KR101531256B1 - 칩형 전자 부품 수납대지용 다층지 기재 및 그 제조 방법 - Google Patents

칩형 전자 부품 수납대지용 다층지 기재 및 그 제조 방법 Download PDF

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Publication number
KR101531256B1
KR101531256B1 KR1020090057535A KR20090057535A KR101531256B1 KR 101531256 B1 KR101531256 B1 KR 101531256B1 KR 1020090057535 A KR1020090057535 A KR 1020090057535A KR 20090057535 A KR20090057535 A KR 20090057535A KR 101531256 B1 KR101531256 B1 KR 101531256B1
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KR
South Korea
Prior art keywords
pulp
inorganic filler
mass
less
layer
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KR1020090057535A
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English (en)
Korean (ko)
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KR20100003216A (ko
Inventor
히로시 수에나가
이쿠로우 테시마
Original Assignee
오지 홀딩스 가부시키가이샤
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Publication of KR20100003216A publication Critical patent/KR20100003216A/ko
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Publication of KR101531256B1 publication Critical patent/KR101531256B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/64—Paper recycling

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Paper (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
KR1020090057535A 2008-06-30 2009-06-26 칩형 전자 부품 수납대지용 다층지 기재 및 그 제조 방법 KR101531256B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2008-170343 2008-06-30
JP2008170343 2008-06-30
JPJP-P-2009-089044 2009-04-01
JP2009089044A JP5470980B2 (ja) 2008-06-30 2009-04-01 チップ型電子部品収納台紙用多層紙基材の製造方法

Publications (2)

Publication Number Publication Date
KR20100003216A KR20100003216A (ko) 2010-01-07
KR101531256B1 true KR101531256B1 (ko) 2015-06-24

Family

ID=41512951

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090057535A KR101531256B1 (ko) 2008-06-30 2009-06-26 칩형 전자 부품 수납대지용 다층지 기재 및 그 제조 방법

Country Status (4)

Country Link
JP (1) JP5470980B2 (zh)
KR (1) KR101531256B1 (zh)
CN (1) CN101619555B (zh)
TW (1) TW201016463A (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5825124B2 (ja) * 2012-02-01 2015-12-02 王子ホールディングス株式会社 チップ型電子部品収納台紙用多層紙基材およびその製造方法
JP2014023908A (ja) * 2012-06-19 2014-02-06 Sammy Corp 遊技機
JP6085467B2 (ja) * 2012-12-17 2017-02-22 大王製紙株式会社 キャリアテープ用紙及びこのキャリアテープ用紙の中層に用いる古紙パルプの製造方法
WO2014104187A1 (ja) * 2012-12-27 2014-07-03 特種東海製紙株式会社 ガラス板合紙用木材パルプ及びガラス板用合紙
CN103321088B (zh) * 2013-07-19 2014-11-12 吉安集团有限公司 再生高强瓦楞原纸及其生产方法
JP6149589B2 (ja) * 2013-08-07 2017-06-21 王子ホールディングス株式会社 容器用原紙及びその容器用原紙の製造方法
CN105735033B (zh) * 2016-02-19 2017-11-07 江苏理文造纸有限公司 一种白面牛卡纸的生产工艺

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004124280A (ja) * 2002-09-30 2004-04-22 Daio Paper Corp 雑誌古紙を配合した印刷用塗被紙およびその製造方法
JP2004156160A (ja) * 2002-11-05 2004-06-03 Rengo Co Ltd 製紙方法
JP2006143227A (ja) * 2004-11-16 2006-06-08 Oji Paper Co Ltd チップ型電子部品収納台紙
JP2007261593A (ja) * 2006-03-27 2007-10-11 Hokuetsu Paper Mills Ltd チップ状電子部品用キャリアテープ紙

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2916379A1 (de) * 1979-04-23 1980-11-13 Schultz & Nauth Collodin Kleb Invertierter papierleim und verfahren zu seiner herstellung
US5830317A (en) * 1995-04-07 1998-11-03 The Procter & Gamble Company Soft tissue paper with biased surface properties containing fine particulate fillers
CN101092807B (zh) * 2006-06-20 2010-12-22 王子制纸株式会社 胶版印刷用新闻纸

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004124280A (ja) * 2002-09-30 2004-04-22 Daio Paper Corp 雑誌古紙を配合した印刷用塗被紙およびその製造方法
JP2004156160A (ja) * 2002-11-05 2004-06-03 Rengo Co Ltd 製紙方法
JP2006143227A (ja) * 2004-11-16 2006-06-08 Oji Paper Co Ltd チップ型電子部品収納台紙
JP2007261593A (ja) * 2006-03-27 2007-10-11 Hokuetsu Paper Mills Ltd チップ状電子部品用キャリアテープ紙

Also Published As

Publication number Publication date
KR20100003216A (ko) 2010-01-07
CN101619555A (zh) 2010-01-06
TW201016463A (en) 2010-05-01
JP5470980B2 (ja) 2014-04-16
JP2010030677A (ja) 2010-02-12
CN101619555B (zh) 2012-06-20

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