KR101552590B1 - 부품 실장 장치 - Google Patents

부품 실장 장치 Download PDF

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Publication number
KR101552590B1
KR101552590B1 KR1020147026260A KR20147026260A KR101552590B1 KR 101552590 B1 KR101552590 B1 KR 101552590B1 KR 1020147026260 A KR1020147026260 A KR 1020147026260A KR 20147026260 A KR20147026260 A KR 20147026260A KR 101552590 B1 KR101552590 B1 KR 101552590B1
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KR
South Korea
Prior art keywords
component
offset
imaging
image pickup
amount
Prior art date
Application number
KR1020147026260A
Other languages
English (en)
Korean (ko)
Other versions
KR20140125451A (ko
Inventor
카즈아키 야마다
Original Assignee
야마하하쓰도키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 야마하하쓰도키 가부시키가이샤 filed Critical 야마하하쓰도키 가부시키가이샤
Publication of KR20140125451A publication Critical patent/KR20140125451A/ko
Application granted granted Critical
Publication of KR101552590B1 publication Critical patent/KR101552590B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020147026260A 2012-05-10 2013-02-26 부품 실장 장치 KR101552590B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012108531A JP5600705B2 (ja) 2012-05-10 2012-05-10 部品実装装置
JPJP-P-2012-108531 2012-05-10
PCT/JP2013/054928 WO2013168450A1 (ja) 2012-05-10 2013-02-26 部品実装装置

Publications (2)

Publication Number Publication Date
KR20140125451A KR20140125451A (ko) 2014-10-28
KR101552590B1 true KR101552590B1 (ko) 2015-09-11

Family

ID=49550511

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147026260A KR101552590B1 (ko) 2012-05-10 2013-02-26 부품 실장 장치

Country Status (4)

Country Link
JP (1) JP5600705B2 (zh)
KR (1) KR101552590B1 (zh)
CN (1) CN104303614B (zh)
WO (1) WO2013168450A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016194136A1 (ja) * 2015-06-02 2016-12-08 富士機械製造株式会社 部品実装装置及び吸着位置設定方法
EP3244286B1 (en) * 2016-05-13 2020-11-04 Accenture Global Solutions Limited Installation of a physical element
CN109716878B (zh) * 2016-09-22 2021-02-09 株式会社富士 元件供给系统
JP6920548B2 (ja) * 2018-04-18 2021-08-18 ヤマハ発動機株式会社 部品認識装置、部品実装機および部品認識方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004281468A (ja) 2003-03-12 2004-10-07 Yamaha Motor Co Ltd 電子部品実装装置
JP2010016115A (ja) 2008-07-02 2010-01-21 Panasonic Corp 部品実装方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4041768B2 (ja) * 2002-09-12 2008-01-30 松下電器産業株式会社 部品装着ヘッド

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004281468A (ja) 2003-03-12 2004-10-07 Yamaha Motor Co Ltd 電子部品実装装置
JP2010016115A (ja) 2008-07-02 2010-01-21 Panasonic Corp 部品実装方法

Also Published As

Publication number Publication date
JP2013236011A (ja) 2013-11-21
CN104303614A (zh) 2015-01-21
JP5600705B2 (ja) 2014-10-01
KR20140125451A (ko) 2014-10-28
CN104303614B (zh) 2016-09-28
WO2013168450A1 (ja) 2013-11-14

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