KR101576856B1 - 캐리어 테이프 중의 부품의 유무를 검출하는 방법, 센서 모듈, 스플라이싱 장치 및 부품 실장기 - Google Patents

캐리어 테이프 중의 부품의 유무를 검출하는 방법, 센서 모듈, 스플라이싱 장치 및 부품 실장기 Download PDF

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KR101576856B1
KR101576856B1 KR1020150003704A KR20150003704A KR101576856B1 KR 101576856 B1 KR101576856 B1 KR 101576856B1 KR 1020150003704 A KR1020150003704 A KR 1020150003704A KR 20150003704 A KR20150003704 A KR 20150003704A KR 101576856 B1 KR101576856 B1 KR 101576856B1
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KR
South Korea
Prior art keywords
pocket
tape
displacement
carrier tape
light
Prior art date
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KR1020150003704A
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English (en)
Korean (ko)
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KR20150107593A (ko
Inventor
요시타카 다이시
준이치 마에카와
하지메 가와이
Original Assignee
오므론 가부시키가이샤
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Publication date
Application filed by 오므론 가부시키가이샤 filed Critical 오므론 가부시키가이샤
Publication of KR20150107593A publication Critical patent/KR20150107593A/ko
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Publication of KR101576856B1 publication Critical patent/KR101576856B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1679—Programme controls characterised by the tasks executed
    • B25J9/1687—Assembly, peg and hole, palletising, straight line, weaving pattern movement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H21/00—Apparatus for splicing webs
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/0215—Interconnecting of containers, e.g. splicing of tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
KR1020150003704A 2014-03-14 2015-01-09 캐리어 테이프 중의 부품의 유무를 검출하는 방법, 센서 모듈, 스플라이싱 장치 및 부품 실장기 KR101576856B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-051433 2014-03-14
JP2014051433A JP2015176970A (ja) 2014-03-14 2014-03-14 キャリアテープ中の部品の有無を検出する方法、センサモジュール、スプライシング装置、及び、部品実装機

Publications (2)

Publication Number Publication Date
KR20150107593A KR20150107593A (ko) 2015-09-23
KR101576856B1 true KR101576856B1 (ko) 2015-12-14

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150003704A KR101576856B1 (ko) 2014-03-14 2015-01-09 캐리어 테이프 중의 부품의 유무를 검출하는 방법, 센서 모듈, 스플라이싱 장치 및 부품 실장기

Country Status (5)

Country Link
US (1) US20150258687A1 (fr)
EP (1) EP2919573A3 (fr)
JP (1) JP2015176970A (fr)
KR (1) KR101576856B1 (fr)
CN (1) CN104918478A (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104221487B (zh) * 2012-04-18 2017-03-01 富士机械制造株式会社 自动拼接装置
JP6322811B2 (ja) * 2014-07-28 2018-05-16 パナソニックＩｐマネジメント株式会社 部品実装装置および部品実装方法
JP6521991B2 (ja) * 2014-10-09 2019-05-29 株式会社Ｆｕｊｉ 判定方法、および判定装置
CN108370659B (zh) * 2015-12-10 2019-08-30 株式会社富士 拼接装置
JP6603877B2 (ja) * 2016-03-09 2019-11-13 パナソニックＩｐマネジメント株式会社 キャリアテープの部品検出装置および部品供給装置
JP6735835B2 (ja) * 2016-08-30 2020-08-05 株式会社Ｆｕｊｉ スプライシング装置
JP6745892B2 (ja) * 2016-10-20 2020-08-26 株式会社Ｆｕｊｉ スプライシング装置
JP6667421B2 (ja) * 2016-11-10 2020-03-18 ヤマハ発動機株式会社 部品実装装置およびテープフィーダ
US11647621B2 (en) * 2017-09-15 2023-05-09 Fuji Corporation Feeding system for components in a scattered state
WO2019142249A1 (fr) * 2018-01-17 2019-07-25 株式会社Ｆｕｊｉ Dispositif d'épissage
JP6842571B2 (ja) * 2018-01-25 2021-03-17 株式会社Ｆｕｊｉ スプライシング装置
CN110481841B (zh) * 2018-05-14 2022-08-23 深圳市复德科技有限公司 取放料装置及具有该取放料装置的替换料设备
JP7008835B2 (ja) * 2018-09-27 2022-01-25 株式会社Fuji 部品供給装置
CN110027735B (zh) * 2019-04-01 2024-01-30 东莞旺福电子有限公司 一种自动化激光模组检测包装设备
CN111182780B (zh) * 2020-01-16 2021-06-22 深圳市蓝眼博科科技有限公司 料带续接机
CN111301748B (zh) * 2020-02-27 2021-09-10 深圳格兰达智能装备股份有限公司 一种ic芯片编带自动拼接机构及编带复检机
KR102132984B1 (ko) * 2020-02-27 2020-07-10 주식회사하이셈테크놀로지 칩이 포장된 캐리어 테이프의 검사장치
JP2021166225A (ja) * 2020-04-06 2021-10-14 株式会社Fuji キャリアテープ判定装置
WO2022149264A1 (fr) * 2021-01-08 2022-07-14 株式会社Fuji Dispositif de détection de présence/d'absence de composant, procédé d'apprentissage pour dispositif de détection de présence/d'absence de composant et machine de montage de composant
KR102441250B1 (ko) * 2022-02-21 2022-09-07 (주)네온테크 레이저를 사용하여 소재의 들뜸을 측정하는 검출 시스템 및 이를 사용한 소재의 들뜸을 측정하는 방법
CN114509041B (zh) * 2022-04-20 2022-07-01 南通勤为半导体科技有限公司 用于载带生产的在线检测机构
CN115258235B (zh) * 2022-08-02 2024-04-16 深圳市中金科五金制造有限公司 一种基于图像识别的载带包装检查控制系统
CN115258237B (zh) * 2022-08-11 2024-04-16 深圳市中金科五金制造有限公司 一种全自动电子感应系统及其ccd垂直检测方法

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JP2007214476A (ja) 2006-02-13 2007-08-23 Matsushita Electric Ind Co Ltd 電子部品実装方法
JP2010171208A (ja) 2009-01-22 2010-08-05 Hitachi High-Tech Instruments Co Ltd 電子部品装着方法及び電子部品装着装置

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JPS57212020A (en) * 1981-06-25 1982-12-27 Showa Electric Wire & Cable Co Ltd Automatic tape jointing device
JPS63177589A (ja) * 1987-01-19 1988-07-21 三洋電機株式会社 部品の自動装着装置
JPH04243757A (ja) * 1991-01-22 1992-08-31 Tdk Corp チップ部品連の自動接続装置
JP4494547B2 (ja) * 1999-03-10 2010-06-30 Ｊｕｋｉ株式会社 電子部品検出装置
JP4275258B2 (ja) * 1999-07-23 2009-06-10 富士機械製造株式会社 物品供給装置
US7220095B2 (en) * 2001-05-24 2007-05-22 Lyndaker David W Self-threading component tape feeder
JP2005105681A (ja) * 2003-09-30 2005-04-21 Toto Ltd 人体検出装置及びそれを搭載した自動水栓装置
JP5431237B2 (ja) * 2010-04-23 2014-03-05 パナソニック株式会社 治具、貼着方法
JP5434884B2 (ja) * 2010-10-27 2014-03-05 パナソニック株式会社 電子部品実装装置および電子部品実装方法
JP5940243B2 (ja) * 2010-12-28 2016-06-29 ヤマハ発動機株式会社 電子部品装着装置及び電子部品装着方法
KR101232134B1 (ko) * 2011-11-25 2013-02-13 에스티에스 주식회사 빈 부품의 위치를 감지하여 캐리어 테이프를 신속하게 배출하는 테이프 피더
CN104221487B (zh) * 2012-04-18 2017-03-01 富士机械制造株式会社 自动拼接装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007214476A (ja) 2006-02-13 2007-08-23 Matsushita Electric Ind Co Ltd 電子部品実装方法
JP2010171208A (ja) 2009-01-22 2010-08-05 Hitachi High-Tech Instruments Co Ltd 電子部品装着方法及び電子部品装着装置

Also Published As

Publication number Publication date
EP2919573A3 (fr) 2016-07-13
JP2015176970A (ja) 2015-10-05
CN104918478A (zh) 2015-09-16
EP2919573A2 (fr) 2015-09-16
US20150258687A1 (en) 2015-09-17
KR20150107593A (ko) 2015-09-23

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