TW201016463A - Multilayer paper substrate for chip-type electronic component storage mount, and method of producing same - Google Patents

Multilayer paper substrate for chip-type electronic component storage mount, and method of producing same Download PDF

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TW201016463A
TW201016463A TW98121688A TW98121688A TW201016463A TW 201016463 A TW201016463 A TW 201016463A TW 98121688 A TW98121688 A TW 98121688A TW 98121688 A TW98121688 A TW 98121688A TW 201016463 A TW201016463 A TW 201016463A
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Taiwan
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paper
pulp
waste paper
inorganic filler
layer
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TW98121688A
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Chinese (zh)
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Hiroshi Suenaga
Ikurou Teshima
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Oji Paper Co
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02WCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00Technologies for solid waste management
    • Y02W30/50Reuse, recycling or recovery technologies
    • Y02W30/64Paper recycling

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Paper (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

The present invention provides a multilayer paper substrate for a storage mount, which is capable of improving the precision of cavity formation, and preventing delamination caused by bending stress and the generation of paper dust during cavity formation. A multilayer paper substrate 1 for a cup-type electronic component storage mount according to the present invention includes pulp fibers and inorganic fillers derived from waste paper within a layer 20, not within the top surface layer 10, wherein the combined proportion of the pulp fibers and inorganic fillers derived from waste paper is within a range from 5 to 70% by mass, the ash content is within a range from 1 to 15% by mass, and the inorganic fillers have a mass average particle size of less than 50 μ m and contains inorganic filler particles having a particle size of 50 μ m or greater in a proportion of less than 40% by mass.

Description

201016463 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種用以製造收納晶片型電子零件之紙製 之晶片型電子零件收納底紙之多層紙基材及其製造方法。 【先前技術】 用作晶片型電子零件之載體之晶片型電子零件收納底紙 (以下,省略為「收納底紙」),通常係藉由使收納底紙用 紙基材成為帶狀,進行壓花加工或穿孔形成模穴而製造。 收納底紙係以如下方式使用。 亦即,於對紙基材進行壓花加工所得之收納底紙中,直 接將晶片型電子零件填充至模穴内,於穿孔所得之收納底 紙中,將底蓋膠帶接著於背面(底侧)而設置底面之後,將 晶片型電子零件填充至模穴内。 然後,將頂蓋膠帶接著於表面(頂侧),捲繞於卡式卷盤 上而出貨。繼而,由使用者將頂蓋膠帶剝離,取出填充於 模穴内之晶片型電子零件,並安裝至印刷基板。 ;x如上之方式使用,故而對於收納底紙之要求如 下不對所填充之晶片型電子零件之品質帶來不良影響; :面具有平滑性以良好地與蓋膠帶接著;具有不因向卡式 政盤之捲、為等之彎曲應力而產生層間剝離或底紙破 ^度;供晶片型電子零件插人之模穴之形成精度良好,可 較少等。 零件,用以形成模穴之模具之磨損 其中 尤其重要的是模穴之形成精度良好。亦即,於使 141273.doc 201016463 用冲孔機或壓花機而形成模穴之過程中,於模穴之内壁面 未鋒利(以正確之尺寸)地形成之情形時,容易卡住晶片型 電子零件。因此’於晶片廠家填充晶片型電子零件時或於 安裝廠家取出晶片型電子零件時會產生困擾。 為使模穴之形成精度提高,亦可採用對模具進行重新研 磨或製作新的模具等之對策,但由於會產生時間及良率之 損失等而使操作性降低,故而成本變高。 又,為使模穴之形成精度提高,採用改良模具本身以改 善模具之磨損性之方法,但亦要求改良收納晶片型電子零 件之收納底紙。 例如於專利文獻j、2中,揭示有調整收納底紙之紙之 密度而使模穴之形成性提高的方法。 於專利文獻3中’揭示有調整收納底紙中之紙之縱方向 及橫方向之斷裂伸長率而調整模穴形成性的方法。 於專利文獻4中,揭示有調整收納底紙之灰分量而使模 穴形成性提高之方法。 然而,收納於模穴中之晶片型電子零件正日益小型化, 實際情況是即便於專利文獻卜4所揭示之方法中,模穴之 形成精度亦不充分。又,於專利文獻丨〜4所揭示之方法 中,未充分地解決由彎曲應力引起之層間剥離之產生、或 形成模穴時之紙粉之產生。 — [先行技術文獻] [專利文獻] [專利文獻1]日本專利特開2〇〇〇_43975號公報 141273.doc 201016463 [專利文獻2]曰本專利特開2002_53 195號公報 [專利文獻3]曰本專利特開2003-95320號公報 [專利文獻4]曰本專利特開2006-143227號公報 【發明内容】 [發明所欲解決之問題] 本發明之目的在於提供一種收納底紙用多層紙基材及其 製造方法,可防止藉由沖孔加工或壓花加工而形成收納晶 片型電子零件之模穴時之模具磨損,使模穴之形成精度提 高’而且可防止由彎曲應力引起之層間剝離及形成模穴時 之紙粉之產生。 [解決問題之技術手段] 本發明者等對使用於收納底紙用多層紙基材之原材料進 行了研究’尤其對紙漿纖維及無機填充材料進行了研究。 結果發現:使用源於廢紙之紙漿纖維及源於廢紙之無機填 充材料,進而特別規定紙漿纖維與無機填充材料之含有比 率無機填充材料之粒徑,藉此可解決本發明之問題。繼 而,根據該見解,進一步進行研究,發明了以下之收納底 紙用多層紙基材及其製造方法。 亦即’本發明包含以下之發明。 Π]一種晶片型電子零件收納底紙用多層紙基材,其特徵在 於: 於表層以外之層中含有源於廢紙之紙漿纖維及無機填充 材料, 源於廢紙之紙漿纖維與無機填充材料之合計之含有比率 U1273.doc 6 - 201016463 為5〜70質量百分比(%) ’灰分為丨〜15質量百分比(%), 上述無機填充材料之質量平均粒徑未滿5〇 μιη,且以未 滿40質量百分比(%)之範圍包含粒徑為5〇 μπι以上之無機填 充材料。 [2] 如[1]之晶片型電子零件收納底紙用多層紙基材,其中 灰分為1〜10質量百分比, 上述無機填充材料之質量平均粒徑未滿5〇 μιη,且以未 滿30質里百分比(%)之範圍包含粒徑為5〇 以上之無機填 充材料。 [3] 如[1]或[2]之晶片型電子零件收納底紙用多層紙基材, 其中 表層以外之層中所包含之所有紙漿纖維,具有長度為 0.2 mm以下之微細纖維之比例為2〇%以上之纖維長度分 布。 其中,纖維長度分布係利用由JApAN ΤΑρρι N〇 52所規 疋之光學性自動測量法中之紙漿纖維長度測試方法而測 疋經JIS P8220之紙漿碎解方法而碎解之測定試料之纖維長 度’並由數量基準而求出者。 [4] 一種晶片型電子零件收納底紙用多層紙基材之製造方 法,其特徵在於: 包括自廢紙製造包含紙漿纖維及無機填充材料之廢紙紙 聚之廢紙紙聚製造步驟;以及使用新鮮紙漿及廢紙紙漿對 多層紙基材抄紙之抄紙步驟; 於廢紙紙浆製造步驟中,對含有5質量百分比(%)以上之 141273.doc 201016463 作為灰分之無機填充材料之廢紙進行碎解處理,實施除塵 處理之後,實施分散處理,以使無機填充材料之質量平均 粒徑未滿50 μιη,無機填充材料中所含之粒徑為5〇 μιη以上 之無機填充材料之含有比率未滿4〇質量百分比(%); 於抄紙步驟中,將上述廢紙紙漿用於表層以外之層之抄 紙。 [5]如[4]之晶片型電子零件收納底紙用多層紙基材之製造 方法,其中 於上述分散處理中’使用分散器或加熱分散器。 [發明之效果] 根據本發明之多層紙基材’可防止藉由沖孔加工或壓花 加工而形成收納晶片型電子零件之模穴時之模具磨損,使 模穴之形成精度提高。又’根據本發明之多層紙基材,可 防止由彎曲應力引起之層間剝離及形成模穴時之紙粉之產 生。 根據本發明之多層紙基材之製造方法,可容易地製造如 上所述之多層紙基材。 【實施方式】 (晶片型電子零件收納底紙用多層紙基材) 對本發明之晶片型電子零件收納底紙用多層紙基材(以 下’省略為「多層紙基材」)之一實施形態進行說明。 本實施形態之多層紙基材係將新鮮紙漿及廢紙紙漿作為 抄紙原料經抄紙而成之多層之紙基材,如圖1所示,其包 括表層10、與具有中層21及底層22之中底層20。此處,表 141273.doc 201016463 層1〇係接著有頂蓋膠帶之-側之外層,底層22係與接著有 頂蓋膠帶之一側相反側之外層。&,較好的是中底層辦 之令層2!為多層。表層1G及底層以為-層即可。[Technical Field] The present invention relates to a multi-layer paper substrate for manufacturing a wafer-type electronic component storage base paper containing paper-type electronic components and a method of manufacturing the same. [Prior Art] A wafer-type electronic component storage base paper (hereinafter, abbreviated as "storage base paper") used as a carrier for a wafer-type electronic component is usually embossed by making a paper substrate for storing a liner paper into a belt shape. Manufactured by processing or perforating to form a cavity. The storage bottom paper is used in the following manner. That is, in the accommodating base paper obtained by embossing the paper substrate, the wafer type electronic component is directly filled into the cavity, and in the accommodating bottom paper obtained by the puncturing, the bottom cover tape is attached to the back side (bottom side). After the bottom surface is set, the wafer type electronic component is filled into the cavity. Then, the top cover tape is then attached to the surface (top side), wound on a cassette reel and shipped. Then, the user peels off the top cover tape, takes out the wafer type electronic component filled in the cavity, and mounts it to the printed substrate. ;x is used in the above manner, so the requirements for accommodating the backing paper do not adversely affect the quality of the filled wafer type electronic parts as follows; the surface has smoothness to be well adhered to the cover tape; The roll of the disk, for the bending stress, etc., causes interlayer peeling or bottom paper breakage; the formation of the die for inserting the chip type electronic component is good, and can be less. The wear of the parts and the molds used to form the cavities. It is especially important that the cavities are formed with good precision. That is, in the process of forming a cavity by using a punching machine or an embossing machine in the process of forming a cavity by a punching machine or an embossing machine, it is easy to get stuck in the wafer type when the inner wall surface of the cavity is not sharp (in the correct size). Electronic parts. Therefore, there is a problem when the wafer manufacturer fills the wafer type electronic component or when the manufacturer removes the wafer type electronic component. In order to improve the accuracy of the formation of the cavity, it is also possible to use a method of re-grinding the mold or making a new mold. However, the operability is lowered due to loss of time and yield, and the cost is increased. Further, in order to improve the accuracy of forming the cavity, the method of improving the mold itself to improve the wear of the mold is employed, but it is also required to improve the storage base paper for accommodating the wafer type electronic parts. For example, in Patent Documents j and 2, there is disclosed a method of adjusting the density of paper containing the bottom paper to improve the formability of the cavity. In Patent Document 3, a method of adjusting the elongation at break in the longitudinal direction and the transverse direction of the paper in the bottom paper to adjust the cavity formation property is disclosed. Patent Document 4 discloses a method of adjusting the ash content of the bottom paper to improve the cavity formation property. However, the wafer type electronic component housed in the cavity is becoming increasingly miniaturized. Actually, even in the method disclosed in Patent Document 4, the accuracy of forming the cavity is insufficient. Further, in the methods disclosed in Patent Documents 丨 to 4, the occurrence of interlayer peeling due to bending stress or the generation of paper powder when forming a cavity is not sufficiently solved. - [Patent Document 1] [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. JP-A-2003-95320 [Patent Document 4] JP-A-2006-143227 SUMMARY OF INVENTION [Problems to be Solved by the Invention] An object of the present invention is to provide a multi-layer paper for accommodating a base paper. The substrate and the method of manufacturing the same can prevent the mold from being worn when the cavity of the wafer-type electronic component is accommodated by punching or embossing, thereby improving the accuracy of forming the cavity, and preventing the interlayer caused by the bending stress The generation of paper powder when peeling off and forming a cavity. [Means for Solving the Problem] The present inventors have studied the raw materials used for accommodating a multi-ply paper base material for a base paper. In particular, pulp fibers and inorganic fillers have been studied. As a result, it has been found that the use of pulp fibers derived from waste paper and inorganic filler materials derived from waste paper, and in particular, the ratio of the ratio of the pulp fibers to the inorganic filler to the inorganic filler, whereby the problem of the present invention can be solved. Then, based on this finding, further research was conducted to invent the following multi-layer paper substrate for accommodating a base paper and a method for producing the same. That is, the present invention includes the following invention.多层] A multi-layer paper substrate for a wafer-type electronic component storage base paper, which comprises: a pulp fiber and an inorganic filler derived from waste paper in a layer other than the surface layer, and a pulp fiber and an inorganic filler derived from waste paper; The total content ratio of U1273.doc 6 - 201016463 is 5 to 70 mass% (%) 'ash is 丨 15 15% by mass (%), and the mass average particle diameter of the above inorganic filler is less than 5 〇 μιη, and The range of 40% by mass or more (%) includes an inorganic filler having a particle diameter of 5 μm or more. [2] The multi-layer paper substrate for a wafer type electronic component storage base paper according to [1], wherein the ash is 1 to 10% by mass, and the mass average particle diameter of the inorganic filler is less than 5 〇μιη, and less than 30 The percentage of the percentage (%) in the mass contains an inorganic filler having a particle diameter of 5 Å or more. [3] The multi-layer paper substrate for a wafer type electronic component storage base paper according to [1] or [2], wherein all of the pulp fibers contained in the layer other than the surface layer have a ratio of microfibers having a length of 0.2 mm or less. More than 2% of fiber length distribution. Wherein, the fiber length distribution is measured by the pulp fiber length test method in the optical automatic measurement method regulated by JApAN ΤΑρρι N〇52, and the fiber length of the test sample is determined by the pulp disintegration method of JIS P8220. And it is obtained from the number basis. [4] A method for producing a multi-layer paper substrate for a wafer type electronic component storage base paper, comprising: a manufacturing step of manufacturing waste paper from a waste paper comprising a pulp fiber and an inorganic filler; and a papermaking step of papermaking a multi-ply paper substrate using fresh pulp and waste paper pulp; in the waste paper pulp manufacturing step, waste paper containing 5 mass% (%) or more of 141273.doc 201016463 as an inorganic filler material of ash After the disintegration treatment, after the dust removal treatment, the dispersion treatment is performed so that the mass average particle diameter of the inorganic filler is less than 50 μm, and the content of the inorganic filler contained in the inorganic filler is 5 μm or more. 4% by mass (%); In the papermaking step, the above-mentioned waste paper pulp is used for papermaking of a layer other than the surface layer. [5] The method for producing a multilayer paper substrate for a wafer type electronic component storage liner according to [4], wherein a disperser or a heating disperser is used in the above dispersion treatment. [Effects of the Invention] The multi-layer paper substrate ' according to the present invention can prevent the mold from being worn when the cavity of the wafer-type electronic component is accommodated by punching or embossing, thereby improving the accuracy of forming the cavity. Further, the multi-ply paper substrate according to the present invention can prevent the occurrence of paper powder when the interlayer is peeled off by bending stress and the cavity is formed. According to the method for producing a multilayer paper substrate of the present invention, the multilayer paper substrate as described above can be easily produced. [Embodiment] (Multilayer paper substrate for wafer-type electronic component storage base paper) The embodiment of the multi-layer paper substrate for a wafer-type electronic component storage base paper of the present invention (hereinafter referred to as "multi-layer paper substrate") is carried out. Description. The multi-layer paper substrate of the present embodiment is a multi-layer paper substrate obtained by paper-making a fresh pulp and waste paper pulp as a papermaking raw material, as shown in FIG. 1 , which comprises a surface layer 10 and a middle layer 21 and a bottom layer 22 The bottom layer 20. Here, Table 141273.doc 201016463 Layer 1 is followed by a side outer layer of the top cover tape, and the bottom layer 22 is attached to the side opposite the side of the side of the top cover tape. &, it is better to have the middle layer of the layer 2! The surface layer 1G and the bottom layer may be a layer.

[新鮮紙漿J 本發明中,所謂新鮮紙漿,係指將木材或非木材之植物 作為原料而獲得之紙漿。於將植物作為料之新鮮紙聚令 不包含無機填充材料。[Fresh pulp J In the present invention, the term "fresh pulp" refers to pulp obtained by using wood or non-wood plants as raw materials. Fresh paper for plant as a material does not contain inorganic fillers.

作為新鮮紙漿,可列舉漂白化學紙漿⑽KP(Nadelholz Bkhed心也㈣’針葉漂白牛皮紙漿)、LBKP (Laubholz Bleached Kraft pulp,闊葉漂白牛皮紙衆)等)、 未漂白化學紙漿(NUKP(Nadelh〇lz UnMeached Κγ^Examples of the fresh pulp include bleached chemical pulp (10) KP (Nadelholz Bkhed heart), LBKP (Laubholz Bleached Kraft pulp), unbleached chemical pulp (NUKP (Nadelh〇lz) UnMeached Κγ^

Mp ’針葉未漂白牛皮紙聚)、LUKp(Laubh〇lzMp 'coniferous unbleached kraft paper poly), LUKp (Laubh〇lz

Kraft Pulp’闊葉未漂白牛皮紙榮)等)、機械紙浆非木材 纖維紙衆等。《中,自易於表現出強度,且未著色(為白 色)之方面考慮,更好的是漂白化學紙漿。 [廢紙紙漿] 本發月中,所谓廢紙紙漿,係指將廢紙再生而獲得之紙 漿。 此處,作為廢紙,例如可列舉:白色優質紙•方格紙等 使用過一次但印刷部分較少之紙、卡片•印刷有油墨之優 質紙·印刷有顏色之優質紙·製圖紙·白色藝術紙等印刷 物或經染色且使用了一次之紙、印刷用塗覆紙、飲料用包 裝衣、辦公用紙等已使用之優質系廢紙,進而可列舉印刷 有顏色之中質紙·印刷有顏色之硬質紙•經印刷或有顏色 141273.doc 201016463 之中質紙·經印刷或有顏色之紙板等事業系中質廢紙、報 紙•雜誌•雜紙等一般中質廢紙、無色牛皮紙•無色牛皮 紙之損紙•牛皮紙空袋•硬紙板等牛皮紙系廢紙等。 該等廢紙中,自多層紙基材中之源於廢紙之墨水含量變 少之觀點考慮’較好的是印刷部分少之紙。 廢紙紙漿較好的是未經印刷之廢紙之碎解紙漿、經脫墨 處理而除去了墨水部分之脫墨廢紙紙漿等未著色者。若收 納電子零件之模穴内已著色,則於收納零件後或取出零件 後之檢查步驟巾之圖像處理巾,有錯誤地識別為零件之可 能性。 於將廢紙作為原料之廢紙紙浆中,通常包含無機填充材 料此處,無機填充材料係源於廢紙内所添加之填料及塗 覆層中之顏料。 [表層] 通常’於收納底紙中,將晶片型電子零件收納至模穴中 之後’黏貼頂蓋膠帶,由最終使用者將頂蓋膠帶剝離並取 出晶片型電子零件。因此,要求㈣底紙用之多層紙基材 1之表層10與頂蓋膠帶之接著性高,且具有適度之剝離 性’故而較好的是僅使用不含有無機填充材料之新鮮紙 作為適於表層10之新鮮紙漿,可列舉漂白化學紙浆,但 並不限定於此。 構成表層10之紙漿纖維整體之加拿大標準游離度較好的 是300〜560 ml ’更好的是3〇〇〜5〇〇 m卜若紙襞纖維整體之 141273.doc 201016463 加拿大標準游離度為300 ml以上,則可防止紙漿良率之降 低、及由高密度化引起之分量虧損,若紙漿纖維整體之加 拿大標準游離度為560 ml以下,則可進一步提高層間強 度。 為了防止頂蓋膠帶之剝離性及細毛之產生,進而為了其 他目的’亦可於表層1〇中包含内添劑。 作為内添劑,例如可列舉松香系上漿劑、笨乙烯•順丁 烯二酸共聚合樹脂、苯乙烯•丙烯酸共聚合樹脂、苯乙 稀烯烴酸共聚合樹脂、烯丙基乙稀酮二聚物、烯基琥珀 酸酐等天然及合成之製紙用之内添上漿劑,紙力增強劑、 濾水良率提高劑、耐水化劑、消泡劑等。 又’亦可含有陽離子化澱粉、陽離子化聚丙烯酸醯胺、 聚乙烯亞胺、聚醯胺聚胺環氧氣丙烷、陽離子改質古亞 膠、陽離子改質聚乙烯醇等之陽離子性高分子等。 於可進一步防止層間剝離之方面考慮,較好的是含有分 子量為200萬以上之兩性聚丙烯酸醯胺紙力增強劑。兩性 聚丙烯酸醯胺紙力增強劑可於陰離子部經由鋁而吸附於紙 漿纖維,於陽離子部則可自我吸附,不易受到廢紙及/或 填料等引起之pH變化之影響,可穩定地增強纖維間結合。 又,若兩性聚丙烯酸醯胺紙力增強劑之分子量為2〇〇萬以 上,則可充分防止層間剝離。 較好的是,兩性聚丙烯酸醯胺紙力增強劑之含有比率為 設紙漿纖維為1 00質量百分比(%)時的0.5〜5.0質量百分比 (%)。若兩性聚丙烯酸醯胺紙力增強劑之添加量為0.5質量 141273.doc 201016463 百分比(%)以上,則可充分發揮紙力增強效果。然而,即 便添加量超過5.〇質量百分比(%),因紙力增強效果已達頂 點’故僅會導致成本變高。 [t底層] 構成中底層20之各層既可為所有層使用相同之抄紙原料 進行抄紙所得者,亦可為使用不同抄紙原料進行抄紙所得 者。如下所述,中層21與底層22之較佳構成不同,因此較 好的是,中層21與底層22為使用各不相同之抄紙原料進行 抄紙所得者。 響 中底層20之抄紙原料中之紙漿中包含廢紙紙漿。藉由於 中底層20之原料中包含廢紙紙漿,多層紙基材^乍為整體 而滿足以下之條件。 由下式求出之廢紙紙漿纖維與無機填充材料於多層紙基 材1中所佔之合計之含有比率為5〜7〇質量百分比。較好 的是,廢紙紙漿纖維與無機填充材料之合計之含有比率為 10〜50質量百分比(%)。 αι=(Μ1/Ν1)χ 1〇〇(〇/0) 參 此處,〜係廢紙紙漿纖維與無機填充材料於多層紙基材 1令所佔之合計之含有比率,Μι係中底層20中之廢紙錢 . 纖維與無機填充材料之合古+暂县 χγ # Π" <。冲質量,Νι係多層紙基材1之乾 、 燥固形物質量。 廢紙紙漿纖維與無機填充材料於多層紙基材^中所佔 。4之3有比率未滿5 f量百分比(%),則模穴形成精度 降低力超過70質量百分比㈤,則不僅存在纖維間結 141273.doc •12- 201016463 合變得過弱而引起層間剝離之可能性,且變得易產生紙 粉。 形成中底層2〇之廢紙紙槳之調配比例越高,又,多層紙 基材1中之中底層20之質量比例越高,則廢紙紙漿纖維與 無機填充材料於多層纸基材1中所佔之合計之含有比率越 多。 灰分為1〜15質量百分比(%)’較好的是1〜1〇質量百分比 (%)。此處’灰分係根據JIS P 8251以525°c煅燒多層紙基 ❿ 材1之試料,並由下述式所求出之值。Kraft Pulp' broadleaf unbleached kraft paper, etc.), mechanical pulp, non-wood fiber paper, etc. In the middle, it is better to bleach chemical pulp from the viewpoint of being easy to express strength and not being colored (white). [Waste Paper Pulp] In the current month, the term “waste paper pulp” refers to the pulp obtained by regenerating waste paper. Here, as the waste paper, for example, white high-quality paper, checkered paper, etc., which have been used once but have a small number of printed portions, cards, high-quality paper printed with ink, high-quality paper printed with color, and blueprints are listed. Printed materials such as art paper, or high-quality waste paper that has been used, such as paper, printing coated paper, beverage packaging, office paper, etc., which can be used as printed paper. Hard paper • Printed or colored 141273.doc 201016463 Medium-quality paper, printed or colored cardboard, medium-sized waste paper, newspapers, magazines, miscellaneous paper, etc., medium-sized waste paper, colorless kraft paper • colorless Kraft paper damaged paper • Kraft paper empty bags • Kraft paper such as cardboard is waste paper. Among these waste papers, from the viewpoint of the ink content of the waste paper from the multi-ply paper substrate being reduced, it is preferable that the paper having a small portion is printed. The waste paper pulp is preferably an uncolored one such as a pulverized pulp of unprinted waste paper or a deinked waste paper pulp which has been subjected to deinking treatment to remove the ink portion. If the cavity in which the electronic component is received is colored, the image processing towel of the inspection step after the component is stored or after the component is taken out is erroneously recognized as a component. The waste paper pulp which uses waste paper as a raw material usually contains an inorganic filler. Here, the inorganic filler is derived from the filler added in the waste paper and the pigment in the coating layer. [Surface] Normally, after the wafer-type electronic component is housed in the cavity in the storage liner, the top cover tape is adhered, and the end user tape is peeled off by the end user to take out the wafer-type electronic component. Therefore, it is required that (4) the surface layer 10 of the multi-ply paper substrate 1 for the backing paper has high adhesion to the top cover tape and has a moderate peeling property. Therefore, it is preferred to use only fresh paper containing no inorganic filler material as suitable. The fresh pulp of the surface layer 10 is, for example, bleached chemical pulp, but is not limited thereto. The Canadian standard freeness of the whole pulp fiber constituting the surface layer 10 is preferably 300 to 560 ml. More preferably, the thickness of the paper is 〇〇 141 〇〇 141 141 141 141 141 141 141 141 141 141 273 2010. When the amount is more than ml, the reduction in the pulp yield and the loss due to the high density can be prevented. If the Canadian standard freeness of the whole pulp fiber is 560 ml or less, the interlayer strength can be further improved. In order to prevent the peeling property of the top cover tape and the generation of fine hair, it is also possible to include an internal additive in the surface layer 1 for other purposes. Examples of the internal additive include a rosin-based sizing agent, a stupid ethylene-maleic acid copolymer resin, a styrene-acrylic copolymer resin, a styrene-olefin copolymer resin, and an allyl ketene. A sizing agent, a paper strength enhancer, a water filter yield improver, a water resistance agent, an antifoaming agent, and the like are added to natural and synthetic papermaking materials such as a polymer and an alkenyl succinic anhydride. Further, it may also contain a cationic polymer such as a cationized starch, a cationized polyacrylamide, a polyethyleneimine, a polyamine polyamine epoxide, a cationic modified guar gum, or a cationically modified polyvinyl alcohol. . In view of further preventing interlayer peeling, it is preferred to contain an amphoteric polyacrylamide paper strength enhancer having a molecular weight of 2,000,000 or more. The amphoteric polyacrylamide paper strength enhancer can be adsorbed to the pulp fiber through the aluminum in the anion portion, and can be self-adsorbed in the cationic portion, and is not easily affected by the pH change caused by the waste paper and/or the filler, and can stably strengthen the fiber. Combination. Further, if the molecular weight of the amphoteric polyacrylamide paper strength enhancer is 2,000,000 or more, interlayer peeling can be sufficiently prevented. It is preferable that the content ratio of the amphoteric polyacrylamide paper strength enhancer is 0.5 to 5.0% by mass (%) when the pulp fiber is 100% by mass (%). If the addition amount of the amphoteric polyacrylamide paper strength enhancer is 0.5 mass 141273.doc 201016463 percentage (%) or more, the paper strength enhancement effect can be fully exerted. However, even if the added amount exceeds 5. 〇 mass percentage (%), since the paper strength enhancement effect has reached the top point, it only causes the cost to become high. [t bottom layer] Each layer constituting the middle layer 20 may be obtained by papermaking using the same papermaking materials for all layers, or may be obtained by using different papermaking materials for papermaking. As described below, the intermediate layer 21 is different from the preferred structure of the underlayer 22. Therefore, it is preferable that the intermediate layer 21 and the underlayer 22 are obtained by papermaking using different papermaking materials. The pulp in the papermaking raw material of the middle layer 20 contains waste paper pulp. By the waste paper pulp contained in the raw material of the middle layer 20, the multilayer paper substrate as a whole satisfies the following conditions. The content ratio of the waste paper pulp fiber and the inorganic filler which are obtained by the following formula to the multilayer paper base 1 is 5 to 7 Å by mass. It is preferred that the total content of the waste paper pulp fiber and the inorganic filler is 10 to 50% by mass (%). Ιι=(Μ1/Ν1)χ 1〇〇(〇/0) Here, the ratio of the content of the waste paper pulp fiber and the inorganic filler to the multilayer paper substrate 1 is the total content of the ruthenium base layer 20 In the waste paper money. The combination of fiber and inorganic filler material + temporary county χ γ # Π "<. Punching quality, Νι is the dry and dry quality of the multi-layer paper substrate 1. Waste paper pulp fibers and inorganic filler materials are occupied by multi-layer paper substrates. 4 to 3 ratio is less than 5 f percentage (%), then the cavity formation accuracy reduction force exceeds 70 mass% (five), then there is not only the interfiber junction 141273.doc •12- 201016463 becomes too weak to cause interlayer peeling The possibility, and it becomes easy to produce paper powder. The higher the proportion of the waste paper pulp which forms the middle layer 2〇, and the higher the mass ratio of the bottom layer 20 in the multilayer paper substrate 1, the waste paper pulp fiber and the inorganic filler material in the multilayer paper substrate 1 The total content ratio of the total is taken up. The ash content is 1 to 15% by mass (%)', preferably 1 to 1% by mass (%). Here, the ash is a sample obtained by calcining a sample of the multilayer paper base material 1 at 525 ° C in accordance with JIS P 8251, and having the following formula.

Pi=(Pi/Qi)xl〇〇(%) 此處’ β!係灰分,卩丨係煅燒後之殘留物之質量,Qi係緞 燒前之多層紙基材1之乾燥固形物質量。 若灰分未滿1質量百分比(%),則無法防止模具之磨損, 若超過15質量百分比(%),則層間強度會降低,或者變得 易產生紙粉。再者’灰分對應於無機填充材料之量。 φ 灰分係源於廢紙紙漿者,故可藉由廢紙紙漿之調配比例 及用以獲得廢紙紙漿之廢紙中所含之無機填充材料之比例 而調整。 無機填充材料之質量平均粒徑未滿50 μιη,較好的是未 滿4〇 μΠ1。藉由無機填充材料之質量平均粒徑未滿50 μιη, 用以形成模穴之模具接觸時無機填充材料容易移動,因此 可防止模具之磨損。 又,無機填充材料中之粒徑為50 μιη以上之無機填充材 料之含有比率相對於全部無機填充材料刚質量百分比(% ) 141273.doc -13· 201016463 為未滿40質量百& ,。/、 比(/。)’較好的是未滿3〇質量百分比 (%)最好的疋〇質量百分比(%)。粒徑為叫以上之無機 填充材料於形成收納晶片型電子零件之模穴時與模具接觸 之概率較高。因此1含有的質量百分比(%)以上之粒徑 為50 μιη以上的較大無機填充材料則模具易磨損。 為使無機填充材料之粒徑分布為如上所述之範圍,可適 當調整下述分散處理之處理條件(例如,分散時間、剪斷 效率、處理溫度等)。例如,分散時間越長,剪斷效率越 高,則質量平均粒徑越小’粒徑為5〇 _以上之無機填充 材料之含有比率越少。 本發明中之粒徑係指由電子顯微鏡拍攝剖面所得圖像中 之各無機填充材料之最長的長度。例如,於無機填充材料 呈棒狀之情形時,本發明中之粒徑係其長度,於呈橢圓狀 之情形時係其長徑。 質量平均粒徑及粒徑為50 μιη以上之無機填充材料之含 有比率按以下方式求出。 首先,如表1所示之例般,對於粒徑為5 μιη以上且未滿 250 μιη之無機填充材料,分類成每隔1〇 粒徑之區間丨之 任一個(A)。設區間i中之上限之粒徑與下限之粒徑的中間 粒徑為Bi。又’設區間i之粒徑範圍令所含之無機填充材料 之個數相對於粒徑為5 μηι以上且未滿250 μπι之無機填充材 料之總數的比例為數量比率Ci。此處,設粒徑5 μιη以上 250 μηι之無機填充材料之總數為1〇〇質量百分比之原因 係粒徑未滿5 μηι之無機填充材料不會影響模具之磨損。再 141273.doc •14- 201016463 者,於存在粒徑為250 μιη以上之無機填充材料之情形時, 如包含最大徑者般增加區間i進行計算。 其次,根據[數1]求出區間i之質量比率Di。繼而,根據 [數2]求出質量平均粒徑。根據[數3]求出粒徑為50 μιη以上 之無機填充材料之含有比率。 [表1]Pi = (Pi / Qi) xl 〇〇 (%) Here, 'β! is the ash, the mass of the residue after calcination, and the dry solid mass of the multilayer paper substrate 1 before the satin burning. If the ash content is less than 1 mass% (%), the wear of the mold cannot be prevented. If it exceeds 15 mass% (%), the interlayer strength may be lowered or paper powder may be easily generated. Further, the 'ash' corresponds to the amount of the inorganic filler. The φ ash is derived from the waste paper pulp, so it can be adjusted by the proportion of the waste paper pulp and the proportion of the inorganic filler contained in the waste paper for obtaining waste paper pulp. The inorganic filler has a mass average particle diameter of less than 50 μηη, preferably less than 4 μ μ〇1. Since the mass average particle diameter of the inorganic filler is less than 50 μm, the inorganic filler is easily moved when the mold for forming the cavity contacts, and thus the wear of the mold can be prevented. Further, the content ratio of the inorganic filler having a particle diameter of 50 μm or more in the inorganic filler is less than 40 mass% &% with respect to the total mass percentage (%) of the entire inorganic filler 141273.doc -13· 201016463. /, ratio (/.)' is preferably less than 3 〇 mass percent (%) of the best 疋〇 mass percentage (%). The inorganic filler having a particle size of above has a high probability of coming into contact with the mold when forming a cavity for accommodating the wafer type electronic component. Therefore, the larger inorganic filler material having a particle diameter of 50 μm or more or more in mass percentage (%) or more contains a mold which is easily worn. In order to make the particle size distribution of the inorganic filler material as described above, the processing conditions (e.g., dispersion time, shearing efficiency, processing temperature, etc.) of the dispersion treatment described below can be appropriately adjusted. For example, the longer the dispersion time, the higher the shearing efficiency, the smaller the mass average particle diameter, and the smaller the content ratio of the inorganic filler having a particle diameter of 5 Å or more. The particle size in the present invention means the longest length of each inorganic filler in the image obtained by the cross section of the electron microscope. For example, in the case where the inorganic filler is in the form of a rod, the particle diameter in the present invention is the length thereof, and in the case of an elliptical shape, its long diameter. The content ratio of the inorganic filler having a mass average particle diameter and a particle diameter of 50 μm or more was determined as follows. First, as shown in Table 1, the inorganic filler having a particle diameter of 5 μm or more and less than 250 μm is classified into any one of the particle sizes (A). The intermediate particle diameter of the particle diameter of the upper limit in the interval i and the particle diameter of the lower limit is Bi. Further, the particle size range of the interval i is such that the ratio of the number of the inorganic fillers to the total number of the inorganic fillers having a particle diameter of 5 μη or more and less than 250 μm is the number ratio Ci. Here, the total amount of the inorganic filler having a particle diameter of 5 μm or more and 250 μηι is 1 〇〇 by mass. The inorganic filler having a particle diameter of less than 5 μη does not affect the wear of the mold. Further, in the case of the presence of an inorganic filler having a particle diameter of 250 μm or more, the interval i is increased as in the case of including the maximum diameter. Next, the mass ratio Di of the section i is obtained from [number 1]. Then, the mass average particle diameter was determined from [number 2]. The content ratio of the inorganic filler having a particle diameter of 50 μm or more was determined from [Number 3]. [Table 1]

(A) (Β) (C) (D) 區間i 粒徑 區間i之中間之 數量比率(%) 質量比率(%) (μιη) 粒徑(μιη) 例1 例2 例1 例2 1 5以上且未滿10 7.5 16.5 31.9 0.6 3.1 2 10以上且未滿20 15 35.9 24.2 5.2 9.5 3 20以上且未滿30 25 21.4 19.8 8.5 21,6 4 30以上且未滿40 35 14.6 15.4 11.4 32.9 5 40以上且未滿50 45 3.9 7.7 5.0 27.2 6 50以上且未滿60 55 1.9 1.1 3.8 5.8 7 60以上且未滿70 65 1.9 0.0 5.3 0.0 8 70以上且未滿80 75 1.0 0.0 3.5 0.0 9 80以上且未滿90 85 0.0 0.0 0.0 0.0 10 90以上且未滿100 95 0.0 0.0 0.0 0.0 11 100以上且未滿110 105 0.0 0.0 0.0 0.0 12 110以上且未滿120 115 0.0 0.0 0.0 0.0 13 120以上且未滿130 125 0.0 0.0 0.0 0.0 14 130以上且未滿140 135 0.0 0.0 0.0 0.0 15 140以上且未滿150 145 1.0 0.0 13.1 0.0 16 150以上且未滿160 155 1.0 0.0 14.9 0.0 17 160以上且未滿170 165 0.0 0.0 0.0 0.0 18 170以上且未滿180 175 0.0 0.0 0.0 0.0 19 180以上且未滿190 185 0.0 0.0 0.0 0.0 20 190以上且未滿200 195 0.0 0.0 0.0 0.0 21 200以上且未滿210 205 0.0 0.0 0.0 0.0 22 210以上且未滿220 215 1.0 0.0 28.7 0.0 23 220以上且未滿230 225 0.0 0.0 0.0 0.0 24 230以上且未滿240 235 0.0 0.0 0.0 0.0 25 240以上且未滿250 245 0.0 0.0 0.0 0.0 合計 100.0 100.0 100.0 100.0 質量平均粒徑(um) 121.2 34.0 粒徑為50 nm以上之無機填充材料之含有比率(%) 69.2 5.8 [數1] 質量比率(Di)= k(Bi2xCi) xlOO (%) t(Bi2xCi) 15- 141273.doc 201016463 [數2] 質量平均粒徑=t (所x D,·) (μιη) i=l [數3] 粒徑為50 μιη以上之無機填充材料之含有比率=之Di (%) i=6 再者,於[數1]中,使用Bi之2次方之原因係源於廢紙之 無機填充材料,尤其源於塗覆紙之塗覆層之無機填充材料 多數呈較薄之平板狀。 又,於本發明中,基於以下理由,以數量基準規定無機 填充材料之平均粒徑因並不適當。亦即,即便粒徑較小之 無機填充材料之數量比例較多,但若存在少數粒徑超過 100 μιη般之較大之無機填充材料,則模具切斷較大粒子之 概率亦較高,從而易引起模具之磨損。 較好的是,中底層20中所含之所有紙漿纖維具有長度為 0.2 mm以下之極細纖維之比例為20%以上之纖維長度分 布。本發明中之纖維長度分布係利用由JAPAN TAPPI No. 52所規定之光學性自動測量法中之紙漿纖維長度測試方 法,而測定經JIS P 8220之紙漿碎解方法碎解之測定試料 之纖維長度,並由數量基準而求出之纖維長度分布。 若長度為0.2 mm以下之極細纖維之比例為20%以上,則 可提高長度超過〇. 2 mm之纖維彼此之結合力,從而模穴形 成性將變得更高。 又,較好的是,0.2 mm以下之極細纖維之比例為70%以 下。若極細纖維之比例為70%以下,則阻礙紙漿纖維之濾 水性之情形較少,故而容易進行抄紙。 141273.doc -16- 201016463 為調整長度為0.2 mm以下之極細纖維之比例,可調整形 成中底層20之廢紙紙漿之調配比例。具體而言,廢紙紙漿 =調配比例越高,則長度為〇_2 mm以下之纖維之比例越 高。又,可在由廢紙獲得廢紙紙漿之後,進行下述之打浆 處理進行調整。 構成中底層20之紙漿纖維整體之加拿大標準游離度較好 的是250〜500 nU,更好的是250〜450 m卜 <底層> 鲁 底層22較好的是無機填充材料之含量較少,更好的是完 全不含無機填充材料。然而,亦可使用與中層2丨同樣之抄 紙原料作為底層22之抄紙原料。 為使無機填充材料之含量較少,較好的是底層22之廢紙 紙漿之含量較少,更好的是完全不含廢紙紙漿。 右底層22之無機填充材料之含量較少,則可提高底層22 之表面平滑性。由於存在底蓋膠帶接著於底層22之情形, • 故而表面平滑性較高對於接著性方面較好。 <中層> 較好的疋中層21作為整體而滿足以下條件。若滿足以下 之條件,則可容易滿足上述中底層2〇之各條件。 由下式求出之中層21中之廢紙紙漿纖維與無機填充材料 之合计之含有比率較好的是5〜8〇質量百分比(%),較好的 疋為10〜60質量百分比(%)。 a2=(M2/N2)xl〇〇(%) 此處’ α2係中層21中之廢紙紙漿纖維與無機填充材料之 H1273.doc •17· 201016463 合計之含有比率,Μ2係中層21中之廢紙紙漿纖維與無機填 充材料之合計質量,A係中層21之乾燥固形物質量。 形成中層21之廢紙紙漿之調配比例越高,則中層21中之 廢紙紙漿纖維與無機填充材料之合計之含有比率越多。 中層21之灰分量較好的是2 〇〜2〇質量百分比(%)。此 處’中層21之灰分係根據JIS ρ 8251,採取中層21作為試 料’以525 °C進行煅燒並由下式而求出之值。 P2=(P2/Q2)x1〇〇(%) 此處,β2係中層21之灰分,P2係烺燒後之殘留物之質 量,Q2係煅燒前之中層21之乾燥固形物質量。 中層21之灰分可藉由中層21之廢紙紙漿之調配比例及用 以獲得廢紙紙漿之廢紙中所含之無機填充材料之比例而調 整。 較好的是’中層21中所含之所有紙漿纖維具有長度為 0.2 mm以下之極細纖維之比例為2〇%以上之纖維長度分 布’更好的是具有極細纖維之比例為25〜5〇%之纖維長度 分布。 為調整中層21中所含之長度為0.2 mm以下之極細纖維之 比例,可調整形成中層21之廢紙紙漿之調配比例。具體而 δ ’廢紙紙衆之調配比例越高,則長度為〇 2 mm以下之纖 維之比例越高。 [作用效果] 新鮮紙漿纖維大多纖維相對較硬,纖維長度較長,剖面 接近正圓。與此相對,經紙漿化及用於製紙之碎解、打 141273.doc 201016463 漿、乾燥、抑铋 m ^ . ,,之各步驟(歷程)而由廢紙再生的廢紙紙漿 纖維中,藉A ^ 短。 丹生步驟時之藥品處理及機械處理而纖維變 廢紙紙漿纖維包含較多的短纖維。短纖維起到 增強如新錄έ j 用 、、裝纖維般之較粗纖維之網路與纖維交點之作 口此,包含廢紙紙漿纖維之本發明之多層紙基材中, 於形成槿 /吟模具接觸時,可防止較粗之纖維彼此離開。 源於廢紙之無機填充材料可阻礙纖維彼此之結合而 ㈣維間結合力變小。因此’形成模穴時之沖孔加工或壓 化口工時對模具之應力得到減輕,磨損得到防止。然而, 粒僅較大之無機填充材料反而會對模具造成應力。因此, 本發明中,藉由特別規定無機填充材料之質量平均粒徑及 粒徑分布,而確實地減輕對模具之應力,防止磨損。 如此,本發明之多層紙基材中,即使於形成模穴時較粗 之纖維仍彼此結合,並防止模具之磨損。因此,模穴内壁 面分明(sharp) ’模穴之形成精度較高。 籲 進而,纖維彼此之結合較強,因此可防止因彎曲應力引 起之層間剝離。 (多層紙基材之製造方法) 本發明之多層紙基材之製造方法包括:由廢紙製造包含 紙漿纖維及無機填充材料之廢紙紙漿之廢紙紙聚製造步 驟;以及使用新鮮紙漿及廢紙紙漿對多層紙基材抄紙之抄 紙步驟。 [廢紙紙漿製造步驟] 廢紙紙漿製造步驟中,對廢紙進行碎解處理,實施除塵 141273.doc -19- 201016463 處理後,實施分散處理。 此處,作為廢紙’可有效利用廢紙中之無機填充材料, 故可使用含有5質量百分比(%)以上之無機填充材料者較 好的是使用含有7質量百分比(%)以上之無機填充材料者。 又’就有效利用廢紙紙漿纖維之方面考慮,較好的是廢紙 中之無機填充材料為40質量百分比(%)以下。 碎解處理係將廢紙碎解而使其成為漿料狀之處理,通常 使用被稱為打槳機(pulper)之碎解機。 作為打漿機’例如可列舉以3〜5質量百分比(%)進行處理 _ 之低濃度打漿機,以5〜18質量百分比(%)進行處理之中噥 度打漿機’以18〜25質量百分比(%)進行處理之高濃度打漿 作為低濃度打漿機’可列舉被稱為轉子(_〇之攪掉翼 安裝於槽之底面或内壁面者。作為中漢度打漿機, 與上述低濃度打㈣同樣加域子㈣者,碎_為橫置 鼓形狀者。作為高濃度打漿機’可列舉槽 參 拌翼之捏合打槳機。 另夕增搜 又’於廢紙難以碎解之悟# & 使用解纖機。碎解之^時,除碎解機以外亦可輔助 :塵處理係將紙漿纖維及無機填充材料以外之異物除去 之處理’使用可除去異物之清潔器、網版。 ’、 =11係_狀’藉由離心分離之原理將砂或金屬 t重大於紙漿纖維之異物除去。 , 作為網版’例如可使用 使用形成有以特定之開π面積開口之 141273.doc -20. 201016463 孔或狹縫之籃框型者。為提高處理效率,較好的是使籃框 旋轉或振動,或者使轉子旋轉。 又,作為網版,亦可使用除去較大異物之Jansson網版、 平板狀之平板網版。 分散處理中,使無機填充材料分散,以使無機填充材料 之質量平均粒徑未滿50 μιη,且粒徑為5〇 以上之無機填 充材料於無機填充材料中所佔之含有比率未滿4 〇質量百分 比(%)。於該分散處理中,不僅可使無機填充材料分散, 亦可使殘墨變少。 於使用大量包含具有含顏料之塗層之塗覆紙之雜誌廢 紙,而碎解處理未能充分分散之情形時(尤其塗層較厚之 情形時),有時無機填充材料會成為相對較大之塊而殘 留。該塊有時即使利用除塵處理亦無法除去,而會包含於 廢紙紙漿中。當對使用包含較大之無機填充材料之廢紙紙 漿而獲得之多層紙基材實施沖孔加工或壓花加工時,可能 會加速模具之磨損。然而,即便使用包含大量塗覆紙之廢 紙,只要於分散處理中使無機填充材料分散成無機填充材 料之質量平均粒徑未滿5〇 μπι,且粒徑為5〇 μηι以上之無機 填充材料於無機填充材料中所佔之含有比率未滿4〇質量百 分比(%),則可防止模具之磨損。 作為分散處理中可使用之機械,例如可列舉精煉機 (Finer)、ConiFiner、TopFiner、coniDisc、精碎機、 Conical flaker、P〇werFiner等之碎解機、精研機雙圓盤 精研機、打漿機專之游離機、捏合機、分散器、分散器、 141273.doc -21 - 201016463 加熱分散器(加熱分散設備)、NEW TAIZEN等之混練•分 散機等。 該等中,較好的是分散器或加熱分散器。若使用分散器 或加熱分散器進行處理,則即便係固形物濃度為25質量百 刀比(/〇)以上之尚濃度,亦不會使游離度極端下降,可高 效率地使無機填充材料變細。 於藉由分散器或加熱分散器進行處理時,分散處理之效(A) (Β) (C) (D) Interval i Number of ratios in the middle of the particle size interval i (%) Mass ratio (%) (μιη) Particle size (μιη) Example 1 Example 2 Example 1 Example 2 1 5 or more And less than 10 7.5 16.5 31.9 0.6 3.1 2 10 or more and less than 20 15 35.9 24.2 5.2 9.5 3 20 or more and less than 30 25 21.4 19.8 8.5 21,6 4 30 or more and less than 40 35 14.6 15.4 11.4 32.9 5 40 or more And less than 50 45 3.9 7.7 5.0 27.2 6 50 or more and less than 60 55 1.9 1.1 3.8 5.8 7 60 or more and less than 70 65 1.9 0.0 5.3 0.0 8 70 or more and less than 80 75 1.0 0.0 3.5 0.0 9 80 or more Full 90 85 0.0 0.0 0.0 0.0 10 90 or more and less than 100 95 0.0 0.0 0.0 0.0 11 100 or more and less than 110 105 0.0 0.0 0.0 0.0 12 110 or more and less than 120 115 0.0 0.0 0.0 0.0 13 120 or more and less than 130 125 0.0 0.0 0.0 0.0 14 130 or more and less than 140 135 0.0 0.0 0.0 0.0 15 140 or more and less than 150 145 1.0 0.0 13.1 0.0 16 150 or more and less than 160 155 1.0 0.0 14.9 0.0 17 160 or more and less than 170 165 0.0 0.0 0.0 0.0 18 170 or more and less than 180 175 0.0 0.0 0.0 0.0 19 180 or more and less than 190 185 0.0 0.0 0.0 0.0 20 190 or more Less than 200 195 0.0 0.0 0.0 0.0 21 200 or more and less than 210 205 0.0 0.0 0.0 0.0 22 210 or more and less than 220 215 1.0 0.0 28.7 0.0 23 220 or more and less than 230 225 0.0 0.0 0.0 0.0 24 230 or more and less than 240 235 0.0 0.0 0.0 0.0 25 240 or more and less than 250 245 0.0 0.0 0.0 0.0 Total 100.0 100.0 100.0 100.0 Mass average particle diameter (um) 121.2 34.0 Content ratio of inorganic filler with particle diameter of 50 nm or more (%) 69.2 5.8 [Number 1] Mass ratio (Di) = k(Bi2xCi) xlOO (%) t(Bi2xCi) 15- 141273.doc 201016463 [Number 2] Mass average particle diameter = t (x D, ·) (μιη) i= l [Number 3] Content ratio of inorganic fillers with a particle size of 50 μm or more = Di (%) i = 6 Furthermore, in [Number 1], the reason for using Bi 2 is derived from waste paper. The inorganic filler material, especially the inorganic filler material derived from the coating layer of the coated paper, is mostly in the form of a thin flat plate. Further, in the present invention, the average particle diameter of the inorganic filler is not determined as appropriate based on the number of reasons. That is, even if the amount of the inorganic filler having a small particle diameter is large, if there are a small number of inorganic fillers having a particle diameter exceeding 100 μm, the probability of the mold cutting off the larger particles is also high. Easy to cause wear of the mold. Preferably, all of the pulp fibers contained in the middle layer 20 have a fiber length distribution in which the ratio of the ultrafine fibers having a length of 0.2 mm or less is 20% or more. The fiber length distribution in the present invention is determined by the pulp fiber length test method in the optical automatic measurement method specified by JAPAN TAPPI No. 52, and the fiber length of the test sample which is disintegrated by the pulp disintegration method of JIS P 8220 is measured. And the fiber length distribution obtained from the number basis. If the proportion of the ultrafine fibers having a length of 0.2 mm or less is 20% or more, the bonding strength of the fibers having a length exceeding 〇. 2 mm can be increased, and the cavity formation property becomes higher. Further, it is preferred that the ratio of the ultrafine fibers of 0.2 mm or less is 70% or less. When the ratio of the ultrafine fibers is 70% or less, the filtration of the pulp fibers is inhibited, so that papermaking is easy. 141273.doc -16- 201016463 To adjust the proportion of ultrafine fibers with a length of 0.2 mm or less, the ratio of the waste paper pulp to the middle layer 20 can be adjusted. Specifically, the higher the proportion of the waste paper pulp = the blending ratio, the higher the proportion of fibers having a length of 〇 2 mm or less. Further, after the waste paper pulp is obtained from the waste paper, the following beating treatment can be carried out to adjust. The Canadian standard freeness of the pulp fibers constituting the middle layer 20 is preferably 250 to 500 nU, more preferably 250 to 450 m. <underlayer> The bottom layer 22 is preferably a small amount of inorganic filler. More preferably, it is completely free of inorganic filler materials. However, it is also possible to use the same papermaking material as the middle layer 2 as the papermaking material of the bottom layer 22. In order to reduce the content of the inorganic filler material, it is preferred that the waste paper pulp of the bottom layer 22 is contained in a small amount, and more preferably, it is completely free of waste paper pulp. When the content of the inorganic filler of the right underlayer 22 is small, the surface smoothness of the underlayer 22 can be improved. Since there is a case where the bottom cover tape is attached to the bottom layer 22, the surface smoothness is high, and the adhesion is good. <Middle layer> The preferred mid-layer 21 as a whole satisfies the following conditions. If the following conditions are satisfied, the conditions of the above-mentioned middle and lower layers can be easily satisfied. The content ratio of the waste paper pulp fiber to the inorganic filler in the intermediate layer 21 is preferably from 5 to 8 % by mass (%), preferably from 10 to 60% by mass (%). . A2=(M2/N2)xl〇〇(%) Here, the content ratio of the waste paper pulp fiber in the middle layer 21 of the α2 system and the inorganic filler material H1273.doc •17· 201016463, the waste in the middle layer 21 of the Μ2 system The total mass of the paper pulp fiber and the inorganic filler, and the dry solid mass of the middle layer 21 of the A system. The higher the blending ratio of the waste paper pulp forming the intermediate layer 21, the higher the content ratio of the total amount of the waste paper pulp fibers and the inorganic filler in the intermediate layer 21. The ash component of the middle layer 21 is preferably 2 〇 to 2 〇 mass percent (%). Here, the ash of the middle layer 21 is obtained by calcining at 525 °C in accordance with JIS ρ 8251, taking the intermediate layer 21 as a sample, and obtaining the value obtained by the following formula. P2 = (P2 / Q2) x1 〇〇 (%) Here, β2 is the ash of the middle layer 21, P2 is the mass of the residue after the smoldering, and Q2 is the dry solid mass of the layer 21 before the calcination. The ash of the middle layer 21 can be adjusted by the ratio of the waste paper pulp of the middle layer 21 and the ratio of the inorganic filler contained in the waste paper for obtaining waste paper pulp. It is preferred that all of the pulp fibers contained in the middle layer 21 have a fiber length distribution in which the ratio of the ultrafine fibers having a length of 0.2 mm or less is 2% or more, and it is more preferable that the proportion of the ultrafine fibers is 25 to 5 %. Fiber length distribution. In order to adjust the ratio of the ultrafine fibers having a length of 0.2 mm or less contained in the intermediate layer 21, the blending ratio of the waste paper pulp forming the intermediate layer 21 can be adjusted. Specifically, the higher the proportion of δ 'waste paper paper, the higher the proportion of fibers with a length of 〇 2 mm or less. [Effects] Most of the fresh pulp fibers are relatively hard, the fiber length is long, and the profile is close to a perfect circle. On the other hand, in the waste paper pulp fiber which is recycled from waste paper by pulping and disintegration of paper, 141273.doc 201016463 pulp, drying, and inhibition of m ^ . A ^ short. The drug treatment and mechanical treatment in the Dansheng step and the fiber-waste waste paper pulp fiber contain more short fibers. The short fibers serve to enhance the intersection of the network and the fibers of the coarser fibers such as the new fibers, and the multi-ply paper substrate of the present invention comprising the waste paper pulp fibers. When the 吟 mold is in contact, it prevents the coarser fibers from leaving each other. The inorganic filler material derived from waste paper can hinder the bonding of the fibers to each other (4) The inter-dimensional bonding force becomes small. Therefore, the stress on the mold during the punching or pressing of the cavity is reduced, and the wear is prevented. However, only a larger inorganic filler material will cause stress on the mold. Therefore, in the present invention, by specifically specifying the mass average particle diameter and the particle diameter distribution of the inorganic filler, the stress on the mold is surely reduced to prevent abrasion. Thus, in the multi-ply paper substrate of the present invention, the coarser fibers are bonded to each other even when the cavity is formed, and the wear of the mold is prevented. Therefore, the sharpness of the inner wall of the cavity is highly accurate. Further, the fibers are strongly bonded to each other, so that peeling due to bending stress can be prevented. (Manufacturing Method of Multilayer Paper Substrate) The method for producing a multi-ply paper substrate of the present invention comprises: a waste paper forming step of producing waste paper pulp containing pulp fibers and inorganic filler from waste paper; and using fresh pulp and waste Papermaking step of paper pulp on papermaking of multi-layer paper substrates. [Waste Paper Pulp Manufacturing Step] In the waste paper pulp manufacturing step, the waste paper is subjected to disintegration treatment, and after the dust removal 141273.doc -19-201016463 is treated, the dispersion treatment is performed. Here, as the waste paper, the inorganic filler in the waste paper can be effectively utilized, so that it is preferable to use an inorganic filler containing 5 mass% or more, and it is preferable to use an inorganic filler containing 7 mass% or more. Material. Further, in view of the effective use of the waste paper pulp fiber, it is preferred that the inorganic filler in the waste paper is 40% by mass or less. The disintegration treatment is a process in which waste paper is disintegrated into a slurry form, and a disintegrator called a pulper is usually used. As the beater, for example, a low-concentration beater which is treated at 3 to 5 mass% (%) is treated with 5 to 18 mass% (%), and the twister is '18 to 25 mass% ( %) High-concentration beating for treatment as a low-concentration beater' is exemplified as a rotor (the smashing wing is attached to the bottom or inner wall of the groove. As a medium-sized beater, with the above-mentioned low concentration (four) Similarly, the domain (4) is added, and the broken _ is the shape of the transverse drum. As a high-concentration beater, the kneading and paddle-making machine of the slotted mixed-wing wing can be cited. In addition, the addition of the waste paper is difficult to disintegrate. # &amp ; Use a defibrating machine. When disintegrating, it can be assisted in addition to the disintegrating machine: Dust processing is a process of removing foreign matter other than pulp fibers and inorganic fillers. 'Use a cleaner that removes foreign matter, screen.' , =11 _-' removes the foreign matter of the sand or metal t from the pulp fiber by the principle of centrifugal separation. As the screen, for example, 141273.doc -20 can be used to form the opening with a specific opening π area. . 201016463 Hole or slit basket In order to improve the processing efficiency, it is preferable to rotate or vibrate the basket or to rotate the rotor. Also, as the screen, a Jansson screen or a flat plate screen which removes a large foreign matter can be used. The inorganic filler is dispersed such that the inorganic filler has a mass average particle diameter of less than 50 μm, and the inorganic filler having a particle diameter of 5 Å or more accounts for less than 4% by mass of the inorganic filler. (%). In the dispersion treatment, not only the inorganic filler may be dispersed, but also the residual ink may be reduced. A large amount of magazine waste paper containing coated paper having a pigment-containing coating is used, and the disintegration process is not When it can be sufficiently dispersed (especially when the coating is thick), the inorganic filler may remain as a relatively large block. The block may not be removed even by dust removal, but may be contained in waste paper. In the pulp, when the multi-ply paper substrate obtained by using the waste paper pulp containing the larger inorganic filler material is subjected to punching or embossing, the wear of the mold may be accelerated. However, even if waste paper containing a large amount of coated paper is used, it is only necessary to disperse the inorganic filler in the dispersion treatment to an inorganic filler having an average particle diameter of less than 5 μm, and having a particle diameter of 5 μm or more. When the content ratio of the inorganic filler is less than 4% by mass (%), the wear of the mold can be prevented. As the machine that can be used in the dispersion treatment, for example, a finisher (Finer), ConiFiner, TopFiner, and coniDisc can be cited. , fine crusher, Conical flaker, P〇werFiner and other disintegrators, lapping machine double disc lapping machine, beating machine special free machine, kneading machine, disperser, disperser, 141273.doc -21 - 201016463 Heating disperser (heating and dispersing equipment), mixing and dispersing machine such as NEW TAIZEN. Among these, a disperser or a heating disperser is preferred. When the disperser or the heat disperser is used for the treatment, even if the solid concentration is a concentration of 25 mass % (/〇) or more, the freeness is not extremely lowered, and the inorganic filler can be efficiently changed. fine. Dispersion treatment when treated by a disperser or a heated disperser

率提高,故而較好的是藉由蒸氣.加熱器而加熱至 80〜120〇C。 於分散處理中所用之機械為被處理之廢紙紙漿通過2片 圓盤之間的圓盤型加熱分散器之情形時,柔軟性變高且容 易分散’故而較好的是加熱。 又,較好的是,2片圓盤之間隙為適當的範圍。間隙越 小,則分散效率越高,但若過小,則處理效率反而會降 低’並且存在造成過載之傾向。 藉由經過上述碎解處理、除塵處理及分散處理,構成廢The rate is increased, so it is preferred to heat to 80 to 120 Torr C by means of a steam heater. The machine used in the dispersion treatment is a case where the treated waste paper pulp passes through a disc-type heating disperser between two discs, and the flexibility becomes high and it is easy to disperse. Therefore, heating is preferred. Further, it is preferable that the gap between the two discs is an appropriate range. The smaller the gap, the higher the dispersion efficiency, but if it is too small, the processing efficiency is lowered, and there is a tendency to cause an overload. By the above disintegration treatment, dust removal treatment and dispersion treatment, the waste is constituted

紙之紙漿纖維得以⑽化。χ,廢紙中之填料及顏料得以 微細化。例如,顏料個較大之塊被破碎為數十至數百 個較小的粒子》 較好的是於分散處理前 於使用印刷過之廢紙之情形時, 藉由浮選器等實施脫墨處理。 脫墨處理後之裂料中,灰分亦可與殘墨部分—同分散, 故而較好的是濃縮至固形物濃度成為1()〜35f量百分 之後實施分散處理。 141273.doc -22- 201016463 較好的是,於分散處理之後進而實施紙漿清洗處理。若 實施紙漿清洗處理,則可容易地使廢紙中之灰分量變低。 具體而言,若與分散處理一併實施紙漿清洗處理,則即便 大量使用灰分量超過25質量百分比(%)之廢紙,亦可容易 地將廢紙紙漿之灰分量調整為0.7〜25質量百分比(%)。因 此,於使用廢紙紙漿形成中底層20之多層紙基材i中 可 容易地使中底層20之灰分量為2.0〜20質量百分比(%)。 作為紙襞清洗處理中可使用之機械,例如可列舉dnt洗 • 滌機、精簡化洗滌機、下落洗滌機、BALIUS PRIT、化過 濾器、DP Cosmo、GAP洗滌機等之清洗裝置。 固形物濃度越低,則紙漿清洗處理中之灰分之除去效率 越高,故而較好的是於紙漿清洗處理之前將分散處理後之 紙漿漿料稀釋。 較好的是,於紙漿清洗步驟之前或處理過程中將 理後之紙漿漿料稀釋。 [抄紙步驟] 9 於抄紙步驟中,廢紙紙漿係用於中底層2〇之抄紙。表層 之抄紙僅使用新鮮紙漿。較好的是’底層22之抄紙亦僅 使用新鮮紙漿,但亦可將廢紙紙漿混合後使用。 又’為提高與蓋膠帶之接著性,或者為其他目的,亦可 於各層之抄紙原料中根據需要含有上述各種内添劑。 多層紙基材之基重可根據模穴内所收納之晶片型電子零 件之大小而適當選擇,通常為200〜1000 g/m2。 作為抄紙方法,ϋ質地容易操作之觀點考慮,較好的是 141273.doc -23- 201016463 3~10層之多層抄製。作為客恳 马多層抄製所用之抄紙機,例如可 列舉圓網多層抄紙機、圓網短 j姐網組合抄紙機、短網多層抄 紙機、長網多層抄紙機等。 為提南與頂蓋膠帶、底篆脲溫令吐# 你盂膠帶之接者性及防止細毛之產 生,亦可於多層紙基材1之矣人 在竹ί之表面或背面適當塗佈或含 面處理劑。 作為表面處理劑,例如可列舉聚乙烯醇、殿粉、聚丙稀 酸醯胺、丙烯酸樹脂、苯乙烯.丁二烯共聚樹脂、苯乙 烯·異戊二烯共聚樹脂、聚酯系樹脂、乙烯·乙酸乙烯酯 共聚樹脂、乙酸乙烯酯•乙烯醇共聚樹脂、胺酯樹脂等。 又,作為表面處理劑,亦可使用苯乙烯·順丁烯二酸共 聚樹脂、烯烴•順丁烯二酸共聚樹脂。若塗佈具有親水基 (羧基)之苯乙烯·順丁烯二酸共聚樹脂、烯烴•順丁烯二 酸共聚樹脂,則不僅可實現表面被覆,而且羧基會與紙漿 纖維形成氫鍵’從而可將纖維間交聯。因此,可使纖維間 結合進一步提高。藉由纖維間結合之提高,剝離頂蓋膠帶 或底蓋膠帶時之阻力提高,可使剝離強度變強,又,可進 一步防止細毛之產生。 作為於多層紙基材1之表面或背面塗佈·含浸表面處理 劑之機構,例如可使用棒塗機、刮刀塗佈機、氣刀塗佈 機、棒式塗佈機、門輥塗佈機或施膠壓榨或壓光塗佈機等 之輥式塗佈機、比爾刮刀塗佈機(Bill-blade coater)等之塗 佈裝置。該等中,藉由夾壓可使表面處理劑容易較深地浸 透,故而較好的是施膠壓榨或壓光塗佈機。 141273.doc -24- 201016463 表面處理劑之塗佈量較好的是以乾燥塗佈量計為〇 w 1 g/m2’更好的是G·6〜U咖2。若以乾燥塗佈量為(U g/m2 以上之方式塗佈表面處理劑,則可充分抑制細毛或紙粉之 產生,若以乾燥塗佈量為U g/m2以下之方式進行塗佈, 則可充分確保對頂蓋膠帶之接著力。 [作用效果] 上述多層紙基材1之製造方法中,係使用源於廢紙之短 、紙衆纖維製造多層紙基材1。藉由該製造方法而獲得之多 《紙基材1中’可防止模穴形成時較粗之紙漿纖維彼此分 開,又,藉由源於廢紙之無機填充材料而使纖維彼此之結 合力減小。因此’可防止模具之磨損,且可提高模六之形 成精度。Paper pulp fibers are (10). χ, the fillers and pigments in the waste paper are fine. For example, a larger block of the pigment is broken into tens to hundreds of smaller particles. It is preferable to perform deinking by a flotation device or the like in the case of using the printed waste paper before the dispersion treatment. deal with. In the crack after the deinking treatment, the ash may be dispersed in the same manner as the residual ink portion. Therefore, it is preferred to carry out the dispersion treatment after the concentration of the solid matter is 1 () to 35 f. 141273.doc -22- 201016463 It is preferred to carry out the pulp cleaning treatment after the dispersion treatment. If the pulp washing treatment is carried out, the ash content in the waste paper can be easily lowered. Specifically, when the pulp washing treatment is carried out together with the dispersion treatment, even if a large amount of waste paper having a ash content of more than 25% by mass (%) is used, the ash content of the waste paper pulp can be easily adjusted to 0.7 to 25 mass%. (%). Therefore, the ash component of the middle base layer 20 can be easily made 2.0 to 20 mass% (%) in the multilayer paper substrate i in which the intermediate layer 20 is formed using the waste paper pulp. Examples of the machine that can be used in the paper cleaning process include a dnt washing machine, a simplified washing machine, a falling washing machine, a BALIUS PRIT, a filter, a DP Cosmo, a GAP washer, and the like. The lower the solid content concentration, the higher the removal efficiency of the ash in the pulp cleaning treatment. Therefore, it is preferred to dilute the dispersion-treated pulp slurry before the pulp cleaning treatment. Preferably, the pulp slurry is diluted prior to or during the pulp cleaning step. [Papering Step] 9 In the papermaking step, the waste paper pulp is used for papermaking of the middle and bottom layers. The papermaking of the surface layer uses only fresh pulp. Preferably, the papermaking of the bottom layer 22 uses only fresh pulp, but the waste paper pulp can also be used after mixing. Further, in order to improve the adhesion to the cover tape or for other purposes, the various internal additives may be contained in the papermaking raw materials of the respective layers as needed. The basis weight of the multilayer paper substrate can be appropriately selected depending on the size of the wafer type electronic component housed in the cavity, and is usually 200 to 1000 g/m2. As a papermaking method, it is preferable to use 141273.doc -23-201016463 3~10 layers for the purpose of easy handling. As a paper machine used for multi-layer papermaking, for example, a rotary net multi-layer paper machine, a rotary net short jie net combination paper machine, a short net multi-layer paper machine, a long net multi-layer paper machine, and the like can be cited. For the touch of the South and the top cover tape, the bottom of the urea, the temperature of the spit # you can pick up the tape and prevent the generation of fine hair, can also be applied to the surface of the multi-layer paper substrate 1 on the surface or back of the bamboo or Contains a surface treatment agent. Examples of the surface treatment agent include polyvinyl alcohol, temple powder, polyacrylamide, acrylic resin, styrene-butadiene copolymer resin, styrene-isoprene copolymer resin, polyester resin, and ethylene. Vinyl acetate copolymer resin, vinyl acetate, vinyl alcohol copolymer resin, amine ester resin, and the like. Further, as the surface treatment agent, a styrene-maleic acid copolymer resin or an olefin-maleic acid copolymer resin can also be used. When a styrene-maleic acid copolymer resin having a hydrophilic group (carboxyl group) or an olefin-maleic acid copolymer resin is applied, not only surface coating but also a carboxyl group may form a hydrogen bond with the pulp fiber. Crosslink the fibers. Therefore, the interfiber bonding can be further improved. By increasing the bonding between the fibers, the resistance when the top cover tape or the bottom cover tape is peeled off is increased, the peel strength is made stronger, and the generation of fine hair can be further prevented. As a mechanism for coating or impregnating the surface treatment agent on the surface or the back surface of the multilayer paper substrate 1, for example, a bar coater, a knife coater, an air knife coater, a bar coater, or a door roll coater can be used. Or a coating machine such as a roll coater such as a size press or a calender coater or a biller coater (Bill-blade coater). Among these, the surface treatment agent can be easily penetrated deep by nip, and therefore, a size press or a calender coater is preferred. 141273.doc -24- 201016463 The coating amount of the surface treatment agent is preferably 〇 w 1 g/m 2 ' in terms of dry coating amount, more preferably G·6 to U coffee 2 . When the surface treatment agent is applied in a dry coating amount of (U g / m 2 or more, the generation of fine hair or paper powder can be sufficiently suppressed, and if the dry coating amount is U g / m 2 or less, the coating is performed. The adhesive force to the top cover tape can be sufficiently ensured. [Effects and Effects] In the method for producing the multilayer paper substrate 1, the multilayer paper substrate 1 is produced by using short paper fibers of waste paper. The method obtained in the "paper substrate 1" prevents the coarser pulp fibers from being separated from each other when the cavity is formed, and the bonding strength of the fibers to each other is reduced by the inorganic filler material derived from the waste paper. It can prevent the wear of the mold and improve the formation precision of the mold.

並且,根據本發明,可有效利用廢紙令之無機填充材料 (填料、顏料PMoreover, according to the present invention, the inorganic filler material (filler, pigment P) of waste paper can be effectively utilized.

[實施例] 以下,根據實施例對本發明進行詳細說明,但本發明不 限定於下述實施例。 再者,表示調配、濃度等之數值係固形物或有效成分之 質量基準之數值。 [廢紙紙漿之製造] &lt;廢紙紙漿A之製造方法&gt; 泮J用打漿機將雜s志廢紙(灰分為20.3%)碎解,通過除塵 裝置(清潔器及網版)之後,用水稀釋至固形物濃度為1%為 止’添加脫墨劑,利用浮選器實施脫墨處理。 141273.doc -25- 201016463 繼而,利用傾斜萃取器及螺旋壓力脫水機濃縮至固形物 濃度為30%左右為止。 然後’使用圓盤型之加熱分散設備(Selwood公司製 KRIMA),於圓盤之間隙為〇.2 mm、溫度為11 0°C之條件下 進行分散處理’進而一面以水進行稀釋一面通過紙漿清洗 機(DNT洗滌機:相川鐵工製),獲得含有紙漿纖維與無機 填充材料之廢紙紙漿A。對該廢紙紙漿A之灰分進行測 定,結果為7.3%。 &lt;廢紙紙漿B之製造方法&gt; 利用打漿機將製圖紙廢紙(灰分為33.2%)碎解,通過除 塵裝置(清潔器及網版)之後,利用傾斜萃取器及螺旋壓力 脫水機’濃縮至固形物濃度為30%左右為止。 然後,使用圓盤型之加熱分散設備(Selw〇〇d公司製 KRIMA),於圓盤之間隙為〇 2 mm、溫度為j丨〇。匚之條件下 進行分散處理,進而一面用水稀釋一面通過紙漿清洗機 (DNT洗滌機:相川鐵工製)’獲得含有紙漿纖維與無機填 充材料之廢紙紙漿B。對該廢紙紙漿B之灰分進行測定, 結果為23.5%。 &lt;廢紙紙漿C之製造方法&gt; 利用打漿機將雜誌廢紙(灰分為2〇 3%)碎解,通過除塵 裝置(清潔器及網版)之後,用水稀釋至固形物漢度為1%為 止,添加脫墨劑,利用浮選器實施脫墨處理。 繼而,利用傾斜萃取器濃縮至固形物濃度為5%為止。 然後,通過雙圓盤精研機(DDR,d〇uMe I心邮 141273.doc -26 201016463 次,使游離度自3 58 ml降低至1 87 ml為止,獲得含有紙漿 纖維與無機填充材料之廢紙紙漿C。對該廢紙紙漿C之灰 分進行測定,結果為16.8%。 &lt;廢紙紙漿D之製造方法&gt; 利用打漿機將製圖紙之廢紙(灰分為33.2%)碎解,通過 除塵裝置(清潔器及網版)之後,通過雙圓盤精研機1次,使 游離度自358 ml降低至330 ml為止,獲得含有紙漿纖維與 無機填充材料之廢紙紙漿D。對該廢紙紙漿D之灰分進行 測定,結果為29.1%。 &lt;廢紙紙漿E之製造方法&gt; 利用打漿機將雜誌廢紙(灰分為20.3%)碎解,通過除塵 裝置(清潔器及網版)之後,用水稀釋至固形物濃度為1%為 止,添加脫墨劑,利用浮選器實施脫墨處理。 繼而’利用傾斜萃取器及螺旋壓力脫水機濃縮至固形物 濃度為15%左右為止。 然後,使用圓盤型之加熱分散設備(Selwood公司製 KRIMA),於圓盤之間隙為1.〇 mm、溫度為7(TC之條件下 進行分散處理,進而一面用水稀釋一面通過紙漿清洗機 (DNT洗滌機:相川鐵工製),獲得含有紙漿纖維與無機填 充材料之廢紙紙漿E。對該廢紙紙漿e之灰分進行測定,結 果為7.5%。 &lt;廢紙紙漿F之製造方法&gt; 利用打漿機將雜誌廢紙(灰分為20.3%)碎解,通過除塵 裝置(清潔器及網版)之後,用水稀釋至固形物濃度為丨0/〇為 141273.doc •27- 201016463 止,添加脫墨劑,利用浮選器實施脫墨處理。 繼而β用傾斜萃取器及螺旋壓力脫水機濃縮至固形物 濃度為30%左右為止。 然後,利用分散器(相川鐵卫製,TL1型)進行分散處 理,進而一面用水稀釋一面通過紙聚清洗機(dnt洗蘇 機:相川鐵工製),獲得含有紙漿纖維與無機填充材料之 廢紙紙裝Γ。對該廢紙紙漿F之灰分進行測定,結果為 7.3%。 〈廢紙紙漿G之製造方法&gt; 利用打漿機將印刷有顏色之廢紙(灰分為3丨3%)碎解, 通過除塵裝置(清潔器及網版)之後,用水稀釋至固形物濃 度為1%為止,添加脫墨劑,利用浮選器實施脫墨處理。 繼而,利用傾斜萃取器及螺旋壓力脫水機濃縮至固形物 濃度為30%左右為止。 然後,利用分散器(相川鐵工製,TL1型)進行分散處 理’進而一面用水進行稀釋一面通過紙漿清洗機(DNT洗 滌機:相川鐵工製)’獲得含有紙漿纖維與無機填充材料 之廢紙紙漿G。對該廢紙紙漿G之灰分進行測定,結果為 18·8%。 &lt;廢紙紙漿Η之製造方法&gt; 利用打漿機將雜誌廢紙(灰分為20.3%)碎解,通過除塵 裝置(清潔器及網版)之後,用水稀釋至固形物濃度為1〇/〇為 止,添加脫墨劑,利用浮選器實施脫墨處理。 繼而,利用傾斜萃取器濃縮至固形物濃度為5%左右為 141273.doc -28· 201016463 止。 然後,將雙圓盤精研機進行2段處理,使游離度自358 ml降低至232 ml為止,獲得含有紙漿纖維與無機填充材料 之廢紙紙漿Η。對該廢紙紙漿Η之灰分進行測定,結果為 16.6%。 &lt;廢紙紙漿I之製造方法&gt; 利用打漿機將雜誌廢紙(灰分為20.3%)碎解,通過除塵 裝置(清潔器及網版)之後,用水豨釋至固形物濃度為1%為 ® 止,添加脫墨劑,利用浮選器實施脫墨處理。 繼而,利用傾斜萃取器濃縮至固形物濃度為5%左右為 止。 然後’將雙圓盤精研機進行2段處理,使游離度自358 ml降低至274 ml為止,獲得含有紙漿纖維與無機填充材料 之廢紙紙漿I。對該廢紙紙漿〗之灰分進行測定,結果為 16.7%。 ❿ 〈廢紙紙漿J之製造方法&gt; 利用打漿機將製圖紙廢紙(灰分為33 2%)碎解,通過除 塵裝置(清潔器及網版)。 繼而’利用傾斜萃取器及螺旋壓力脫水機濃縮至固形物 濃度為30%左右為止。 然後’使用圓盤型之加熱分散設備(Selw〇〇d公司製 KRIMA) ’於圓盤之間隙為〇·2 mm、溫度為11(TC之條件下 進行刀政處理’獲彳于含有紙漿纖維與無機填充材料之廢紙 紙漿J。對該廢紙紙漿J之灰分進行測定 ,結果為30.3%。 141273.doc •29· 201016463 [多層紙基材之製造] 〈實施例1&gt; 利用雙圓盤精研機將NBKP : 30%、LBKP : 70%混合打 漿,調製成CSF(Canadian standard freeness,加拿大標準 游離度)460 ml,獲得表層形成用紙漿漿料。 利用雙圓盤精研機將NBKP : 10%、LBKP : 60%、廢紙 紙漿A : 30%混合打漿,調製成CSF(加拿大標準游離 度)410 m卜獲得中層形成用紙漿漿料。 利用雙圓盤精研機單獨將LBKP打漿,調製成CSF(加拿 大標準游離度)470 ml,獲得底層形成用紙漿漿料。 向各紙漿漿料中,相對於紙漿漿料之固形物100%而添 加2.0%之硫酸鋁。又,相對於紙漿漿料之固形物ι〇〇%而 添加0.50%之作為上漿劑之Size pine N-lll(荒川化學工業 公司製,松香乳液上漿劑)。又,相對於紙漿漿料之固形 物100。/。而添加2.0%之作為紙力增強劑之p〇lyStroI1 1250(荒 川化學工業公司製’兩性聚丙稀酸醯胺系紙力增強劑,分 子量300萬)。 利用長網5層抄合抄紙機對上述紙漿漿料進行多層抄 製,以使表層(1層)為100 g/m2、中層為(3層)6〇〇 g/m2、底 層(1層)為100 g/m2 ’進而,利用施膠壓榨機塗佈皂化度為 88莫耳%、聚合度為1〇〇〇之聚乙烯醇,使乾燥塗佈量為1.0 g/m2。 然後’利用機械壓光機進行平滑化處理,製造基重為 800 g/m2、厚度為〇 95mm之多層紙基材。 141273.doc 201016463 &lt;實施例2&gt; 作為中層形成用紙漿漿料之原料,使用NBKP : 10%、 LBKP : 20%、廢紙紙漿 B : 70% 代替 NBKP : 10%、 LBKP : 60%、廢紙紙漿A : 30%,除此以外與實施例1同樣 地製造基重為800 g/m2、厚度為0.95 mm之多層紙基材。 &lt;實施例3&gt; 1 作為中層形成用紙漿漿料之原料,使用NBKP : 10%、 LBKP : 40%、廢紙紙漿 C : 50% 代替 NBKP : 10%、 ® LBKP : 60%、廢紙紙漿A ·· 30%,除此以外與實施例1同樣 地製造基重為800 g/m2、厚度為0.95 mm之多層紙基材。 〈實施例4&gt; 作為中層形成用紙漿漿料之原料,使用NBKP : 10%、 LBKP : 75%、廢紙紙漿 F : 15% 代替 NBKP : 10%、 LBKP : 60%、廢紙紙漿A : 30%,除此以外與實施例1同樣 地製造基重為800 g/m2、厚度為0.95 mm之多層紙基材。 〈實施例5&gt; 作為中層形成用紙漿漿料之原料,使用NBKP : 10%、 LBKP : 30%、廢紙紙漿 G : 60% 代替 NBKP : 10%、 • LBKP : 60%、廢紙紙漿A : 30%,除此以外與實施例1同樣 - 地製造基重為800 g/m2、厚度為0.95 mm之多層紙基材。 &lt;實施例6&gt; 作為中層形成用紙漿漿料之原料,使用NBKP : 10%、 LBKP : 10°/。、廢紙紙漿 G : 80% 代替 NBKP : 10%、 LBKP : 60%、廢紙紙漿A : 30%,作為底層形成用紙漿, 141273.doc -31 · 201016463 使用 LBKP ·· 50%、廢紙紙漿 G : 50%代替 LBKP : 100%, 除此以外與實施例1同樣地製造基重為800 g/m2、厚度為 0.95 mm之多層紙基材。 &lt;實施例7&gt; 作為中層形成用紙漿漿料之原料,使用NBKP : 10%、 LBKP : 40%、廢紙紙漿 G : 50% 代替 NBKP : 10%、 LBKP : 60%、廢紙紙漿A : 30%,作為底層形成用紙漿, 使用LBKP : 50%、廢紙紙漿G : 50%代替LBKP : 100%, 除此以外與實施例1同樣地製造基重為800 g/m2、厚度為 0.95 mm之多層紙基材。 〈實施例8&gt; 作為中層形成用紙漿漿料之原料,使用NBKP : 10%、 LBKP : 40%、廢紙紙漿 Η ·· 50% 代替 NBKP ·· 10%、 LBKP ·· 60%、廢紙紙漿A ·· 30%,除此以外與實施例1同樣 地製造基重為800 g/m2、厚度為0.95 mm之多層紙基材。 &lt;比較例1 &gt; 作為中層形成用紙漿漿料之原料,使用NBKP : 10%、 LBKP : 90% 代替 NBKP : 10%、LBKP : 60%、廢紙紙漿 A : 30%,除此以外與實施例1同樣地製造基重為800 g/m2、厚度為0.95 mm之多層紙基材。 〈比較例2&gt; 作為中層形成用紙漿漿料之原料,使用廢紙紙漿A : 100% 代替 NBKP : 10%、LBKP : 60%、廢紙紙漿 A : 30%, 除此以外與實施例1同樣地製造基重為800 g/m2、厚度為 141273.doc -32- 201016463 0.9 5 mm之多層紙基材。 &lt;比較例3 &gt; 作為中層形成用紙漿漿料之原料,使用廢紙紙漿D : 100%代替NBKP : 10%、LBKP : 60%、廢紙紙漿A : 30%, 除此以外與實施例1同樣地製造基重為800 g/m2、厚度為 0 · 9 5 mm之多層紙基材。 〈比較例4&gt; 作為中層形成用紙漿漿料之原料,使用NBKP : 10%、 LBKP : 40%、廢紙紙漿 E : 50% 代替 NBKP : 10%、 LBKP : 60%、廢紙紙漿A : 30%,除此以外與實施例1同樣 地製造基重為800 g/m2、厚度為0.95 mm之多層紙基材。 〈比較例5 &gt; 作為中層形成用紙漿漿料之原料,使用NBKP : 10%、 LBKP : 40%、廢紙紙漿I : 50%代替 NBKP : 10%、LBKP : 60%、廢紙紙漿A : 30%,除此以外與實施例1同樣地製造 基重為800 g/m2、厚度為0.95 mm之多層紙基材。 〈比較例6&gt; 作為中層形成用紙漿漿料之原料,使用NBKP : 10%、 LBKP : 20%、廢紙紙漿 J : 70%代替 NBKP : 10%、LBKP : 60%、廢紙紙漿A : 30%,除此以外與實施例1同樣地製造 基重為800 g/m2、厚度為0.95 mm之多層紙基材。 [多層紙基材之組成] 對於上述實施例1〜8及比較例1〜6之多層紙基材,利用下 述方法求出廢紙紙漿之灰分、中層及底層之廢紙紙漿調配 141273.doc -33- 201016463 率、多層紙基材之廢紙紙漿調配率、多層紙基材之灰分、 無機填充材料之質量平均粒徑、粒徑為5〇 μιη以上之無機 填充材料之含有比率、中底層之微細纖維之比例,總結於 表2中。 &lt;灰分之測定&gt; 廢紙紙漿及多層紙基材之灰分係根據JIS ρ 825丨,以 525°C煅燒試料並測定殘留物之質量,由下式而求出。 P=(P/Q)xl〇〇(%) 此處,β係灰分,P係煅燒後之殘留物之質量,Q係煅燒 前之乾燥固形物質量。 &lt;中層、底層及多層紙基材之廢紙紙漿調配率之求出方法&gt; 廢紙紙楽調配率係由下式求出。 α=(Μ/Ν)χ100(%) 此處,α係廢紙紙漿調配率,]^係所用廢紙紙漿之乾燥 固形物質量’ Ν係所用所有紙漿之乾燥固形物質量。 再者,多層紙基材之廢紙紙漿調配率與廢紙紙漿纖維及 無機填充材料於多層紙基材_所佔之合計之含有比率大致 等同。 &lt;無機填充材料之質量平均粒徑、粒徑為5〇 以上之無機 填充材料之含有比率之求出方法&gt; 利用掃描型電子顯微鏡(Hitachi mgh_Techn〇1〇gies[Examples] Hereinafter, the present invention will be described in detail based on examples, but the present invention is not limited to the following examples. Further, the numerical values indicating the blending, concentration, etc. are the values of the mass basis of the solid matter or the active ingredient. [Manufacture of waste paper pulp] &lt;Manufacturing method of waste paper pulp A&gt; 泮J used a beater to disintegrate miscellaneous waste paper (ash content: 20.3%), and after passing through a dust removing device (cleaner and screen), The deinking agent was added by diluting with water until the solid content concentration was 1%, and deinking treatment was carried out by a flotation device. 141273.doc -25- 201016463 Then, it was concentrated by a tilt extractor and a screw pressure dehydrator until the solid concentration was about 30%. Then, using a disc-type heating and dispersing device (KRIMA manufactured by Selwood Co., Ltd.), the dispersion treatment was carried out under the condition that the gap between the discs was 〇.2 mm and the temperature was 110 °C, and then the water was diluted while passing through the pulp. A washing machine (DNT washing machine: manufactured by Aikawa Iron Works) was used to obtain waste paper pulp A containing pulp fibers and inorganic filler materials. The ash of the waste paper pulp A was measured and found to be 7.3%. &lt;Manufacturing method of waste paper pulp B&gt; The paper waste paper (ash is 33.2%) is disintegrated by a beater, and after passing through a dust removing device (cleaner and screen), a tilt extractor and a screw pressure dehydrator are utilized. Concentrate until the solids concentration is about 30%. Then, a disc type heat dispersing device (KRIMA manufactured by Selw〇〇d Co., Ltd.) was used, and the gap between the discs was 〇 2 mm and the temperature was j丨〇. The dispersion paper was subjected to a dispersion treatment, and further, while being diluted with water, a waste paper pulp B containing pulp fibers and an inorganic filler was obtained by a pulp washing machine (DNT washing machine: manufactured by Aikawa Iron Works). The ash content of the waste paper pulp B was measured and found to be 23.5%. &lt;Manufacturing method of waste paper pulp C&gt; The magazine waste paper (ash is divided into 2〇3%) is disintegrated by a beater, and after passing through a dust removing device (cleaner and screen), it is diluted with water to a solidity of 1 As far as % is concerned, a deinking agent is added, and a deinking treatment is performed by a flotation device. Then, it was concentrated by a tilt extractor until the solid concentration was 5%. Then, through the double disc lapping machine (DDR, d〇uMe I 142273.doc -26 201016463 times, the freeness is reduced from 3 58 ml to 1 87 ml, and the waste containing pulp fibers and inorganic filler is obtained. Paper pulp C. The ash content of the waste paper pulp C was measured and found to be 16.8%. &lt;Manufacturing method of waste paper pulp D&gt; The waste paper of the drawing paper (ash content: 33.2%) was disintegrated by a beater. After the dust removing device (cleaner and screen), the free paper is reduced from 358 ml to 330 ml by a double disc lapping machine to obtain a waste paper pulp D containing pulp fibers and inorganic filler. The ash of the paper pulp D was measured and found to be 29.1%. &lt;Manufacturing method of waste paper pulp E&gt; The magazine waste paper (ash content: 20.3%) was disintegrated by a beater, and passed through a dust removing device (cleaner and screen) Thereafter, the mixture was diluted with water until the solid content concentration was 1%, a deinking agent was added, and a deinking treatment was performed by a flotation device. Then, it was concentrated by a tilt extractor and a screw pressure dehydrator until the solid concentration was about 15%. , using disc type heating The dispersing equipment (KRIMA manufactured by Selwood Co., Ltd.) was dispersed in a disc with a gap of 1. 〇mm and a temperature of 7 (TC), and further diluted with water while passing through a pulp washing machine (DNT washing machine: Aikawa Iron Works) The waste paper pulp E containing the pulp fiber and the inorganic filler material was obtained. The ash content of the waste paper pulp e was measured and found to be 7.5%. &lt;Manufacturing method of waste paper pulp F&gt; Magazine waste paper using a beater (Gray is 20.3%) Disintegrated, after passing through the dust removal device (cleaner and screen), dilute with water until the solid concentration is 丨0/〇 is 141273.doc •27- 201016463, add deinking agent, use flotation The deinking treatment was carried out. Then, the β was concentrated by a tilt extractor and a screw pressure dehydrator until the solid concentration was about 30%. Then, it was dispersed by a disperser (manufactured by Aikawa Tiewei, TL1 type), and further diluted with water. On one side, a paper-based cleaning machine (dnt washing machine: manufactured by Aikawa Iron Works) was used to obtain a waste paper package containing pulp fibers and inorganic fillers. The ash of the waste paper pulp F was measured and found to be 7.3. % <Manufacturing method of waste paper pulp G> Using a beater to disperse the printed waste paper (ash ash 3 3%), after passing through a dust removing device (cleaner and screen), dilute with water to a solid matter At a concentration of 1%, a deinking agent was added, and a deinking treatment was carried out by a flotation device. Then, the concentration was adjusted to about 30% by a tilt extractor and a screw pressure dehydrator. Then, a disperser (Aikawa Iron) was used. The TL1 type was subjected to a dispersion treatment, and further, while being diluted with water, a waste paper pulp G containing pulp fibers and an inorganic filler was obtained by a pulp washing machine (DNT washing machine: manufactured by Aikawa Iron Works). The ash content of the waste paper pulp G was measured and found to be 18.8%. &lt;Manufacturing method of waste paper pulp&gt; The magazine waste paper (ash content: 20.3%) was disintegrated by a beater, and after passing through a dust removing device (cleaner and screen), it was diluted with water to a solid concentration of 1 〇/〇. Up to now, a deinking agent was added, and a deinking process was performed by a flotation device. Then, use a tilted extractor to concentrate to a solid concentration of about 5% for 141273.doc -28· 201016463. Then, the double disc lapping machine was subjected to two treatments to reduce the freeness from 358 ml to 232 ml to obtain a waste paper pulp containing pulp fibers and an inorganic filler. The ash content of the waste paper pulp was measured and found to be 16.6%. &lt;Manufacturing method of waste paper pulp I&gt; The magazine waste paper (ash content: 20.3%) was disintegrated by a beater, and after passing through a dust removing device (cleaner and screen), the water was released to a solid concentration of 1%. ®, add deinking agent, and perform deinking treatment with a flotation device. Then, it was concentrated by a tilt extractor to a solid concentration of about 5%. Then, the double disc refiner was subjected to two treatments to reduce the freeness from 358 ml to 274 ml, and a waste paper pulp I containing pulp fibers and an inorganic filler was obtained. The ash content of the waste paper pulp was measured and found to be 16.7%. 〈 <Manufacturing method of waste paper pulp J> The paper waste paper (ash is divided into 33 2%) is disintegrated by a beater, and passed through a dust removing device (cleaner and screen). Then, it was concentrated by a tilt extractor and a screw pressure dehydrator until the solid content concentration was about 30%. Then, 'using a disc-type heating and dispersing device (KRIMA, manufactured by Selw〇〇d Co., Ltd.), 'with a gap of 〇·2 mm at a disc and a knife at a temperature of 11 (TC under the condition of TC) Waste paper pulp J with an inorganic filler material. The ash content of the waste paper pulp J was measured and found to be 30.3%. 141273.doc •29· 201016463 [Manufacturing of a multilayer paper substrate] <Example 1> Using a double disc The lapping machine combines NBKP: 30%, LBKP: 70% and mixes it into CSF (Canadian standard freeness) 460 ml to obtain a pulp slurry for surface layer formation. NBKP is used by a double disc lapping machine: 10%, LBKP: 60%, waste paper pulp A: 30% mixed beating, prepared into CSF (Canadian Standard Freeness) 410 m to obtain pulp slurry for intermediate layer formation. LBKP was beaten separately by a double disc lapping machine. 470 ml of CSF (Canadian Standard Freeness) was prepared to obtain a pulp slurry for forming an underlayer. To each pulp slurry, 2.0% of aluminum sulfate was added to 100% of the solids of the pulp slurry. Further, relative to the pulp The solid content of the slurry is added by 〇〇% 0.50% of Size pine N-lll (a rosin emulsion sizing agent manufactured by Arakawa Chemical Industries Co., Ltd.) as a sizing agent. Further, it is added as a paper strength with respect to the solid content of the pulp slurry of 100%. P〇lyStroI1 1250 (amphoteric polyacrylic acid amide-based paper strength enhancer, molecular weight 3 million) made by abandoned 5-layer papermaking machine The surface layer (1 layer) is 100 g/m2, the middle layer is (3 layers), 6 〇〇g/m2, and the bottom layer (1 layer) is 100 g/m2'. Further, the saponification degree is 88 by the size of the size press. The polyvinyl alcohol having a % by ear and a degree of polymerization of 1 使 was applied to a dry coating amount of 1.0 g/m 2 . Then, it was smoothed by a mechanical calender to have a basis weight of 800 g/m 2 and a thickness of 〇. 95 mm multilayer paper substrate. 141273.doc 201016463 &lt;Example 2&gt; As a raw material for the intermediate layer forming pulp slurry, NBKP: 10%, LBKP: 20%, waste paper pulp B: 70% instead of NBKP: 10% was used. A basal weight of 800 g/m 2 was produced in the same manner as in Example 1 except that LBKP: 60% and waste paper pulp A: 30%. A multilayer paper substrate of 0.95 mm. &lt;Example 3&gt; 1 As a raw material for the pulp slurry for intermediate layer formation, NBKP: 10%, LBKP: 40%, waste paper pulp C: 50% instead of NBKP: 10%, A multilayer paper substrate having a basis weight of 800 g/m 2 and a thickness of 0.95 mm was produced in the same manner as in Example 1 except that the LBKP was 60% and the waste paper pulp A was 30%. <Example 4> As a raw material for the pulp slurry for intermediate layer formation, NBKP: 10%, LBKP: 75%, waste paper pulp F: 15% instead of NBKP: 10%, LBKP: 60%, waste paper pulp A: 30 was used. A multilayer paper substrate having a basis weight of 800 g/m 2 and a thickness of 0.95 mm was produced in the same manner as in Example 1 except for the above. <Example 5> As a raw material for the pulp slurry for intermediate layer formation, NBKP: 10%, LBKP: 30%, waste paper pulp G: 60% instead of NBKP: 10%, • LBKP: 60%, waste paper pulp A: A multilayer paper substrate having a basis weight of 800 g/m 2 and a thickness of 0.95 mm was produced in the same manner as in Example 1 except for 30%. &lt;Example 6&gt; As a raw material of the pulp slurry for intermediate layer formation, NBKP: 10% and LBKP: 10°/ were used. Waste paper pulp G: 80% instead of NBKP: 10%, LBKP: 60%, waste paper pulp A: 30%, used as the base paper, 141273.doc -31 · 201016463 LBKP ·· 50%, waste paper pulp G: 50% instead of LBKP: 100%, a multilayer paper substrate having a basis weight of 800 g/m 2 and a thickness of 0.95 mm was produced in the same manner as in Example 1. &lt;Example 7&gt; As a raw material for the pulp slurry for intermediate layer formation, NBKP: 10%, LBKP: 40%, waste paper pulp G: 50% instead of NBKP: 10%, LBKP: 60%, waste paper pulp A: 30%, a base weight of 800 g/m2 and a thickness of 0.95 mm were produced in the same manner as in Example 1 except that LBKP: 50%, waste paper pulp G: 50% was used instead of LBKP: 100%. Multi-layer paper substrate. <Example 8> As a raw material for the pulp slurry for intermediate layer formation, NBKP: 10%, LBKP: 40%, waste paper pulp Η ·· 50% instead of NBKP ·· 10%, LBKP ··60%, waste paper pulp A multilayer paper substrate having a basis weight of 800 g/m 2 and a thickness of 0.95 mm was produced in the same manner as in Example 1 except that 30% of A·· was used. &lt;Comparative Example 1 &gt; As a raw material for the pulp slurry for intermediate layer formation, NBKP: 10%, LBKP: 90% was used instead of NBKP: 10%, LBKP: 60%, and waste paper pulp A: 30%, and In Example 1, a multilayer paper substrate having a basis weight of 800 g/m 2 and a thickness of 0.95 mm was produced in the same manner. <Comparative Example 2> As the raw material for the pulp slurry for intermediate layer formation, the same was used as in Example 1 except that the waste paper pulp A: 100% was used instead of NBKP: 10%, LBKP: 60%, and waste paper pulp A: 30%. A multilayer paper substrate having a basis weight of 800 g/m 2 and a thickness of 141273.doc -32 - 201016463 0.9 5 mm was produced. &lt;Comparative Example 3 &gt; As a raw material for the intermediate layer-forming pulp slurry, waste paper pulp D: 100% was used instead of NBKP: 10%, LBKP: 60%, and waste paper pulp A: 30%, and the examples were 1 A multilayer paper substrate having a basis weight of 800 g/m 2 and a thickness of 0.95 mm was produced in the same manner. <Comparative Example 4> As a raw material for the pulp slurry for intermediate layer formation, NBKP: 10%, LBKP: 40%, waste paper pulp E: 50% instead of NBKP: 10%, LBKP: 60%, and waste paper pulp A: 30 were used. A multilayer paper substrate having a basis weight of 800 g/m 2 and a thickness of 0.95 mm was produced in the same manner as in Example 1 except for the above. <Comparative Example 5 &gt; As a raw material for the pulp slurry for intermediate layer formation, NBKP: 10%, LBKP: 40%, waste paper pulp I: 50% instead of NBKP: 10%, LBKP: 60%, waste paper pulp A: A multilayer paper substrate having a basis weight of 800 g/m 2 and a thickness of 0.95 mm was produced in the same manner as in Example 1 except for the above. <Comparative Example 6> As a raw material for the pulp slurry for intermediate layer formation, NBKP: 10%, LBKP: 20%, waste paper pulp J: 70% instead of NBKP: 10%, LBKP: 60%, and waste paper pulp A: 30 were used. A multilayer paper substrate having a basis weight of 800 g/m 2 and a thickness of 0.95 mm was produced in the same manner as in Example 1 except for the above. [Composition of Multilayer Paper Substrate] With respect to the multilayer paper substrates of Examples 1 to 8 and Comparative Examples 1 to 6, the ash, middle layer and bottom layer of waste paper pulp of waste paper pulp were obtained by the following method 141273.doc -33- 201016463 rate, waste paper pulp preparation ratio of multi-layer paper substrate, ash content of multi-layer paper substrate, mass average particle diameter of inorganic filler, content ratio of inorganic filler having particle diameter of 5 〇μηη or more, medium-bottom layer The proportion of the fine fibers is summarized in Table 2. &lt;Measurement of ash&gt; The ash of the waste paper pulp and the multi-ply paper base material was obtained by calcining the sample at 525 ° C according to JIS ρ 825 并 and measuring the mass of the residue, and the following formula was used. P = (P / Q) x l 〇〇 (%) Here, β is ash, P is the mass of the residue after calcination, and Q is the mass of the dried solid before calcination. &lt;Method for determining the distribution ratio of waste paper pulp of the middle layer, the bottom layer and the multilayer paper substrate&gt; The distribution ratio of the waste paper pulp is determined by the following formula. α=(Μ/Ν)χ100(%) Here, the blending ratio of α-based waste paper pulp,] is the dry solids quality of the waste paper pulp used. The dry solid mass of all pulps used in the system. Further, the ratio of the waste paper pulp blending ratio of the multi-ply paper base material to the total ratio of the waste paper pulp fibers and the inorganic filler to the multi-ply paper base material is substantially the same. &lt;Method for determining the content ratio of the inorganic filler having a mass average particle diameter of 5 Å or more and an inorganic filler; &gt; Using a scanning electron microscope (Hitachi mgh_Techn〇1〇gies)

Manufacture &amp; Service公司製S3600N)連續拍攝多層紙基材 之剖面之0.95 mmx 10 mm之區域,由其圖像中抽取最長部 分為5 μιη以上之無機填充材料ι〇〇個以上。繼而,根據上 141273.doc •34· 201016463 分為5 以上之無機填充材料loo個以上。繼而,根據上 述數2求出質量平均粒徑,根據上述數3求出粒徑為50 μιη 以上之無機填充材料之含有比率。 &lt;中底層之極細纖維之比例之測定&gt; 中底層之極細纖維之比例係對多層紙基材之中底層藉由 使用人工散解機之標準法進行紙聚之碎解,並使用Kaj aani 公司製之纖維長度分布測定機「Fiber Lab」測定纖維長度 分布而求出。測定纖維根數為1 〇〇〇〇根以上。 再者,中底層採取以下方式。 將分割成8 mm寬度之帶狀之多層紙基材浸潰於自來水 中一晝夜,使紙充分濕潤,將i層表層剝開分離,採取中 底層。 141273.doc -35- 201016463 &lt;N&lt; 中底層之 微細織維 之比例(%) cn vS m 寸· 寸 m Ο 卜 Η VO vq Pi 卜 σί $ 00 cs 卜 00 m 寸 ί钵Ϊ 5 ^ i-Mii 04 ΐτί 寸 fW rs 00 &lt;N ο 卜 ν〇 CN m 00 cs 00 寸 00 1 寸 σ\ V-&gt; ^±Β οο ο; CN cs »〇 cn T-H 1—Η cn ΓΛ 00 m m VO m ON 00 jn I v〇 oo m ΓΊ 多層紙基材1 之灰分(%) _1 VC ΓΛ ri VO *η 00 Os O) 卜 os vd ΓΛ Ο 00 cs 00 oi 寸 v〇 ΟΟ in 多層紙基材之 廢紙紙漿 調配率(%) »Ti &lt;Ν &lt;Ν »r&gt; &lt;N *Λ »r&gt; Pi rn JO ΓΛ v〇 VO 00 Ο VQ jn ΙΛ K Ρί &lt;N »η V ^ «?鉍w Ο O o Ο ο 沄 o Ο o o o Ο ο V W S? «?鲧U -δ- ^ 沄 o s g 沄 Ο o H o ο 廢紙之 灰分(%) rn &lt;N 00 ψ-^ ΓΛ c4 CN| »—· ri (N Η (N &lt;N v〇 vd I rn On &lt;N •η 卜 分散處理 方法 加熱分散 間陈0.2 mm 加熱分散 間隙0_2 mm DDR 2段處理 分散器 分散器 分散器 分散器 DDR 2段處理 1 加熱分散 間隙0.2 mm DDR 1段處理 加熱分散 間隙1.0 mm DDR 2段處理 加熱分散 間隙0.2 mm &lt; CQ u Uh Ο O o X &lt; Q ω I-H 實施例1| 實施例2 實施例3 1實施例4| 1實施例5| |實施例6| |實施例7| 實施例8 比較例1 比較例2 比較例3 比較例4 比較例5 比較例6 -36- 141273.doc 201016463 [多層紙基材之評價] 對於上述實施例1〜8及比較例1〜6中製造多層紙基材利 用下述方法,對模具磨損性、Z軸強度、模穴形成精度、 紙粉產生防止性進行評價。表3表示評價結果。再者,以 下之測定及評價係於實施前處理之後進行,該前處理係根 據JIS P 8111將所抄製之多層紙基材調整為溫度為 23°C±1°C、相對濕度為50%±2%之狀態。 &lt;模具磨損性評價&gt; 使用 JAPAN AUTOMATIC MACHINE公司製的 ACP5〇5s 型穿孔機,對分割成8 mm寬度之帶狀之未形成模穴的多層 紙基材’根據JIS C 0806-3 ’以2 mm間隔連續沖孔3〇〇萬 處’形成模穴。此時’作為模具係使用研磨後之新模具。 又’模穴之形狀係使寬度方向之長度為112 mm,使流動 方向之長度為0.62 mm。 繼而’利用放大鏡觀察300萬發模穴之剖面部分,研究 細毛產生之狀況,根據該細毛產生狀況對模具磨損進行評 價。目測評價之等級(grade)如下’若為等級1、2,則係實 用方面可用之水平。 等級1 :完全觀察不到細毛(幾乎無模具磨損)。 等級2 :於1.12 mm邊之寬度觀察到1〜3根細毛(模具磨損 極小)。 等級3 :於1.12 mm邊之寬度觀察到4〜1 〇根細毛(稍有模 具磨損)。 等級4 :於1.12 mm邊之寬度觀察到11〜20根細毛(相當有 141273.doc -37- 201016463 模具磨損)。 等級5 :於1.12 mm邊之寬度觀察到20根以上之細毛(模 具磨損嚴重,需要研磨或更換)。 &lt;Z軸強度之測定&gt; Z轴強度係根據TAPPI實用測試法UM584而測定。若z轴 強度為200 N/(25 mm)2以上,則即便於將收納底紙捲繞於 卷盤上時產生彎曲應力,亦不易引起層間剝離。 &lt;模穴形成精度之評價&gt; 自表面側用實體顯微鏡分別拍攝上述&lt;模具磨損評價&gt;中 參 之第300萬次沖孔之前2〇次之模穴。圖2表示所拍攝之照片 之一例。該照片中之黑色部分係模穴,其周圍係收納底紙 之表層。 對於各模穴之照片,測量流動方向之最窄長度,評價模 穴形成精度。模穴之流動方向之最窄長度越長,則凹凸高 度越低’模穴形成精度越高。 此處,模穴之流動方向之最窄長度如將圖2之照片模式 化之圖3所示,係與流動方向垂直的彼此對向之模穴内壁參 面30、30中最突出之部分31、31彼此之與流動方向平行的 長度b。 砰價如下。評價◎、〇、△為實用方面可用之水平。 汗價◎:模穴之流動方向之最窄長度b之平均值㈣〇)為 〇·5 8 mm以上。 秤價〇:模穴之流動方向之最窄長〇之平均值(η, 為〇.56mm以上且未滿〇.58mm。 141273.d« -38· 201016463 評價△:模穴之流動方向之最窄長度b之平均值(n=20)為 0.5 4 mm以上且未滿0 · 5 6 mm。 評價x :模穴之流動方向之最窄長度b之平均值(n=20)為 未滿 0.54 mm。 &lt;紙粉產生防止性評價方法&gt;Manufacture &amp; Service Co., Ltd. S3600N) continuously photographs a 0.95 mm x 10 mm section of a cross-section of a multi-ply paper substrate, and extracts more than 5 μm of inorganic filler material from the image. Then, according to the above 141273.doc •34· 201016463, more than 5 inorganic fillers are more than loo. Then, the mass average particle diameter was determined from the above-mentioned number 2, and the content ratio of the inorganic filler having a particle diameter of 50 μm or more was determined from the above-mentioned number 3. &lt;Measurement of the ratio of the ultrafine fibers in the middle layer&gt; The ratio of the ultrafine fibers in the middle layer is the disintegration of the bottom layer in the multilayer paper substrate by the standard method using an artificial disintegrator, and using Kaj aani The fiber length distribution measuring machine "Fiber Lab" manufactured by the company measures the fiber length distribution and obtains it. The number of fibers was determined to be 1 or more. Furthermore, the middle and bottom layers take the following approach. The strip-shaped multi-ply paper substrate divided into 8 mm width was immersed in tap water for a day and night to sufficiently wet the paper, and the surface layer of the i layer was peeled off and separated to take the middle layer. 141273.doc -35- 201016463 &lt;N&lt; ratio of micro-weaving dimension in the middle layer (%) cn vS m inch·inch m Ο divination VO vq Pi 卜σί $ 00 cs 00 m inch 钵Ϊ 5 ^ i -Mii 04 ΐτί inch fW rs 00 &lt;N ο 卜ν〇CN m 00 cs 00 inch 00 1 inch σ\ V-&gt; ^±Β οο ο; CN cs »〇cn TH 1—Η cn ΓΛ 00 mm VO m ON 00 jn I v〇oo m 灰 ash (%) of multilayer paper substrate 1 _1 VC ΓΛ ri VO *η 00 Os O) os vd ΓΛ 00 00 cs 00 oi inch v 〇ΟΟ in multi-layer paper substrate Waste paper pulp blending rate (%) »Ti &lt;Ν &lt;Ν »r&gt;&lt;N *Λ »r&gt; Pi rn JO ΓΛ v〇VO 00 Ο VQ jn ΙΛ K Ρί &lt;N »η V ^ «?铋w Ο O o Ο ο 沄o Ο ooo Ο ο VWS? «?鲧U -δ- ^ 沄osg 沄Ο o H o ο Waste paper ash (%) rn &lt;N 00 ψ-^ ΓΛ c4 CN| »—· ri (N lt (N &lt;N v〇vd I rn On &lt;N •η 卜 Dispersion Treatment Method Heating Dispersion Interval 0.2 mm Heating Dispersion Clearance 0_2 mm DDR 2 Stage Treatment Disperser Disperser Disperser DDR 2 segment processing 1 heating dispersion gap 0.2 mm DDR 1 segment Heating dispersion gap 1.0 mm DDR 2 stage treatment heating dispersion gap 0.2 mm &lt; CQ u Uh Ο O o X &lt; Q ω IH Example 1| Example 2 Example 3 1 Example 4| 1 Example 5| Example 6| |Example 7| Example 8 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Comparative Example 6 -36-141273.doc 201016463 [Evaluation of Multilayer Paper Substrate] For the above Example 1~ 8 and Comparative Examples 1 to 6 A multilayer paper base material was produced, and the mold abrasion property, the Z-axis strength, the cavity formation precision, and the paper powder generation prevention property were evaluated by the following methods. Table 3 shows the evaluation results. The measurement and evaluation are carried out after the pre-treatment, which is prepared according to JIS P 8111 to a temperature of 23 ° C ± 1 ° C and a relative humidity of 50% ± 2%. status. &lt;Mold wear evaluation&gt; Using a ACP5〇5s type puncher manufactured by JAPAN AUTOMATIC MACHINE Co., a multi-ply paper base material which was formed into a strip-shaped unformed cavity of 8 mm width was selected according to JIS C 0806-3 2 mm intervals are continuously punched at 3 million locations to form a cavity. At this time, a new mold after polishing was used as a mold. Further, the shape of the cavity was such that the length in the width direction was 112 mm, and the length in the flow direction was 0.62 mm. Then, the section of the 3 million hair cavity was observed with a magnifying glass, and the condition of fine hair generation was examined, and the wear of the mold was evaluated based on the state of the fine hair. The grade of visual evaluation is as follows. 'If it is grade 1, 2, it is the level available for practical use. Grade 1: No fine hair is observed at all (almost no mold wear). Grade 2: 1 to 3 fine hairs (very small mold wear) were observed at a width of 1.12 mm. Grade 3: 4 to 1 fine roots (slightly worn) were observed at a width of 1.12 mm. Grade 4: 11 to 20 fine hairs were observed at a width of 1.12 mm (respectively 141273.doc -37- 201016463 mold wear). Grade 5: More than 20 fine hairs were observed at a width of 1.12 mm (the mold was severely worn and needs to be ground or replaced). &lt;Measurement of Z-Axis Strength&gt; The Z-axis strength was measured in accordance with the TAPPI Practical Test Method UM584. When the z-axis strength is 200 N/(25 mm) 2 or more, even if the storage backing paper is wound around the reel, bending stress is generated, and interlayer peeling is less likely to occur. &lt;Evaluation of Cavity Formation Accuracy&gt; The cavity of 2 times before the 3 millionth punching of the above-mentioned &lt;mold wear evaluation&gt; was photographed from the surface side by a stereomicroscope. Fig. 2 shows an example of a photograph taken. The black portion of the photograph is a cavity with a surface layer surrounding the bottom paper. For the photograph of each cavity, the narrowest length of the flow direction was measured, and the accuracy of cavity formation was evaluated. The longer the narrowest length of the flow direction of the cavity, the lower the height of the concavity and the higher the accuracy of cavity formation. Here, the narrowest length of the flow direction of the cavity is as shown in Fig. 3, which is a pattern of the photograph of Fig. 2, which is the most prominent portion of the inner wall faces 30, 30 of the cavity opposite to each other in the direction perpendicular to the flow direction. 31 is a length b parallel to the flow direction of each other. The price is as follows. Evaluation of ◎, 〇, △ is a practical level available. Sweat price ◎: The average value of the narrowest length b of the flow direction of the cavity (4) 〇) is 〇·5 8 mm or more. The price is 平均值: the average value of the narrowest long 〇 of the flow direction of the cavity (η, 〇.56mm or more and less than 58.58mm. 141273.d« -38· 201016463 Evaluation △: the flow direction of the cavity The average value of the narrow length b (n=20) is 0.5 4 mm or more and less than 0 · 5 6 mm. Evaluation x: The average value of the narrowest length b of the flow direction of the cavity (n=20) is less than 0.54 Mm. &lt;paper powder production prevention evaluation method&gt;

採取上述〈模具磨損評價 &gt;中之第300萬次沖孔之前1000 m之收納底紙。利用東京Welles公司製的TWA6601,不進 行頂蓋膠帶之黏貼與對模穴之零件插入,而以2400拍/分 鐘之速度捲出該收納底紙。捲出之後,目測評價模穴中之 紙粉產生狀況與纖維脫離狀況。評價如下。評價◎、〇、 △係實用方面可用之水平。 評價◎:幾乎未產生紙粉。 評價〇:極少產生紙粉。 評價△:稍微產生紙粉。 評價X :大量產生紙粉。 [表3]Take the bottom paper of 1000 m before the 3 millionth punching in the above-mentioned <Mold Wear Evaluation>. With the TWA6601 manufactured by Tokyo Welles Co., the top cover tape was not pasted and the parts of the cavity were inserted, and the storage backing paper was unwound at a speed of 2400 beats/min. After the film was taken out, the state of occurrence of the paper powder and the state of fiber detachment in the cavity were visually evaluated. The evaluation is as follows. Evaluate the level of practical use of ◎, 〇, and △. Evaluation ◎: Almost no paper powder was produced. Evaluation 〇: Paper powder is rarely produced. Evaluation Δ: Paper powder was slightly generated. Evaluation X: A large amount of paper powder was produced. [table 3]

模具磨損性 評價 Z轴強度 N/(25 mm)2 模穴形成 精度評價 紙粉產生 防止評價 實施例1 等級1 320 ◎ ◎ 實施例2 等級2 240 ◎ 〇 實施例3 等級2 295 ◎ ◎ 實施例4 等級1 325 〇 ◎ 實施例5 等級2 273 ◎ 〇 實施例6 等級2 215 ◎ 〇 實施例7 等級2 281 ◎ 〇 實施例8 等級2 275 ◎ ◎ 比較例1 等級3 358 Δ 〇 比較例2 等級2 195 Δ Δ 比較例3 等級5 120 〇 X 141273.doc -39- 201016463 比較例4 等級4 273 〇 Δ 比較例5 等級3 235 〇 △ 比較例6 等級2 193 〇 Δ 使用廢紙紙漿製作多層紙基材,使無機填充材料之質量 平均粒徑未滿50 μηι且使粒徑為50 μιη以上之無機填充材料 之含有比率未滿40%,使多層紙基材之廢紙紙漿調配率為 5〜70%(亦即,使廢紙紙漿纖維與無機填充材料於多層紙基 材中所佔之合計之含有比率為5〜70%),使灰分為1〜15%之 實施例1〜8中’模具之磨損得到防止。又,Ζ轴強度、模穴 形成精度較高,紙粉之產生亦得到防止。 與此相對,未使用廢紙紙漿製作多層紙基材之比較例1 中,模具容易磨損,模穴形成精度較低。 使用廢紙紙漿製作多層紙基材,但使多層紙基材中之廢 紙紙漿調配率超過70%之比較例2中,模穴形成精度及2轴 強度較低,亦觀察到有紙粉產生。 使無機填充材料之質量平均粒徑為5〇 以上使粒徑 為50 μη!以上之無機填充材料之含有比率為4〇%以上使 灰刀间於15/〇之比較例3中,模具容易磨損,ζ軸強度及模 穴形成精度較低,而且容易產生紙粉。 、使粒徑為50 μιη以上之無機填充材料之含有比率為4〇% 、上之比較例4令,模具容易磨損,模穴形成精度及ζ抽強 度較低,而且容易產生紙粉。 【圖式簡單說明】 圖1係表示本發明之收納底紙用多層紙基材之一實施形 態之剖面圖; 141273.doc 201016463 圖2係評價模穴形成精度時所拍攝之模穴之照片 例;及 圖3係將圖2之照片模式化之圖。 【主要元件符號說明】 1 多層紙基材 10 表層 20 中底層 21 中層 22 底層 141273.doc -41 -Mold wear evaluation Z-axis strength N/(25 mm) 2 Cavity formation accuracy evaluation Paper powder generation prevention evaluation Example 1 Level 1 320 ◎ ◎ Example 2 Level 2 240 ◎ 〇 Example 3 Level 2 295 ◎ ◎ Example 4 Grade 1 325 〇 ◎ Example 5 Grade 2 273 ◎ 〇 Example 6 Grade 2 215 ◎ 〇 Example 7 Grade 2 281 ◎ 〇 Example 8 Grade 2 275 ◎ ◎ Comparative Example 1 Grade 3 358 Δ 〇 Comparative Example 2 Grade 2 195 Δ Δ Comparative Example 3 Grade 5 120 〇X 141273.doc -39- 201016463 Comparative Example 4 Grade 4 273 〇Δ Comparative Example 5 Grade 3 235 〇△ Comparative Example 6 Grade 2 193 〇Δ Multi-layer paper made from waste paper pulp The base material is such that the inorganic filler has a mass average particle diameter of less than 50 μm and the inorganic filler having a particle diameter of 50 μm or more is less than 40%, and the waste paper pulp preparation ratio of the multilayer paper substrate is 5 to 5. 70% (that is, the ratio of the total amount of the waste paper pulp fiber and the inorganic filler to the multi-layer paper substrate is 5 to 70%), and the ash is divided into 1 to 15% in the examples 1 to 8' The wear of the mold is prevented. Further, the strength of the boring shaft and the formation accuracy of the cavity are high, and the generation of paper powder is also prevented. On the other hand, in Comparative Example 1 in which a multi-ply paper substrate was produced without using waste paper pulp, the mold was easily worn and the cavity formation precision was low. In the comparative example 2 in which the waste paper pulp was used in the multi-ply paper pulp, the precision of the cavity formation and the strength of the two-axis were low, and paper powder generation was also observed. . When the mass average particle diameter of the inorganic filler is 5 Å or more, the content ratio of the inorganic filler having a particle diameter of 50 μη! or more is 4% by weight or more, and the mold is easily worn in Comparative Example 3 where the knives are 15/〇. The strength of the boring shaft and the formation of the cavity are low, and the paper powder is easily generated. The content ratio of the inorganic filler having a particle diameter of 50 μm or more was 4% by weight, and the mold of Comparative Example 4 was easy to wear, the cavity formation precision and the enthalpy strength were low, and paper powder was easily generated. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing an embodiment of a multi-ply paper base material for accommodating bottom paper of the present invention; 141273.doc 201016463 Fig. 2 is a photograph example of a cavity photographed when evaluating the accuracy of cavity formation. And Figure 3 is a diagram of the pattern of Figure 2 being modeled. [Main component symbol description] 1 Multi-layer paper substrate 10 Surface layer 20 Middle layer 21 Middle layer 22 Bottom layer 141273.doc -41 -

Claims (1)

201016463 七、申請專利範圍: 1 · 一種晶片型電子零件收納底紙用多層紙基材,其特徵在 於: 於表層以外之層中含有源於廢紙之紙漿纖維及無機填 充材料,201016463 VII. Patent Application Range: 1 · A multi-layer paper substrate for wafer type electronic parts storage base paper, which is characterized in that: a pulp fiber and an inorganic filler material derived from waste paper are contained in a layer other than the surface layer, 源於廢紙之紙漿纖維與無機填充材料之合計之含有比 率為5〜70質量百分比(%) ’灰分為丨〜15質量百分比(%), 上述無機填充材料之質量平均粒徑未滿5〇 μιη,且以 未滿40質量百分比(%)之範圍包含粒徑為 5 0 μιη以上之無 機填充材料。 2.如请求項丨之晶片型電子零件收納底紙用多層紙基材’ 其中 灰分為1〜10質量百分比(%), 上述無機填充材料之質量平均粒徑未滿50 μιη,且以 未滿30質量百分比(%)之範圍包含粒徑為5〇㈣以上之無 機填充材料。 ~ 3.如睛求項1或2之晶片也丨雷工 乃1電子零件收納底紙用多層紙基 材,其中 層、卜之層中所包含之所有紙漿纖維,具有長度為 〇.2醜以下之微細纖維之比例為20%以上之纖維長度分 布, 其中’纖維長度分布係免丨田丄 ”1糸利用由 JAPAN TAPPI No. 52所 規定之光學性自動測量法 里在中之紙漿纖維長度測試方法, 而測定經JIS P8220之银骑 Ά聚碎解方法碎解之測定試料之纖 141273.doc 201016463 維長度,並由數量基準而求出之纖維長度分布。 4· 一種晶片型電子零件收納底紙用多層紙基材之製造方 法,其特徵在於:包括自廢紙製造包含紙漿纖維及無機 真充材料之廢紙紙漿之廢紙紙漿製造步驟;以及使用新 鮮紙漿及廢紙紙漿對多層紙基材抄紙之抄紙步驟; 於廢紙紙漿製造步驟中,對含有5質量百分比(%)以上 之作為灰刀之無機填充材料之廢紙進行碎解處理,實施 除塵處理之後,實施分散處理,以使無機填充材料之質 量平均粒徑未滿50 μιη,無機填充材料中所含之粒徑為 50 μιη以上之無機填充材料之含有比率未滿4〇質量百分 比(%); 於抄紙步驟中,將上述廢紙紙漿用於表層以外之層之 抄紙。 5.如e青求項4之晶片型電子零件收納底紙用多層紙基材之 製造方法,其中 於上述分散處理中,使用分散器或加熱分散器。 141273.docThe content ratio of the pulp fiber derived from the waste paper to the inorganic filler is 5 to 70% by mass (%), the ash is 丨 15 15% by mass (%), and the mass average particle diameter of the above inorganic filler is less than 5 〇. Μηη, and an inorganic filler having a particle diameter of 50 μm or more is contained in a range of less than 40% by mass (%). 2. The multi-layer paper substrate for a wafer-type electronic component storage base paper of the present invention, wherein the ash is divided into 1 to 10 mass% (%), and the mass average particle diameter of the inorganic filler is less than 50 μm, and is less than The range of 30 mass% (%) includes an inorganic filler having a particle diameter of 5 〇 (four) or more. ~ 3. The wafer of the item 1 or 2 is also a multi-layer paper substrate for the electronic component storage base paper, wherein all the pulp fibers contained in the layer and the layer of the layer have a length of 〇.2 ugly. The following ratio of the fine fibers is a fiber length distribution of 20% or more, wherein 'the fiber length distribution is free from the 丨田丄' 1) using the optical fiber length in the optical automatic measurement method prescribed by JAPAN TAPPI No. 52 The test method was measured for the length of the fiber 141273.doc 201016463, which was obtained by the method of the silver smashing and disintegrating method of JIS P8220, and the fiber length distribution was determined by the number basis. A method for producing a multi-ply paper substrate for a base paper, comprising: a waste paper pulp manufacturing step of producing waste paper pulp comprising pulp fibers and inorganic true charge materials from waste paper; and using a fresh pulp and waste paper pulp for the multi-layer paper a papermaking step of papermaking of a substrate; in the waste paper pulp manufacturing step, the waste paper containing 5 mass% (%) or more of the inorganic filler as a gray knife is disintegrated After the dust removal treatment is performed, the dispersion treatment is performed so that the mass average particle diameter of the inorganic filler is less than 50 μm, and the content of the inorganic filler having a particle diameter of 50 μm or more contained in the inorganic filler is less than 4 〇. Percentage of mass (%); in the papermaking step, the waste paper pulp is used for papermaking of a layer other than the surface layer. 5. A method for producing a multi-layer paper substrate for a wafer type electronic component storage base paper according to the item 4, In the above dispersion treatment, a disperser or a heating disperser is used. 141273.doc
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