JP5470980B2 - チップ型電子部品収納台紙用多層紙基材の製造方法 - Google Patents

チップ型電子部品収納台紙用多層紙基材の製造方法 Download PDF

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Publication number
JP5470980B2
JP5470980B2 JP2009089044A JP2009089044A JP5470980B2 JP 5470980 B2 JP5470980 B2 JP 5470980B2 JP 2009089044 A JP2009089044 A JP 2009089044A JP 2009089044 A JP2009089044 A JP 2009089044A JP 5470980 B2 JP5470980 B2 JP 5470980B2
Authority
JP
Japan
Prior art keywords
pulp
paper
inorganic filler
paper pulp
waste paper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009089044A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010030677A (ja
Inventor
浩 末永
伊久朗 手島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
New Oji Paper Co Ltd
Oji Holdings Corp
Original Assignee
Oji Holdings Corp
Oji Paper Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oji Holdings Corp, Oji Paper Co Ltd filed Critical Oji Holdings Corp
Priority to JP2009089044A priority Critical patent/JP5470980B2/ja
Priority to KR1020090057535A priority patent/KR101531256B1/ko
Priority to TW98121688A priority patent/TW201016463A/zh
Priority to CN2009101396151A priority patent/CN101619555B/zh
Publication of JP2010030677A publication Critical patent/JP2010030677A/ja
Application granted granted Critical
Publication of JP5470980B2 publication Critical patent/JP5470980B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/64—Paper recycling

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Paper (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
JP2009089044A 2008-06-30 2009-04-01 チップ型電子部品収納台紙用多層紙基材の製造方法 Expired - Fee Related JP5470980B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009089044A JP5470980B2 (ja) 2008-06-30 2009-04-01 チップ型電子部品収納台紙用多層紙基材の製造方法
KR1020090057535A KR101531256B1 (ko) 2008-06-30 2009-06-26 칩형 전자 부품 수납대지용 다층지 기재 및 그 제조 방법
TW98121688A TW201016463A (en) 2008-06-30 2009-06-26 Multilayer paper substrate for chip-type electronic component storage mount, and method of producing same
CN2009101396151A CN101619555B (zh) 2008-06-30 2009-06-26 芯片型电子元件收纳衬纸用多层纸基材及其制造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008170343 2008-06-30
JP2008170343 2008-06-30
JP2009089044A JP5470980B2 (ja) 2008-06-30 2009-04-01 チップ型電子部品収納台紙用多層紙基材の製造方法

Publications (2)

Publication Number Publication Date
JP2010030677A JP2010030677A (ja) 2010-02-12
JP5470980B2 true JP5470980B2 (ja) 2014-04-16

Family

ID=41512951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009089044A Expired - Fee Related JP5470980B2 (ja) 2008-06-30 2009-04-01 チップ型電子部品収納台紙用多層紙基材の製造方法

Country Status (4)

Country Link
JP (1) JP5470980B2 (zh)
KR (1) KR101531256B1 (zh)
CN (1) CN101619555B (zh)
TW (1) TW201016463A (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5825124B2 (ja) * 2012-02-01 2015-12-02 王子ホールディングス株式会社 チップ型電子部品収納台紙用多層紙基材およびその製造方法
JP2014023908A (ja) * 2012-06-19 2014-02-06 Sammy Corp 遊技機
JP6085467B2 (ja) * 2012-12-17 2017-02-22 大王製紙株式会社 キャリアテープ用紙及びこのキャリアテープ用紙の中層に用いる古紙パルプの製造方法
CN108755264A (zh) * 2012-12-27 2018-11-06 特种东海制纸株式会社 玻璃板衬纸用木材纸浆以及玻璃板用衬纸
CN103321088B (zh) * 2013-07-19 2014-11-12 吉安集团有限公司 再生高强瓦楞原纸及其生产方法
JP6149589B2 (ja) * 2013-08-07 2017-06-21 王子ホールディングス株式会社 容器用原紙及びその容器用原紙の製造方法
CN105735033B (zh) * 2016-02-19 2017-11-07 江苏理文造纸有限公司 一种白面牛卡纸的生产工艺

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2916379A1 (de) * 1979-04-23 1980-11-13 Schultz & Nauth Collodin Kleb Invertierter papierleim und verfahren zu seiner herstellung
US5830317A (en) * 1995-04-07 1998-11-03 The Procter & Gamble Company Soft tissue paper with biased surface properties containing fine particulate fillers
JP2004124280A (ja) * 2002-09-30 2004-04-22 Daio Paper Corp 雑誌古紙を配合した印刷用塗被紙およびその製造方法
JP4394341B2 (ja) * 2002-11-05 2010-01-06 レンゴー株式会社 製紙方法
JP4449707B2 (ja) * 2004-11-16 2010-04-14 王子製紙株式会社 チップ型電子部品収納台紙
JP4422115B2 (ja) * 2006-03-27 2010-02-24 北越紀州製紙株式会社 チップ状電子部品用キャリアテープ紙
CN101092807B (zh) * 2006-06-20 2010-12-22 王子制纸株式会社 胶版印刷用新闻纸

Also Published As

Publication number Publication date
CN101619555A (zh) 2010-01-06
KR101531256B1 (ko) 2015-06-24
CN101619555B (zh) 2012-06-20
JP2010030677A (ja) 2010-02-12
KR20100003216A (ko) 2010-01-07
TW201016463A (en) 2010-05-01

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