235712A Division JP5562315B2 (ja) 2011-10-27 2011-10-27 プライミング処理方法及びプライミング処理装置

Publications (2)

Publication Number Publication Date
JP2011005432A JP2011005432A (ja) 2011-01-13
JP5121778B2 true JP5121778B2 (ja) 2013-01-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009152244A Active JP5121778B2 (ja) 2009-06-26 2009-06-26 プライミング処理方法及びプライミング処理装置

Country Status (4)

Country Link
JP (1) JP5121778B2 (zh)
KR (1) KR101621566B1 (zh)
CN (2) CN101927231B (zh)
TW (1) TWI478775B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD589322S1 (en) 2006-10-05 2009-03-31 Lowe's Companies, Inc. Tool handle
JP5340329B2 (ja) * 2011-02-08 2013-11-13 富士フイルム株式会社 塗布装置及びインクジェット記録装置
JP5757777B2 (ja) * 2011-04-15 2015-07-29 パナソニック株式会社 基板塗布方法及び基板塗布装置並びに同方法を用いた有機エレクトロルミネッセント素子の製造方法
JP2014176812A (ja) * 2013-03-15 2014-09-25 Dainippon Screen Mfg Co Ltd ノズル洗浄装置、塗布装置、ノズル洗浄方法、および塗布方法
CN104785418B (zh) * 2015-04-29 2017-12-01 京东方科技集团股份有限公司 一种涂布装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3877719B2 (ja) * 2002-11-07 2007-02-07 東京応化工業株式会社 スリットコータの予備吐出装置
JP4071183B2 (ja) * 2003-09-12 2008-04-02 東京エレクトロン株式会社 塗布方法及び塗布装置
JP4130971B2 (ja) * 2004-03-05 2008-08-13 東京エレクトロン株式会社 塗布膜形成装置および塗布膜形成方法
JP4429073B2 (ja) * 2004-05-20 2010-03-10 東京応化工業株式会社 スリットコータの予備吐出装置
KR100756811B1 (ko) * 2005-11-24 2007-09-10 쥬가이로 고교 가부시키가이샤 토출 노즐의 세정장치
JP4676359B2 (ja) * 2006-03-07 2011-04-27 東京エレクトロン株式会社 プライミング処理方法及びプライミング処理装置
CN101032714A (zh) * 2006-03-08 2007-09-12 住友化学株式会社 涂敷膜形成装置用前处理装置及方法、涂敷膜形成装置及方法
JP2007268521A (ja) * 2006-03-08 2007-10-18 Sumitomo Chemical Co Ltd 塗布膜形成装置用前処理装置及び塗布膜形成装置用前処理方法、並びに、塗布膜形成装置及び塗布膜形成方法
JP2007283181A (ja) * 2006-04-14 2007-11-01 Toray Ind Inc 塗布方法と塗布装置並びに液晶ディスプレイ用部材の製造方法
JP2008049226A (ja) * 2006-08-22 2008-03-06 Tokyo Ohka Kogyo Co Ltd 予備吐出装置

Also Published As

Publication number Publication date
KR101621566B1 (ko) 2016-05-16
CN101927231B (zh) 2014-05-07
JP2011005432A (ja) 2011-01-13
KR20110000530A (ko) 2011-01-03
TWI478775B (zh) 2015-04-01
CN101927231A (zh) 2010-12-29
CN103466956A (zh) 2013-12-25
TW201116340A (en) 2011-05-16
CN103466956B (zh) 2016-01-20

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