JP5418008B2 - Chip-type electronic component storage board and manufacturing method thereof - Google Patents

Description

  The present invention relates to a paper chip type electronic component storage board and a method for manufacturing the same. More specifically, the present invention provides a multilayer paper base material having good formation accuracy when punching (through-holes) or embossing (recesses) in a hole in which a chip-type electronic component is accommodated, and having less mold wear. And a manufacturing method thereof, and a chip-type electronic component storage board excellent in workability.

A paper chip-type electronic component storage mount is usually used as a carrier for a chip-type electronic component by processing the mount paper base as follows to make a mount.
(1) The mount paper base is slit to a predetermined width.
(2) Open a square hole and a round hole of a predetermined size (punching). The square holes are for storing chip-type electronic components, and the round holes (through holes) are for feeding electronic components into the filling machine.
(3) A cover tape is adhered to the back surface (bottom side) of the mount paper base material to form a mount. In addition, a square embossing of a predetermined size may be performed without opening a square hole, and in this case, the cover tape bonding step is omitted. The method of adhering the backing paper base material and the cover tape is performed by a so-called heat sealing method in which the backing paper base material and the cover tape are overlapped and adhered by applying heat and pressure from the cover tape.
(4) Fill the square holes of the mount with the chip-type electronic components.
(5) A cover tape is bonded to the surface (top side) of the mount by a heat seal method.
(6) It is wound around a cassette reel of a predetermined size and shipped with the chip-type electronic component stored.
(7) The end user (mounting manufacturer) peels off the top cover tape, takes out the chip-type electronic component, and mounts it on the printed circuit board.

  Since it is used as described above, the quality required for the storage board does not adversely affect the quality of the filled chip parts, and it has surface smoothness so that the cover tape can be adhered well. It is strong enough not to cause delamination due to bending stress when it is wound around a cassette reel, or to break the mount, and to form square holes (hereinafter referred to as cavities) into which chip parts are inserted. The detachability is good, and the mold used for forming the cavity is less worn.

  Among these, one of the problems of quality defects of the storage board is that when the cavity is formed with a punching machine or embossing machine, the wall surface is not sharp (accurate dimensions), and chip-type electronic components are not inserted or removed correctly. May occur. If the cavity formability deteriorates in this way, it will cause a trouble when the chip manufacturer fills the chip or picks up the parts at the mounting manufacturer. Therefore, it is necessary to refinish the mold or make a new one to increase the forming accuracy. As a result, the operability such as time loss and yield loss is remarkably deteriorated, resulting in a large cost.

  Until now, as a technique for improving the wearability of the mold, the mold itself has been improved, but there is also a demand for an improvement on the side of the mount for housing the chip-type electronic component. Examples of the improvement technology on the mount side include the technology described in Patent Document 1 and Patent Document 2 for improving the formability of the cavities by the density of the paper, and the paper longitudinal direction and horizontal technology described in Patent Document 3. There are technologies that manage cavity workability by breaking elongation in the direction, and those that regulate the amount of ash (Patent Document 4), etc. The current situation is not.

Further, as an adverse effect on the filled chip component, rust of the chip-type electronic component is cited. Chip-type electronic components may contain silver as a conductive material. In the case of a paper storage board, silver corrosion may occur due to pulp raw materials and chemicals used in the manufacturing process.
When the amount of waste paper is large, reducing sulfur is liberated as hydrogen sulfide, corroding the metal part of the chip-type electronic component, resulting in trouble mainly in the soldering process at the user site. The defect rate in products using chip-type electronic components may increase, causing serious damage to users.

  In addition, in order to ensure quality assurance, each of the raw materials and products must be tested for the occurrence of rust. It is not efficient.

  According to the experiment, if the chip-type storage board is stored in a state having a high bacterial potential, that is, in the vicinity of 30 to 50 ° C. which is an optimum state of reproduction, or in an acidic region which is an optimum pH for the growth of gram-negative bacteria, The incidence has been shown to increase further. This is consistent with the pH at the time of papermaking and the temperature conditions for storage and transportation (especially in the warehouse in the summer and in the hangar when passing through the equator when exporting), and quality assurance is always guaranteed until use at the user site. It is a big problem because it is not always possible.

JP 2000-43975 A JP 2002-53195 A JP 2003-95320 A JP 2006-143227 A

  The object of the present invention is that the accuracy of forming a square hole (cavity) for accommodating a chip-type electronic component is good, the mold wear when punching or embossing the square hole is small, the workability is excellent, and the chip in the mounter Chips that can be processed into chip-type electronic component storage mounts that are less likely to cause problems such as mounting errors when mounting electronic components and paper dust generation, and chips that are more resistant to rust during storage An object of the present invention is to provide a multilayer paper substrate that can be processed into a mold-type electronic component storage mount, a chip-type electronic component storage mount formed from the paper base, and a method for manufacturing the same.

  The present inventors have determined the relationship between raw materials for paper base materials used for chip-type electronic component storage boards, in particular, waste paper pulp and inorganic fillers contained in waste paper pulp, and workability during punching and embossing. By earnestly examining, it came to complete the invention shown below.

(1) A chip-type electronic component storage board provided with a recess or a perforated portion for storing a chip-type electronic component in a multilayer paper base material consisting of a surface layer, a single layer or a plurality of layers, and a back layer,
In the multilayer paper base material, a layer other than the surface layer contains 0.5 to 15% by weight of an inorganic filler derived from waste paper as an ash content of 5 to 70% by weight of the total pulp of the layer other than the surface layer. And the layers other than the surface layer are disaggregated by the pulp disaggregation method of JIS P8220, and JAPAN TAPPI No. In the fiber length distribution at the time of the number average calculation of the fiber length measured by the pulp fiber length test method in the optical automatic measurement method defined in 52, the ratio of fine fibers of 0.2 mm or less is a layer of 20% or more. A chip-type electronic component storage board, characterized in that there is.

(2) The chip-type electronic component storage board according to (1), wherein the multilayer paper base material contains a copper compound.
(3) The chip-type electronic component storage board according to (1) or (2), wherein the multilayer paper base material contains 10 to 1000 ppm of copper compound as the mass of copper.
(4) The multilayer paper substrate contains a water-soluble copper compound selected from the group consisting of sulfates, hydrochlorides, nitrates, and acetates. The chip-type electronic component storage board according to any one of the above.

(5) The waste paper pulp is a waste paper pulp having an ash content of 0.7 to 25% by mass when dispersed according to JIS P8251 after dispersal treatment of the waste paper. The chip-type electronic component storage board according to any one of items (4) to (4).

(6) The chip-type electron according to any one of (1) to (5), wherein the inorganic filler has a mass average particle diameter of less than 50 μm and a mass ratio of 50 μm or more is less than 40%. Parts storage mount.

(7) The ratio of fine fibers of 0.2 mm or less in the layers other than the surface layer is 20 to 70%, more preferably 30 to 70%, characterized in (1) to (6) The chip-type electronic component storage board according to any one of the above.

(8) The chip-type electronic component storage board according to any one of (1) to (7), wherein the layers other than the surface layer are layers containing a paper strength enhancer.

(9) The concave portion or the perforated portion for housing the chip-type electronic component is provided on the multilayer paper base material comprising the surface layer, the single layer or the plurality of layers, and the back layer as described in the above items (1) to (8). A method of manufacturing one of the chip-type electronic component storage mounts,
A raw paper containing 5% by mass or more of an inorganic filler as ash is disaggregated with a pulper or a machine having a disaggregation treatment function, subjected to a dust removal treatment, and then subjected to a dispersion treatment to have an ash content of 0.7 to 25% by mass. A step of preparing waste paper pulp,
Separately from the step of preparing the middle layer and the back layer forming pulp slurry using the waste paper pulp as at least part of the pulp raw material, the surface layer forming not containing the waste paper pulp A step of preparing a pulp slurry, and a step of preparing a pulp slurry for multilayer papermaking,
A step of forming a multilayer paper base material comprising a surface layer, a single layer or a plurality of layers, and a back layer by multilayer papermaking from the surface layer forming pulp slurry and the intermediate layer and back layer forming pulp slurry,
Cutting the formed multilayer paper substrate into a predetermined width to form a strip-shaped multilayer paper substrate;
Forming a concave portion or a perforated portion for accommodating the chip-type electronic component in the strip-shaped multilayer paper base material,
Have
The step of preparing the pulp slurry for forming the intermediate layer and the back layer formed of the single layer or the plurality of layers includes the intermediate layer and the back layer formed from the pulp slurry, and 5 to 70% by mass of the total pulp is used paper. It consists of pulp, contains 0.5 to 15% by mass of an inorganic filler derived from waste paper as ash, and combines the formed middle layer and back layer by the pulp disaggregation method of JIS P8220. In the fiber length distribution at the time of calculating the number average of fiber lengths measured by the pulp fiber length test method in the optical automatic measurement method defined in 52, a layer in which the proportion of fine fibers of 0.2 mm or less is 20% or more is formed. A method for producing a chip-type electronic component storage board, which is a step of preparing a pulp slurry having a composition that can be produced.

(10) A pulp in which a copper compound is further added to the step of preparing a pulp slurry for forming a middle layer and a back layer of a single layer or a plurality of layers using the waste paper pulp as at least a part of a pulp raw material A method for producing a chip-type electronic component storage board as set forth in (9), which is a step of forming a slurry.
(11) Subsequent to the step of forming the perforated portion for storing the chip-type electronic component in the belt-shaped multilayer paper base material, the method includes a step of thermocompression bonding a heat-sealable cover tape to the bottom side of the multilayer paper base material. The manufacturing method of the chip-type electronic component storage board as described in the item 9) or (10).
(12) In the step of preparing the used paper pulp, the mass average particle diameter of the inorganic filler is less than 50 μm, the mass ratio of 50 μm or more is less than 40%, and the amount of ash when measured according to JIS P8251 is 0 The method for producing a chip-type electronic component storage board according to any one of (8) to (11), wherein the method is a step of preparing waste paper pulp of 7 to 25% by mass.
(13) The method for manufacturing a chip-type electronic component storage board according to any one of (9) to (12), wherein the dispersion treatment is a dispersion treatment using a disperser or a hot disperser.

According to the present invention, a multi-layer paper substrate for an electronic component storage board that can form a cavity with less wear of a mold during cavity processing and no generation of paper dust, and the electronic component can be smoothly stored and taken out. Thus, a chip-type electronic component storage board is provided which is less likely to cause troubles such as adhesion of foreign matters due to mounting mistakes and generation of paper dust when mounting the chip-type electronic components.
The present invention also provides a multilayer paper substrate that can be processed into a chip-type electronic component storage board that also has the property that rust is less likely to occur during storage.

The chip-type electronic component storage board of the present invention contains waste paper pulp and an inorganic filler derived from waste paper only in a layer other than the surface layer of the multilayer paper base material for the mount.
Many fresh pulp fibers have relatively hard fibers, a long fiber length, and a cross section close to a perfect circle. On the other hand, waste paper pulp becomes paper once and is damaged by chemicals and instruments while repeating the steps (history) of disaggregation, beating, drying, and paper making with various instruments in the process of recycling it. Thus, the fibers become shorter, and the proportion of fibers having a fiber length of 0.2 mm or less called fine fibers increases. These fine fibers serve to reinforce the fiber-to-fiber intersections of a thick fiber network such as fresh pulp. In addition, when the base material for punch processing comes down to the base paper base material, the paper base made of only fresh pulp, which is a thick fiber, tends to separate the fibers from the old paper pulp. Since the paper base material containing a large amount of fine fibers contains thick fibers that are still bonded even at the cut portion, the cut portion is sharpened and the accuracy is improved.

In addition, since the inorganic filler inhibits the bonding between the fibers and reduces the bonding between the fibers, it has a function of reducing stress on the mold during punching or embossing and suppressing wear. Therefore, in the case of the multilayer paper base material of the present invention, the waste paper pulp is contained in the layer other than the surface layer in a proportion of 5 to 70% by mass in the total pulp of the layer other than the surface layer, and 0 as ash content in the layer other than the surface layer. The inorganic filler derived from waste paper is contained in the range of 5 to 15% by mass.
The waste paper pulp is preferably contained in an amount of 10 to 50% by mass of the pulp in a layer other than the surface layer. If the content is less than 5% by mass, it is difficult to obtain the desired effect, and if the content exceeds 70% by mass, the bond strength between fibers becomes too weak and delamination may occur.

  The mount formed from the multilayer paper base material is shipped with the top cover tape applied after storing the chip-type electronic component, and the top cover tape is peeled off by the end user and the chip-type electronic component is taken out. The surface layer is required to have adhesiveness to the top cover tape and appropriate peelability. For this reason, it is not preferable to contain waste paper pulp containing an inorganic filler in the surface layer where smoothness and uniformity of the surface treatment agent are required.

  The used paper pulp used in the present invention is, for example, white paper, ruled white, etc., which has been used once but has very few printed parts, and printed materials such as cards, imitations, colors, Kent, white art, etc. Once used, high-quality used paper such as paper for printing, coated paper for beverages, beverage packs, office vapors, etc., and business medium-quality such as special cutting, separate cutting, medium-quality anti-old, Kent Manila, etc. Waste paper, general waste paper such as newspapers and magazines, and waste paper obtained from tea-based waste paper such as cut tea, plain tea, miscellaneous bags, corrugated cardboard, etc. Black pulp is preferred. Further, in the present invention, in order to effectively use the inorganic filler in the used paper, it is preferable to use the used paper containing 5% or more of the inorganic filler in the used paper raw material.

  The reason why deinked waste paper pulp is preferable as waste paper pulp is that when there is a dirt-like color derived from ink in a hole (cavity) for inserting an electronic component as a carrier tape, when storing or taking out the component This is because there is a possibility of being erroneously identified as a part by image processing in the inspection process.

  Generally, waste paper pulp is divided into disaggregated pulp and deinked pulp. The disaggregated pulp manufacturing process consists of mixing and disaggregating with water or water containing an alkali component such as sodium hydroxide in a pulper, and then removing foreign matter other than pulp fibers in a dust removal process (cleaner or screen). It is manufactured after. This pulp is used for parts that do not have quality problems due to multi-layered paper even if it is a little dark, such as pulp used in the middle layer of coated balls, such as waste paper that is not originally printed. is there. On the other hand, deinking pulp is a process for mainly reusing printed paper as pulp, and, like depulverized pulp, first depulverized by a pulper and then diluted and passed through a deinking process. The deinking process has an ink separation process called a flotator and / or an ink dispersion process that finely disperses the ink until it cannot be recognized by the human eye by a dispersing machine called a kneader or disperser. Is common.

  In this invention, it is preferable that ash content of layers other than the surface layer of a mount is 0.5 mass% or more and 15 mass% or less, More preferably, it is 1.0 mass% or more and 10 mass% or less. When using waste paper, it is difficult to achieve less than 0.5% by weight. In fact, if it exceeds 15%, the internal strength of the base paper, such as the Z-axis strength, decreases, and the electronic component storage board is processed with tape. Peeling is likely to occur due to stress such as bending during filling and mounting of parts, which is not preferable.

In the mount of the present invention, the one containing 0.5% by mass to 15% by mass as the ash content of layers other than the surface layer is an inorganic filler derived from waste paper pulp.
Although there are prior literatures that describe the use of a filler of 1 to 10 μm as a filler, it is uneconomical to add a new filler and the yield is poor due to its fineness. Moreover, since the binding property with the pulp is weak, there is a possibility of generating paper dust. A thing derived from waste paper pulp is preferable because of its strong binding to pulp fibers.

In the mount of the present invention, layers other than the surface layer of the mount are disaggregated by the pulp disaggregation method of JIS P8220, and JAPAN TAPl No. In the fiber length distribution at the time of calculating the number average of fiber lengths measured by the pulp fiber length test method in the optical automatic measurement method defined in 52, a layer in which fine fibers of 0.20 mm or less are 20% or more is used. Is preferable because it improves punching suitability.
The fine fiber is preferably in the range of 20% to 70%, more preferably 30% to 70%. This is because if the fine fiber is less than 20%, the desired punching ability cannot be obtained, and if it exceeds 70%, the drainage of the raw material is deteriorated, and there is a possibility that the papermaking may be hindered.

  The reason why the suitability for punching can be improved by blending waste paper pulp and increasing the amount of fine fibers can be explained as follows. When only fresh pulp fibers are used, the fibers are relatively hard, the fiber length is long, and the cross section is almost a perfect circle. On the other hand, in the case of waste paper pulp, it is once converted into paper, and in the process where it is regenerated, each process (history) of beating, drying, paper making, and disaggregation by various machines necessary for pulping and papermaking is performed. During the repetition, the fibers are shortened due to damage caused by chemicals and machinery, and the proportion of fibers having a fiber length of 0.20 mm or less called fine fibers increases. By containing many of these fine fibers, the fine fibers serve to reinforce the intersection of the fibers of the large fiber network such as fresh pulp. Also, when the male mold at the time of punching comes down, the one made only of fresh pulp is easy to separate the thick fiber from the fiber, whereas the one that contains a lot of fine fiber is cut by the fine fiber Since the thick fibers are still bonded to each other, the cut end is sharp and the accuracy is considered to be improved.

Furthermore, in the present invention, in order to prevent rust during storage of the storage board after the chip is inserted, it is preferable to include metal salts capable of adsorbing and fixing hydrogen sulfide that causes rust generation in the mount. As the metal salt, a copper compound is particularly preferable.
The copper content is preferably 10 to 1000 ppm in the mount as a mass, and more preferably 10 to 300 ppm. If it is less than 10 ppm, the generated hydrogen sulfide accompanying the growth of sulfate-reducing bacteria is not absorbed, and the generation of rust cannot be suppressed. On the other hand, if it exceeds 1000 ppm, the effect reaches a peak, and if it is added in a large amount, particularly with a copper compound, the color of the pulp itself changes because the aqueous solution is often colored in blue.

In order to contain the copper compound in the mount, a method of adding the copper compound as an aqueous solution is simple, and it is preferable because the metal ions can be uniformly dispersed by adding and stirring to the pulp slurry. The chip-type electronic component storage mount has a cavity for storing the chip-type electronic component, and the chip-type electronic component is stored in the cavity. Therefore, it is necessary to fix hydrogen sulfide throughout the storage mount, and this is not possible with coating or impregnation. This is not preferable because it is sufficient. The basis weight of the storage board varies depending on the chip-type electronic components to be stored. Generally, the basis weight is about 200 to 1000 g / m ^2. Since the paper is made, addition to the pulp slurry is also preferable in order to achieve a uniform rust prevention effect.

  As said copper compound, the salt with a sulfuric acid, hydrochloric acid, nitric acid, and an acetic acid which can be added as aqueous solution is preferable. Examples of the copper compound include copper sulfate, copper nitrate, cuprous chloride, and cupric chloride. Of these, copper sulfate is most preferred from the standpoints of chemical stability, work environment, and safety. Copper sulfate is used as a food additive, and there is no problem with safety. There is no problem when it is burned as waste. Moreover, since there is no elution reference from ash and it does not affect the environment, it is preferable.

  If an effective amount is present in the chip-type electronic component storage board, the copper compound exhibits a rust prevention effect within a practical range. However, as the most efficient method, the copper compound is contained other than the front and back layers. It is preferable. Layers other than the front and back layers (intermediate layer) have a high possibility of coming into contact with the housed chip. The front and back layers have problems such as the need to consider the influence on the adhesiveness to the cover tape and the peelability, and color problems. By containing the copper compound in the middle layer, the same effect as when the copper compound is contained in all the layers of the mount can be obtained, hydrogen sulfide generated can be fixed, and the occurrence of rust can be suppressed.

The copper compound can be contained in the middle layer by adding the copper compound only to the middle layer slurry and making a multilayer paper. The reason why the same effect as when adding to all layers can be obtained just by adding to the middle layer is not clear, but it is considered that the copper compound moves with the water to be dehydrated to other layers during dewatering during multilayer papermaking. It is done.
When copper compound is mainly added to the pulp slurry for the front and back layers of the mount and not added to the pulp slurry for the mount middle layer, depending on the amount added, the copper compound does not exist uniformly in the mount and hydrogen sulfide is generated from the middle layer portion There is a risk of it.

  In addition, when waste paper pulp is blended, various strengths as paperboard are reduced as compared with fresh bleached chemical pulp (BKP). The reason for this is that, as already explained, it is subjected to various mechanical treatments when the paper is recycled, but there are other types of waste paper, including uncoated paper (pigment on the base paper). In addition to non-coated paper), it also contains a lot of coated paper (paper coated with pigment on the base paper), so the pigment component that is a component of the paint, and the filler component that was internally added to the base paper Inorganic fillers such as, and the like are contained, and hydrogen bonds between pulp fibers that originally give the strength of paper are hindered, and when paper is made, it is difficult to obtain strength. For this reason, in the present invention, the waste paper pulp is disposed in a layer other than the surface layer and is in the range of 5 to 70% by mass of the pulp in the layer other than the surface layer, and the inorganic filler is added to the layer other than the surface layer in an ash content of 0. It is made to become 5-15 mass%.

In order to adjust the ash content of layers other than the surface layer to 0.5% by mass to 15% by mass, it can be achieved by blending waste paper and various fresh pulps such as chemical pulp, mechanical pulp, non-wood pulp and various waste paper pulps. Specifically, it is possible to select used paper as a raw material of used paper pulp, in the used paper pulp processing process, adjustment by a deinking process typified by a floatator, a washing process typified by a fall washer, a valveless filter, etc., or used paper The ash content in the raw material pulp can be adjusted by the mixing ratio of the pulp and the like.
Multiple blends of used paper pulp and reuse of ash content in the used waste paper are preferable from the viewpoint of recycling the raw material.

  Inorganic fillers in waste paper pulp are mainly composed of fillers originally made inside waste paper and pigments in the coating layer applied to the surface of waste paper, but large inorganic fillers are coated. Often derived from layers. The coating layer is applied to impart printability and the like to the paper, and its thickness varies, but it is applied to a class of paper called coated paper by about 5 μm to 30 μm. Is common. These are pulverized and dispersed during the waste paper dispersion treatment to become a part of the waste paper pulp component, but the problem is that they cannot be dispersed and remain as large inorganic fillers.

  In the present invention, the inorganic filler is derived from a filler or a pigment, and a preferred size is a mass average particle diameter of less than 50 μm. If the particles are less than 50 μm, the particles can escape when the mold is punched, and the mold is not directly worn. If there are many over 50 μm, the chip type electronic components to be stored are very small, because the frequency of hitting the mold at the time of cavity formation increases, so it is best not to have it, but if the mass ratio is less than 40% , Since it has little influence on mold wear, it is controlled to be less than 40%. More preferably, it is controlled to be less than 30%.

  In the present invention, the particle size is defined by the mass average particle size. The reason for this is that even if the number of particles is overwhelmingly small in number, the probability of cutting large particles when punching with a mold increases dramatically if there are a small number of large particles exceeding 100 μm. Because.

  The inorganic filler separates from the fibers during the used paper processing process and becomes gradually finer, but originally has a thin planar shape. Large chunks can shatter during further waste paper processing, and one large chunk can be dispersed into tens to hundreds of small particles. Therefore, the inorganic filler is not calculated by number but by mass ratio. In the present invention, the mass ratio is calculated by measuring the maximum length of each inorganic filler when a cross section of the chip-type electronic component storage board is observed. Since the original particles are planar, they are cut more two-dimensionally (XY direction) than in the thickness direction (Z direction), so that the calculation is simplified by using the square value of the particle diameter. In the present invention, the mass ratio of the particle size of 50 μm or more is set to be less than 40%.

  In the present invention, the disaggregation step and the dispersion step are important in the waste paper processing step. Waste paper contains a large amount of so-called coated paper with a pigment-containing coat layer, especially in the case of magazine waste paper. Will remain as a relatively large mass. When punching or embossing is performed on a mount containing such waste paper pulp, there is a risk that the wear of the mold is accelerated. Since the coat layer is a very thin layer, it may pass through the dust removal equipment and remain in the final raw material. Therefore, it is necessary to disperse to the size of the inorganic filler, particularly by a dispersion process.

  Machines that can be used for distributed processing include disintegrators such as finalers, conifers, top finalers, conical discs, deflakers, conical flakers, power finers, refiners, double disc refiners, beaters such as beaters, kneaders, dispersers, Dispersers, hot dispersion equipment, kneading and dispersing machines such as New Taizen can be used.

Concerning unraveling to process used waste paper, it is concentrated to a solid content concentration of about 5 to 35% by mass in terms of being able to disperse ash as well as residual ink after deinking treatment with a floatator or the like. It is desirable to perform a treatment by a kneading and dispersing machine.
Among these, the disperser and the hot disperser are particularly preferably used because the inorganic filler can be efficiently made fine at a high concentration of solid content concentration of 25% or more and without extremely reducing the freeness. . Among these, it is more preferable because the treatment can be made more efficient by applying a temperature of about 80 to 120 ° C. with a steam / heater during the treatment of the disperser or the hot disperser.

  It is possible to further control the amount of ash in the used paper through a pulp washing step following the used paper pulp dispersing step. Machines that can be used in the pulp washing process include washing equipment such as DNT washers, compact washers, fall washers, vario splits, SP filters, DP Cosmo, and gap washers, but are not limited to these. Any structure can be used as long as it can be lowered.

In general, as the pulp before entering the washing machine is diluted and the solid content concentration is lowered, the ash removal efficiency is improved. By using these washing devices in combination with a pulp disperser, even when using a large amount of used paper having an ash content exceeding 25% by mass, the ash content of the used paper pulp is reduced to 0.7% to 25% by mass as a raw material. By adjusting this used paper pulp as a raw material for portions other than the surface layer of the mount, it is possible to control the amount of ash content in the range of 0.5% to 15% by mass.
In order to make the ash content of the portion other than the surface layer of the base material 0.5 to 15% by mass, it is appropriate to use the above pulp and various fresh pulps in combination, for example, chemical pulp, mechanical pulp, non-wood fiber pulp, etc. Formulation can be achieved.

  Although the pulp used by this invention can be beaten and used by a well-known method, even if it does not beat, there is no problem. There are no particular limitations on the beater, and various beaters such as a beater, Jordan, a deluxe refiner (DF), and a double disc refiner (DDR) are used. In the case of beating, processing of about 250 ml to 560 ml is preferable with Canadian Standard Freeness, and more preferably 300 ml to 470 ml. If it is higher than 560 ml, the strength, particularly the interlaminar strength, is unfavorable. On the other hand, if the beating is carried out more than 250 ml, problems such as a decrease in pulp yield and a loss of quantity due to a higher density of the base paper occur, which is not preferable.

  Moreover, various internal additives can be used as needed. For example, rosin sizing agent, styrene / maleic acid resin, styrene / acrylic resin, styrene / olefinic acid resin, alkyl ketene dimer, alkenyl succinic anhydride, and other internal sizing agents for natural and synthetic papermaking. Examples thereof include a paper strength enhancer, a drainage yield improver, a water-resistant agent such as a polyamide polyamine epichlorohydrin, and an antifoaming agent.

  In the present invention, the bonding between fibers is inhibited by ash, so that the strength between the layers may be lowered by itself. Therefore, it is preferable to add an amphoteric polyacrylamide paper strength enhancer having a molecular weight of 2 million or more. Amphoteric polyacrylamide can adsorb to pulp fibers via aluminum in the anion part, and can self-adsorb in the cation part, and is less susceptible to changes in the pH caused by waste paper and / or fillers, and stably reinforces interfiber bonds. it can. As the addition amount, it is preferable to add 0.5-5.0 mass% with respect to a pulp. It is also possible to add cationized starch, cationized polyacrylamide, polyethyleneimine, polyamide polyamine epichlorohydrin, cation-modified guar gum, cation-modified polyvinyl alcohol, and other cationic polymers.

In the present invention, waste paper pulp can be added to the surface layer, but is preferably other than the surface layer. The reason for this is that the surface of the electronic component storage board is an important part of quality control that is usually used by bonding the cover tape by heat sealing. The surface strength is increased to prevent peeling when the peel strength is adjusted or peeled off. Therefore, when used paper pulp is used for the surface layer, the used paper pulp may affect the penetrability of chemicals, and these important qualities may fluctuate.

The basis weight of the chip-type electronic component storage board of the present invention is determined by the size of the chip-type electronic component stored therein, but is generally about 200 to 1000 g / m ² . Since the basis weight is within such a range, 3 to 10 layers of multi-layer papers that are easy to form are preferred as the paper base paper making method. Since the mount obtained by the multi-layer paper can be peeled off layer by layer, in the present invention, the surface layer which is the surface in contact with the cover tape of the mount is peeled off and the remaining portion is specified. As the paper machine for the multi-layer paper, various types such as a circular net multi-layer paper, a circular net short net combination, a short net multi-layer paper, a long net multi-layer paper, and the like can be used. Absent.

  In the present invention, polyvinyl alcohol, starch, polyacrylamide, acrylic resin, styrene-butadiene resin, styrene Necessary chemicals such as isoprene-based resin, polyester-based resin, ethylene-vinyl acetate-based resin, vinyl acetate-vinyl alcohol-based resin, and urethane-based resin can be appropriately applied.

  Further, the surface treatment agent may contain styrene / maleic acid resin or olefin / maleic acid resin in order to improve the adhesiveness with the cover tape and further increase the strength of the surface of the mount. Styrene / maleic acid resin and olefin / maleic acid resin have a hydrophobic group and a hydrophilic group. By coating on the surface of the backing paper, in addition to covering the surface, it penetrates into the paper layer and is a hydrophilic group. Carboxylic acid forms a hydrogen bond with the pulp fiber, crosslinks between the fibers, and greatly improves the bond between the fibers. By improving the bond between the fibers, the resistance force when peeling the cover tape is improved, the peel strength is increased, and the removal of the fibers that cause a bad influence on the mounting of the chip-type component can be prevented.

  In the present invention, as means for applying and impregnating the surface treatment agent on the surface of the mount as described above, for example, a bar coater, a blade coater, an air knife coater, a rod coater, a gate roll coater, a size press, a calendar coater, etc. A coating device such as a roll coater or a bill blade coater can be used. Among these, a size press or a calendar coater is preferable because it can easily penetrate the surface treatment agent deeply by the nip pressure.

The coating amount of the water-soluble polymer is preferably 0.1 g / m ² or more and 1.1 g / m ² or less, more preferably 0.6 g / m ² or more and 1.1 g / m ² or less. If it exceeds 1.1 g / m ² , the adhesive strength with the cover tape is remarkably weakened, which is not preferable. On the other hand, when the amount is less than 0.1 g / m ^{2, the} effect of suppressing the scraps and paper dust is weak.

EXAMPLES Hereinafter, although an Example demonstrates this invention in detail, this invention is not limited by these.
In each example, numerical values indicating the composition, concentration, etc. are numerical values based on the solid content or the mass of the active ingredient. Further, unless otherwise specified, the paper made was subjected to pretreatment according to JIS P8111 and then subjected to measurement and testing.
In addition, how to remove the surface layer from the electronic component storage board, the measurement method of the fine fiber ratio other than the surface layer, the ash content measurement method, the mass average particle diameter calculation method, the Z-axis strength measurement method, the die punching suitability evaluation method, Details of the mold abrasion test, the method for measuring the copper content contained in the mount, and the silver rust test method are as follows.

<How to remove the surface layer from the electronic component storage board>
A chip-type electronic component storage board slit in a tape shape with a width of 8 mm is immersed in a commercially available α-amylase (Fangamil, Novozymes) diluted 10 times with water for a day and night, and the paper is sufficiently wetted. After the layer became easy to separate into layers, one surface layer was peeled off and separated, and the remaining portions other than the surface layer were subjected to measurement.

<Method for measuring the ratio of fine fibers other than the surface layer>
Using the electronic component storage board from which the surface layer is removed from the mount, disaggregation is performed using a pulp disaggregation method of JIS P 8220 using a lab disintegrator, and a fiber length distribution measuring device “Fiber Lab” manufactured by Kajaani is used. And carried out measurement (JAPAN TAPPI No. 52). The number of measured fibers was 10,000 or more, and the ratio (%) of fine fibers of 0.2 mm or less was obtained in the fiber length distribution obtained on the basis of the number.

<Measurement of ash content>
In accordance with JIS P 8251, measurement was performed by firing at 525 ° C.

<Calculation method of mass average particle diameter>
A cross-sectional photograph of the electronic component storage board is photographed with an electron microscope, and first, 100 or more of the particle diameter (in the size of the maximum portion) of particles of 5 μm or more among the inorganic filler is measured.
As shown in Table 1, a value (C) obtained by converting the number classified for each section of (A) into a number ratio is obtained. The mass ratio, the mass average particle diameter, and the mass ratio of particles of 50 μm or more when the section is up to k are calculated by the following equations. Table 1 shows two actual calculation examples.

<Z-axis strength>
Measured according to TAPPI practical test method UM584.

<Evaluation of die punching aptitude>
The electronic component storage board is slit into a tape having a width of 8 mm, and in accordance with JIS C 806-3, using an ACP505S punching machine manufactured by Nippon Automatic Machine Co., Ltd. at intervals of 2 mm, a width direction of 1.12 mm and a flow direction of 0.1 mm. A square hole is made using a 62 mm mold (for 1005 electronic components). Twenty square holes are photographed from the surface with a stereomicroscope, and the size of the square holes is measured by an enlarged photograph. The grade of evaluation is as follows.
Evaluation (double-circle): The average value (n = 20) of the narrowest part of the flow direction of a square hole is 0.58 mm or more.
Evaluation (circle): The average value (n = 20) of the narrowest part of the flow direction of a square hole is 0.56 mm or more.
Evaluation (triangle | delta): The average value (n-20) of the narrowest part of the flow direction of a square hole is 0.54 mm or more.
Evaluation x: The average value (n = 20) of the narrowest portion in the flow direction of the square hole is less than 0.54 mm.

<Die wear evaluation>
A sample was slit into a tape shape with a width of 8 mm, and gold in accordance with JIS C 0806-3, with an ACP505S type punch made by Nippon Automatic Machine Co., Ltd., with a width direction of 1.12 mm and a flow direction of 0.62 mm at intervals of 2 mm. Make 3 million shots of square holes using a mold. Observe the cross-section of the 3 million shot square hole with a magnifying glass, and evaluate the die wear level based on whether or not cracking occurred. The grades of visual evaluation are as follows, and grades up to grade 2 are practically usable.
Grade 1: No cracks are seen.
(There is almost no mold wear.)
Grade 2: 1-3 marks are seen in the width of 1.12 mm side.
(Slight mold wear.)
Grade 3: 4 to 10 indentations are seen in the width of 1.12 mm side.
(There is some mold wear.)
Grade 4: There are 11 to 20 pieces of cracks in a width of 1.12 mm.
(There is considerable mold wear.)
Grade 5: 20 or more marks are seen in a width of 1.12 mm.
(The mold wear is severe and is in the polishing or replacement stage.)

<Method for measuring copper content in chip-type electronic component storage board>
As described below, the mount was sealed and wet-decomposed as a pretreatment, and then the copper contained in the mount was quantified by a high frequency induction plasma emission method (ICP).
1) Pre-treatment (sealed wet decomposition of the mount)
First, the mount sample was cut into a size of 2 to 5 mm square using ceramic scissors. 0.2 g is accurately measured from the cut sample, transferred to a sealed fluorine resin processing container, 2 ml of sulfuric acid and 5 ml of nitric acid are added, and this sample is subjected to a wet decomposition apparatus (manufactured by ASTEC, model: MARS5). Decomposed. Thereafter, the decomposition solution in the fluororesin processing container was washed into a centrifuge tube, filtered through a 0.45 μ membrane filter, and then the entire volume was made up to 50 ml with a flask while washing with distilled water.
2) Measurement by high frequency induction plasma emission method (ICP) The copper concentration in the above pretreated sample was measured using ICP-OES (manufactured by Rigaku, model: CIROS-120). For quantitative determination, a calibration curve was prepared in advance using a metal salt standard solution with a known content, and the content (ppm) was calculated. The detection limit was 0.01 ppm.

<Chip type electronic component storage mount-Silver rust test>
B) Prepare a 250 mm long sample (8 mm × 250 mm) and the number of sheets (8 sheets) that are slit to 8 mm width and punched by a punching machine used in the mold wear evaluation, and put them in a sample bottle.
B) Two types of chip capacitors (1.25 mm x 2.05 mm, large 1.27 mm, small 0.59 mm) with silver used for the electrode part are placed in a bottle containing 10 samples (chips) each. Tighten the cap tightly.
C) Place the bottle in a dryer heated to 150 ° C. for 1 hour.
D) Remove the chip condenser from the bottle treated for 1 hour on the dry filter paper, quickly put it in a plastic bag, and observe the occurrence of rust on the front and back with a magnifier.

Judgment criteria (B judgment or more is regarded as a practical range)
A: No change as before the test.
B: Within 3 chips slightly discolored to brown.
C: 4 to 6 chips slightly discolored in brown, or 1 chip discolored in brown and 3 chips slightly discolored.
D: 4 to 6 chips changed to brown, or 1 chip changed to black and 3 chips changed to brown.
E: Two or more chips changed to black.

<Method for producing waste paper pulp A>
Disassemble the old magazine paper (ash content 20.3%) with a pulper, pass it through a dust remover (cleaner and screen), dilute it with water to a solid content concentration of 1%, add deinking agent, and add it to the floatator. Deinking treatment, concentrating to a solids concentration of about 30% with a tilt extractor and screw press dehydrator, using a hot dispersion facility (manufactured by KRIMA), dispersing at a gap of 0.2 mm and a temperature of 110 ° C. The waste paper pulp A was obtained by passing through a pulp washer (DNT washer: manufactured by Aikawa Tekko) while further diluting with water. The ash content of this pulp was measured and found to be 7.3%.

<Method for producing waste paper pulp B>
Kent waste paper (ash content: 33.2%) is disaggregated with a pulper, passed through a dust remover (cleaner and screen), concentrated to a solid content concentration of about 30% with a slant extractor and screw press dehydrator, and hot Dispersion treatment at a gap of 0.2 mm and a temperature of 110 ° C. using a dispersion facility (manufactured by KRIMA), and further passing through a pulp washing machine (DNT washer: Aikawa Tekko) while diluting with water, used paper pulp B was obtained. The ash content of this pulp was measured and found to be 23.5%.

<Method for producing waste paper pulp C>
Disassemble the old magazine paper (ash content: 20.3%) with a pulper, pass through a dust remover (cleaner and screen), dilute with water to a solid content concentration of 1%, add deinking agent, and use a flowmeter. Waste paper pulp C was obtained by performing deinking treatment, concentrating to a solid concentration of about 5% with a gradient extractor, treating the double disc refiner in two stages, and dropping it to freeness 358 ml → 187 ml. The ash content of this pulp was measured and found to be 16.8%.

<Method for producing waste paper pulp D>
Kent waste paper (ash content 33.2%) is disaggregated with a pulper, passed through a dust remover (cleaner and screen), passed through a double disc refiner at a time, and the freeness is changed from 358 ml to 330 ml. D was obtained. The ash content of this pulp was measured and found to be 29.1%.

<Manufacturing method of waste paper pulp E>
Disassemble the old magazine paper (ash content: 20.3%) with a pulper, pass through a dust remover (cleaner and screen), dilute with water to a solid content concentration of 1%, add deinking agent, and use a flowmeter. After deinking, concentrate to a solids concentration of about 15% with a tilt extractor and screw press dehydrator, and disperse at a gap of 1.0 mm and a temperature of 70 ° C. using a hot dispersion facility (manufactured by KRIMA). The waste paper pulp E was obtained by passing through a pulp washer (DNT washer: manufactured by Aikawa Tekko) while further diluting with water. The ash content of this pulp was measured and found to be 7.5%.

<Manufacture of waste paper pulp F>
Disassemble the old magazine paper (ash content: 20.3%) with a pulper, pass through a dust remover (cleaner and screen), dilute with water to a solid content concentration of 1%, add deinking agent, and use a flowmeter. After deinking treatment, concentrate to about 30% solid content with an inclined extractor and screw press dehydrator, and disperse at 90 ° C while adding steam using a disperser (manufactured by Aikawa Tekko, TLI type) Waste paper pulp F was obtained by performing the treatment and passing it through a pulp washer (DNT washer: manufactured by Aikawa Tekko) while further diluting with water. The ash content of this pulp was measured and found to be 7.3%.

<Manufacture of waste paper pulp G>
Disassemble old newspaper (ash content: 12.7%) with a pulper, pass through a dust removal device (cleaner and screen), dilute with water to a solid content concentration of 1%, add deinking agent, and use a flowmeter. After deinking treatment, concentrate to about 30% solid content with an inclined extractor and screw press dehydrator, and disperse at 90 ° C while adding steam using a disperser (manufactured by Aikawa Tekko, TLI type) Processing was performed to obtain waste paper pulp G. The ash content of this pulp was measured and found to be 5.2%.

<Manufacture of waste paper pulp H>
Dissolve old colored paper (ash content: 31.3%) with a pulper, pass through a dust removal device (cleaner and screen), dilute with water to a solid content concentration of 1%, add deinking agent, and add to the floatator Deinking treatment, concentrating to a solids concentration of about 30% with a tilt extractor and screw press dehydrator, using a disperser (manufactured by Aikawa Tekko Co., Ltd., TLI) and dispersing at 90 ° C while adding steam The waste paper pulp H was obtained by passing through a pulp washer (DNT washer: manufactured by Aikawa Tekko) while further diluting with water. The ash content of this pulp was measured and found to be 18.8%.

<Manufacture of waste paper pulp I>
Imitation waste paper (1.3% ash content) that was not printed by the pulper was disaggregated and dust-removed to obtain waste paper pulp I. The ash content of this pulp was measured and found to be 1.2%.

<Manufacture of waste paper pulp J>
Dissolve old colored paper (31.3%) with a pulper, pass through a dust remover (cleaner and screen), dilute with water to a solid concentration of 1%, add deinking agent, and use a flowmeter Perform deinking treatment, concentrate to about 30% solid content with a tilt extractor and screw press dehydrator, and use a disperser (TLI, manufactured by Aikawa Tekko Co., Ltd.) to disperse at 90 ° C while adding steam. The waste paper pulp J was obtained by passing through a pulp washing machine (DNT washer: manufactured by Aikawa Tekko) while further diluting with water. The ash content of this pulp was measured and found to be 22.1%.

Example 1
Pulp is properly used for the surface layer, middle layer and back layer. For the surface layer, NBKP: 30% by mass, LBKP: 70% by mass are mixed and beaten with a double disc refiner to prepare 460 ml of CSF (Canadian Standard Freeness). NBKP: 10% by weight, LBKP: 60% by weight, waste paper pulp A: 30% by weight, mixed and beaten with a double disc refiner to prepare 410 ml of CSF (Canadian Standard Freeness), and LBKP for the back layer It was beaten up to 470ml of CSF (Canadian Standard Freeness) with a double disc refiner alone. Further, copper sulfate (pentahydrate) was added to the pulp slurry used for the middle layer so that the amount was 0.1% with respect to the pulp (total of all layers). Thereafter, 2.0% by mass of a sulfuric acid band was added to each of the front, middle and back pulp slurries, and size pine N-111 (Rosin emulsion sizing agent, Arakawa Chemical Industries, Ltd.) 0.50% as a sizing agent. %, And Polystron 1250 (manufactured by Arakawa Chemical Industries, Ltd., polyacrylamide type paper strength agent) was added as a paper strength agent. Pulp slurries with the above conditions were made with a circular mesh 5-layer papermaking machine at a surface layer (1 layer) of 100 g / m ² , a middle layer (3 layers) of 600 g / m ² , and a back layer (1 layer) of 100 g / m ² . Furthermore, 1.0 g / m ² of polyvinyl alcohol having a saponification degree of 88 mol% and a polymerization degree of 1000 as a dry coating amount was applied with a size press machine, and smoothed with a smoothing machine (machine calendar) installed in the paper machine. The chip-type electronic component storage board having a basis weight of 800 g / m ² and a thickness of 0.95 mm was manufactured.

Example 2
NBKP: 10% by mass, LBKP: 60% by mass, recycled paper pulp A: 30% by mass, NBKP: 10% by mass, LBKP: 20% by mass, recycled paper pulp B: 70% by mass Except that, a chip-type electronic component storage board with a basis weight of 800 g / m ² and a thickness of 0.95 mm was manufactured in the same manner as in Example 1.

Example 3
NBKP: 10% by mass, LBKP: 60% by mass, recycled paper pulp A: 30% by mass, instead of NBKP: 10% by mass, LBKP: 40% by mass, recycled paper pulp C: 50% by mass In addition, instead of adding copper sulfate (pentahydrate) to the pulp slurry used for the middle layer so as to be 0.1% with respect to the pulp (total of all layers), copper nitrate (trihydrate) In the same manner as in Example 1 except that the amount of the slag is 0.05% with respect to the pulp (total of all layers), a chip-type electronic component housing with a basis weight of 800 g / m ² and a thickness of 0.95 mm is accommodated. A mount was manufactured.

Example 4
NBKP: 10% by mass, LBKP: 60% by mass, recycled paper pulp C: 30% by mass, NBKP: 10% by mass, LBKP; 40% by mass, recycled paper pulp E; 50% by mass Copper nitrate (trihydrate) instead of adding copper sulfate (pentahydrate) to the pulp slurry used for the middle layer to 0.1% with respect to the pulp (total of all layers) ) In the same manner as in Example 1 except that it is added so as to be 0.05% with respect to pulp (total of all layers), and a chip-type electronic component having a basis weight of 800 g / m ² and a thickness of 0.95 mm. A storage mount was manufactured.

Example 5
Pulp was properly used for the surface layer, middle layer and back layer, and NBKP; 30% by mass and LBKP; 70% by mass were mixed and beaten with a double disc refiner to prepare 480 ml of CSF (Canadian Standard Freeness). Further, NBKP: 10% by mass, LBKP: 40% by mass, and waste paper pulp F: 50% by mass were mixed and beaten with a double disc refiner and beaten to 450 ml of CSF (Canadian Standard Freeness). Further, copper sulfate (pentahydrate) was added to the pulp slurry used for the middle layer so that the amount was 0.02% with respect to the pulp (total of all layers). Thereafter, 2.0% by mass of a sulfuric acid band was added to each pulp slurry for front and back, and 0.50% by mass of size pine N-111 (manufactured by Arakawa Chemical Industries, Ltd., rosin emulsion sizing agent) was added as a sizing agent. Then, 2.0% by mass of Polystron 1250 (Arakawa Chemical Industries, polyacrylamide type paper strength agent) was added as a paper strength agent. Pulp slurries with the above conditions were made with a circular mesh 8-layer paper making machine at a surface layer (1 layer) of 80 g / m ² , an intermediate layer (6 layers) of 620 g / m ² , and a back layer (1 layer) of 100 g / m ² . Furthermore, 1.0 g / m ² of polyvinyl alcohol having a saponification degree of 88 mol% and a polymerization degree of 1000 as a dry coating amount was applied with a size press machine, and smoothed with a smoothing machine (machine calendar) installed in the paper machine. The chip-type electronic component storage board having a basis weight of 800 g / m ² and a thickness of 0.95 mm was manufactured.

Comparative Example 8
The pulp preparation for the inner and rear layers was mixed and beaten with NBKP: 10% by mass, LBKP: 80% by mass, waste paper pulp G: 10% by mass with a double disc refiner, and CSF (Canadian Standard Freeness) 450 ml A chip-type electronic component storage board was manufactured in the same manner as in Example 5 except that copper sulfate (pentahydrate) was not added to the pulp slurry used for the middle layer.

Example 6
The pulp preparation for the inner back layer was mixed and beaten with a double disc refiner of NBKP: 10% by mass, LBKP: 20% by mass, waste paper pulp H; 70% by mass, and CSF (Canadian Standard Freeness) 450 ml Example 5 except that copper sulfate (pentahydrate) is added to the pulp slurry used for the middle layer so as to be 0.10% of the total amount of pulp (all layers). In the same manner, a chip-type electronic component storage board was manufactured.

Example 7
The pulp preparation for the inner back layer was mixed and beaten with a double disc refiner of NBKP: 10% by mass, LBKP: 75% by mass, waste paper pulp I: 15% by mass, and CSF (Canadian Standard Freeness) 450 ml Example 5 except that copper sulfate (pentahydrate) is added to the pulp slurry used for the middle layer to 0.50% with respect to the pulp (total for all layers). In the same manner, a chip-type electronic component storage board was manufactured.

Comparative Example 1
NBKP: 10% by mass, LBKP: 60% by mass, waste paper pulp A: 30% by mass, NBKP: 10% by mass, LBKP; 90% by mass, and used for the middle layer A chip-type electronic component storage board having a basis weight of 800 g / m ² and a thickness of 0.95 mm was produced in the same manner as in Example 1 except that copper sulfate (pentahydrate) was not added to the pulp slurry. .

Comparative Example 2
Instead of NBKP; 10% by mass, LBKP; 60% by mass, waste paper pulp A; 30% by mass, the pulp used for the middle layer is 100% by mass, and the pulp slurry used for the middle layer A chip-type electronic component storage board having a basis weight of 800 g / m ² and a thickness of 0.95 mm was manufactured in the same manner as in Example 1 except that copper sulfate (pentahydrate) was not added.

Comparative Example 3
Instead of NBKP; 10% by mass, LBKP; 60% by mass, waste paper pulp A; 30% by mass, the pulp for the middle layer is made to be 100% by mass, and the pulp slurry used for the middle layer A chip-type electronic component storage board having a basis weight of 800 g / m ² and a thickness of 0.95 mm was manufactured in the same manner as in Example 1 except that copper sulfate (pentahydrate) was not added.

Comparative Example 4
The pulp preparation for the inner back layer was mixed and beaten with a double disc refiner of NBKP: 10% by mass, LBKP: 10% by mass, waste paper pulp J; 80% by mass, and CSF (Canadian Standard Freeness) 450 ml Example 5 except that copper sulfate (pentahydrate) is added to the pulp slurry used for the middle layer so as to be 0.10% of the total amount of pulp (all layers). In the same manner, a chip-type electronic component storage board was manufactured.

Comparative Example 5
The pulp preparation for the inner back layer was mixed and beaten with a double disc refiner of NBKP; 10% by mass, LBKP; 90% by mass as a blending ratio to prepare 350 ml of CSF (Canadian Standard Freeness), and the middle layer Chip-type electronic component in the same manner as in Example 5 except that copper sulfate (pentahydrate) is added to the pulp slurry to be used to make 0.02% of the total amount of pulp (all layers). A storage mount was manufactured.

Comparative Example 6
The pulp preparation for the inner back layer was mixed and beaten with a double disc refiner with NBKP: 10% by mass and LBKP; 90% by mass as a blending ratio to prepare 550 ml of CSF (Canadian Standard Freeness), and the middle layer Chip-type electronic component in the same manner as in Example 5 except that copper sulfate (pentahydrate) is added to the pulp slurry to be used to make 0.50% of the total pulp (all layers). A storage mount was manufactured.

Comparative Example 7
The pulp preparation for the inner back layer was mixed and beaten with a double disc refiner of NBKP: 10% by mass, LBKP: 86% by mass, waste paper pulp G: 4% by mass, and CSF (Canadian Standard Freeness) 450 ml Example 5 except that copper sulfate (pentahydrate) is added to the pulp slurry used for the middle layer so as to be 2.00% with respect to the pulp (total of all layers). In the same manner, a chip-type electronic component storage board was manufactured. The mount was bluish and looked bad.

About the chip-type electronic component storage board manufactured in Examples 1 to 7 and Comparative Examples 1 to 8 , the type of used paper pulp, the dispersion method of used paper pulp, the mixing ratio of the used paper pulp in the middle layer and the back layer, metal salt Type and addition ratio, fine fiber content ratio in layers other than the surface layer, ash content ratio in layers other than the surface layer, waste paper content ratio in layers other than the surface layer, average particle diameter of the inorganic filler in the entire mount, 50 μm or more in ash content Table 2 shows the mass ratio of the particles, the Z-axis strength of the mount, the punchability evaluation, the mold wear evaluation, the copper content of the mount, and the rust test evaluation.

The electronic component storage board of the present invention has a high-accuracy cavity formed in a multilayer paper base material having a layer structure in which the cavity processing mold is less worn. Electronic components can be smoothly stored and taken out without causing troubles such as adhesion of foreign matters due to paper dust generation, so it can sufficiently handle electronic components that are becoming smaller in size. By using the properties of waste paper pulp and the properties of inorganic fillers derived from waste paper, we prepared a multilayer paper base material with less mold wear and used it as a mount paper base material. It is also valuable as a technology that opens the way to effective use of.

Claims (4)

A chip-type electronic component storage board provided with a concave portion or a perforated portion for storing a chip-type electronic component in a multilayer paper base material consisting of a surface layer, a single layer or a plurality of layers, and a back layer,
The multilayer paper base material contains a copper compound, and the layers other than the surface layer include 0 to 70% by weight of waste paper pulp of the total pulp of the layers other than the surface layer, and an inorganic filler derived from waste paper as ash content. 5-15% by mass and the layers other than the surface layer are disaggregated by the pulp disaggregation method of JIS P8220, and JAPAN TAPPI No. In the fiber length distribution at the time of the number average calculation of the fiber length measured by the pulp fiber length test method in the optical automatic measurement method defined in 52, the ratio of fine fibers of 0.2 mm or less is a layer of 20% or more. A chip-type electronic component storage board, characterized in that there is. 2. The chip-type electronic component storage board according to claim 1, wherein the multilayer paper base material contains a water-soluble copper compound selected from the group consisting of sulfate, hydrochloride, nitrate, and acetate. . The waste paper pulp is a waste paper pulp having a ash content of 0.7 to 25% by mass when dispersed according to JIS P8251 after dispersal treatment of the waste paper, and the inorganic filler has a mass average particle diameter. 3. The chip-type electronic component storage board according to claim 1, wherein a mass ratio of 50 μm or more is less than 40% . A chip-type electronic component storage comprising a multi-layer paper base material comprising a surface layer, a single layer or a plurality of layers, and a back layer according to any one of claims 1 to 3 provided with a recess or a perforated portion for storing the chip-type electronic component. A method of manufacturing one of the mounts,
Raw paper containing 5% by mass or more of an inorganic filler as ash is disaggregated with a pulper or a machine having a disaggregation treatment function, subjected to a dust removal treatment, and then subjected to a dispersion treatment. The mass average particle diameter of the inorganic filler is 50 μm. A step of preparing waste paper pulp having a mass ratio of less than 40 μm and less than 40% and an ash content of 0.7 to 25% by mass when measured according to JIS P8251;
Separately from the step of using the waste paper pulp as at least a part of the pulp raw material, and further adding a copper compound to prepare the middle layer and the back layer forming pulp slurry of the single layer or the plurality of layers, the waste paper pulp A step of preparing the surface layer forming pulp slurry not containing, a step of preparing a multilayer papermaking pulp slurry,
A step of forming a multilayer paper base material comprising a surface layer, a single layer or a plurality of layers, and a back layer by multilayer papermaking from the surface layer forming pulp slurry and the intermediate layer and back layer forming pulp slurry,
Have
The step of preparing the pulp slurry for forming the intermediate layer and the back layer formed of the single layer or the plurality of layers includes the intermediate layer and the back layer formed from the pulp slurry, and 5 to 70% by mass of the total pulp is used paper. Made of pulp, containing 0.5-15% by weight of inorganic paper-derived inorganic filler as ash, further containing a copper compound, and the formed middle layer and back layer are combined and disaggregated by the pulp disaggregation method of JIS P8220. , JAPAN TAPPI No. In the fiber length distribution at the time of calculating the number average of fiber lengths measured by the pulp fiber length test method in the optical automatic measurement method defined in 52, a layer in which the proportion of fine fibers of 0.2 mm or less is 20% or more is formed. A method for producing a chip-type electronic component storage board, which is a step of preparing a pulp slurry having a composition that can be produced .