JP5600705B2 - 部品実装装置 - Google Patents

部品実装装置 Download PDF

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Publication number
JP5600705B2
JP5600705B2 JP2012108531A JP2012108531A JP5600705B2 JP 5600705 B2 JP5600705 B2 JP 5600705B2 JP 2012108531 A JP2012108531 A JP 2012108531A JP 2012108531 A JP2012108531 A JP 2012108531A JP 5600705 B2 JP5600705 B2 JP 5600705B2
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JP
Japan
Prior art keywords
imaging
component
offset
center
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012108531A
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English (en)
Japanese (ja)
Other versions
JP2013236011A (ja
Inventor
一亮 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Priority to JP2012108531A priority Critical patent/JP5600705B2/ja
Priority to PCT/JP2013/054928 priority patent/WO2013168450A1/ja
Priority to CN201380022815.3A priority patent/CN104303614B/zh
Priority to KR1020147026260A priority patent/KR101552590B1/ko
Publication of JP2013236011A publication Critical patent/JP2013236011A/ja
Application granted granted Critical
Publication of JP5600705B2 publication Critical patent/JP5600705B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2012108531A 2012-05-10 2012-05-10 部品実装装置 Active JP5600705B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012108531A JP5600705B2 (ja) 2012-05-10 2012-05-10 部品実装装置
PCT/JP2013/054928 WO2013168450A1 (ja) 2012-05-10 2013-02-26 部品実装装置
CN201380022815.3A CN104303614B (zh) 2012-05-10 2013-02-26 元件安装装置
KR1020147026260A KR101552590B1 (ko) 2012-05-10 2013-02-26 부품 실장 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012108531A JP5600705B2 (ja) 2012-05-10 2012-05-10 部品実装装置

Publications (2)

Publication Number Publication Date
JP2013236011A JP2013236011A (ja) 2013-11-21
JP5600705B2 true JP5600705B2 (ja) 2014-10-01

Family

ID=49550511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012108531A Active JP5600705B2 (ja) 2012-05-10 2012-05-10 部品実装装置

Country Status (4)

Country Link
JP (1) JP5600705B2 (zh)
KR (1) KR101552590B1 (zh)
CN (1) CN104303614B (zh)
WO (1) WO2013168450A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016194136A1 (ja) * 2015-06-02 2016-12-08 富士機械製造株式会社 部品実装装置及び吸着位置設定方法
EP3244286B1 (en) * 2016-05-13 2020-11-04 Accenture Global Solutions Limited Installation of a physical element
CN109716878B (zh) * 2016-09-22 2021-02-09 株式会社富士 元件供给系统
JP6920548B2 (ja) * 2018-04-18 2021-08-18 ヤマハ発動機株式会社 部品認識装置、部品実装機および部品認識方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4041768B2 (ja) * 2002-09-12 2008-01-30 松下電器産業株式会社 部品装着ヘッド
JP4372439B2 (ja) * 2003-03-12 2009-11-25 ヤマハ発動機株式会社 電子部品実装装置
JP4960311B2 (ja) * 2008-07-02 2012-06-27 パナソニック株式会社 部品実装方法

Also Published As

Publication number Publication date
KR101552590B1 (ko) 2015-09-11
JP2013236011A (ja) 2013-11-21
CN104303614A (zh) 2015-01-21
KR20140125451A (ko) 2014-10-28
CN104303614B (zh) 2016-09-28
WO2013168450A1 (ja) 2013-11-14

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