KR101535221B1 - 기판제조장치 - Google Patents

기판제조장치 Download PDF

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Publication number
KR101535221B1
KR101535221B1 KR1020147000799A KR20147000799A KR101535221B1 KR 101535221 B1 KR101535221 B1 KR 101535221B1 KR 1020147000799 A KR1020147000799 A KR 1020147000799A KR 20147000799 A KR20147000799 A KR 20147000799A KR 101535221 B1 KR101535221 B1 KR 101535221B1
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KR
South Korea
Prior art keywords
thin film
film material
temperature
substrate
nozzle
Prior art date
Application number
KR1020147000799A
Other languages
English (en)
Korean (ko)
Other versions
KR20140024952A (ko
Inventor
야스히토 나카모리
케이지 이소
유지 오카모토
타츠로 시라이시
에이지 이치카와
카즈하루 우츠미
Original Assignee
스미도모쥬기가이고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미도모쥬기가이고교 가부시키가이샤 filed Critical 스미도모쥬기가이고교 가부시키가이샤
Publication of KR20140024952A publication Critical patent/KR20140024952A/ko
Application granted granted Critical
Publication of KR101535221B1 publication Critical patent/KR101535221B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020147000799A 2011-07-27 2012-07-06 기판제조장치 KR101535221B1 (ko)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2011164872 2011-07-27
JPJP-P-2011-164872 2011-07-27
JPJP-P-2011-165856 2011-07-28
JP2011165856 2011-07-28
JP2011169831 2011-08-03
JPJP-P-2011-169831 2011-08-03
JPJP-P-2012-051971 2012-03-08
JP2012051971 2012-03-08
PCT/JP2012/067273 WO2013015093A1 (ja) 2011-07-27 2012-07-06 基板製造装置

Publications (2)

Publication Number Publication Date
KR20140024952A KR20140024952A (ko) 2014-03-03
KR101535221B1 true KR101535221B1 (ko) 2015-07-08

Family

ID=47600947

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147000799A KR101535221B1 (ko) 2011-07-27 2012-07-06 기판제조장치

Country Status (5)

Country Link
JP (1) JP5653523B2 (zh)
KR (1) KR101535221B1 (zh)
CN (1) CN103718660B (zh)
TW (1) TWI520789B (zh)
WO (1) WO2013015093A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6006133B2 (ja) * 2013-02-07 2016-10-12 住友重機械工業株式会社 基板製造装置の調整方法、基板製造方法、及び基板製造装置
JP6289880B2 (ja) * 2013-11-26 2018-03-07 住友重機械工業株式会社 薄膜形成方法及び薄膜形成装置
TWI775523B (zh) * 2014-09-02 2022-08-21 美商凱特伊夫公司 用於測量參數的系統和方法
JP6479555B2 (ja) * 2015-04-27 2019-03-06 住友重機械工業株式会社 膜形成装置
JP6479596B2 (ja) 2015-07-07 2019-03-06 住友重機械工業株式会社 インク吐出装置及びインク吐出方法
CN105413967A (zh) * 2015-12-25 2016-03-23 齐齐哈尔大学 一种智能化快速平板刮膜机
CN105750158B (zh) * 2016-05-06 2018-09-28 深圳市鑫三力自动化设备有限公司 精密点胶系统
CN109379850B (zh) * 2018-10-26 2020-07-10 江西旭昇电子有限公司 印制线路板阻焊图形加工装置及方法
CN110439227B (zh) * 2019-08-16 2020-06-02 江西省洪观建筑有限公司 一种自动刷格子花纹墙面装置
CN111565515B (zh) * 2020-06-09 2021-05-28 江苏胜帆电子科技有限公司 一种lcp材料高频板的制造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004344704A (ja) * 2003-05-20 2004-12-09 Seiko Epson Corp 液滴吐出方法及び装置、デバイス及びその製造方法、電気光学装置並びに電子機器
JP2005131829A (ja) * 2003-10-28 2005-05-26 Sony Corp 液体吐出性能維持方法及び液体吐出装置
JP2010228099A (ja) * 2009-03-25 2010-10-14 Fujifilm Corp 液体吐出装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100479000B1 (ko) * 1996-05-15 2005-08-01 세이코 엡슨 가부시키가이샤 박막디바이스,액정패널및전자기기및박막디바이스의제조방법
JPH11179892A (ja) * 1997-12-24 1999-07-06 Canon Inc 記録装置
JP2003220715A (ja) * 2002-01-31 2003-08-05 Konica Corp インクジェットプリンタ
JP4679895B2 (ja) * 2003-12-17 2011-05-11 大日本印刷株式会社 パターン形成装置、ヘッドユニット

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004344704A (ja) * 2003-05-20 2004-12-09 Seiko Epson Corp 液滴吐出方法及び装置、デバイス及びその製造方法、電気光学装置並びに電子機器
JP2005131829A (ja) * 2003-10-28 2005-05-26 Sony Corp 液体吐出性能維持方法及び液体吐出装置
JP2010228099A (ja) * 2009-03-25 2010-10-14 Fujifilm Corp 液体吐出装置

Also Published As

Publication number Publication date
WO2013015093A1 (ja) 2013-01-31
TWI520789B (zh) 2016-02-11
CN103718660A (zh) 2014-04-09
KR20140024952A (ko) 2014-03-03
JP5653523B2 (ja) 2015-01-14
JPWO2013015093A1 (ja) 2015-02-23
TW201309396A (zh) 2013-03-01
CN103718660B (zh) 2016-10-05

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