CN109379850B - 印制线路板阻焊图形加工装置及方法 - Google Patents
印制线路板阻焊图形加工装置及方法 Download PDFInfo
- Publication number
- CN109379850B CN109379850B CN201811254954.XA CN201811254954A CN109379850B CN 109379850 B CN109379850 B CN 109379850B CN 201811254954 A CN201811254954 A CN 201811254954A CN 109379850 B CN109379850 B CN 109379850B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- solder mask
- ink
- horizontal direction
- jet printer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012545 processing Methods 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title abstract description 18
- 238000003466 welding Methods 0.000 title description 11
- 229910000679 solder Inorganic materials 0.000 claims abstract description 109
- 238000004519 manufacturing process Methods 0.000 claims abstract description 17
- 238000007641 inkjet printing Methods 0.000 claims abstract description 14
- 238000003860 storage Methods 0.000 claims abstract description 9
- 238000003672 processing method Methods 0.000 claims abstract description 8
- 238000001816 cooling Methods 0.000 claims description 13
- 239000007921 spray Substances 0.000 claims description 11
- 238000001179 sorption measurement Methods 0.000 claims description 10
- 238000001514 detection method Methods 0.000 claims description 7
- 238000011084 recovery Methods 0.000 claims description 4
- 239000002699 waste material Substances 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 14
- 230000008569 process Effects 0.000 abstract description 9
- 238000007650 screen-printing Methods 0.000 abstract description 9
- 238000007639 printing Methods 0.000 abstract description 7
- 238000011161 development Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 9
- 230000008859 change Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Ink Jet (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811254954.XA CN109379850B (zh) | 2018-10-26 | 2018-10-26 | 印制线路板阻焊图形加工装置及方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811254954.XA CN109379850B (zh) | 2018-10-26 | 2018-10-26 | 印制线路板阻焊图形加工装置及方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109379850A CN109379850A (zh) | 2019-02-22 |
CN109379850B true CN109379850B (zh) | 2020-07-10 |
Family
ID=65389828
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811254954.XA Active CN109379850B (zh) | 2018-10-26 | 2018-10-26 | 印制线路板阻焊图形加工装置及方法 |
Country Status (1)
Country | Link |
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CN (1) | CN109379850B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112238681A (zh) * | 2020-11-03 | 2021-01-19 | 变革智能装备(中山)有限公司 | 一种应用于pcb板印制的阻焊字符加工设备 |
CN113978146B (zh) * | 2021-10-21 | 2024-02-02 | 东莞市启思达智能技术有限公司 | 一种基于双平台阻焊喷印机的喷印方法及系统 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201102356Y (zh) * | 2007-12-29 | 2008-08-20 | 汤振华 | 一种大型平板打印机 |
CN103568612A (zh) * | 2013-11-06 | 2014-02-12 | 复旦大学 | 一种基于压电式家用喷墨打印技术制备印制电子阻焊材料的方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2897100B2 (ja) * | 1993-09-30 | 1999-05-31 | 株式会社村田製作所 | 電子部品の半田流れ止め膜形成方法 |
JP5653523B2 (ja) * | 2011-07-27 | 2015-01-14 | 住友重機械工業株式会社 | 基板製造装置 |
CN103722924B (zh) * | 2012-10-16 | 2016-01-20 | 北京美科艺数码科技发展有限公司 | 一种彩色凹凸图像或文字打印方法 |
CN104369563B (zh) * | 2014-11-25 | 2017-07-18 | 柳州钢铁股份有限公司 | 在高温物体表面进行喷涂标识的方法 |
CN106994816B (zh) * | 2016-01-22 | 2019-09-03 | 杭州御澜科技有限公司 | 无缝打印设备 |
US20180229497A1 (en) * | 2017-02-15 | 2018-08-16 | Kateeva, Inc. | Precision position alignment, calibration and measurement in printing and manufacturing systems |
-
2018
- 2018-10-26 CN CN201811254954.XA patent/CN109379850B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201102356Y (zh) * | 2007-12-29 | 2008-08-20 | 汤振华 | 一种大型平板打印机 |
CN103568612A (zh) * | 2013-11-06 | 2014-02-12 | 复旦大学 | 一种基于压电式家用喷墨打印技术制备印制电子阻焊材料的方法 |
Also Published As
Publication number | Publication date |
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CN109379850A (zh) | 2019-02-22 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Device and method for processing solder resist pattern of printed circuit board Effective date of registration: 20220629 Granted publication date: 20200710 Pledgee: China Construction Bank Corporation Jishui sub branch Pledgor: JIANGXI XUSHENG ELECTRONICS Co.,Ltd. Registration number: Y2022980009346 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230718 Granted publication date: 20200710 Pledgee: China Construction Bank Corporation Jishui sub branch Pledgor: JIANGXI XUSHENG ELECTRONICS Co.,Ltd. Registration number: Y2022980009346 |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 331601 Jishui Industrial Park, Jishui County, Ji'an City, Jiangxi Province, on the east side of Jingong Avenue and the south side of Jingong Avenue, Chengxi Industrial Park Patentee after: Jiangxi Xusheng Electronics Co.,Ltd. Country or region after: China Address before: 331600 Jishui Industrial Park, Jishui County, Ji'an City, Jiangxi Province Patentee before: JIANGXI XUSHENG ELECTRONICS Co.,Ltd. Country or region before: China |