KR101486406B1 - 스케일러블 2단자 나노튜브 스위치를 갖는 비휘발성 저항 메모리, 래치 회로 및 연산 회로 - Google Patents

스케일러블 2단자 나노튜브 스위치를 갖는 비휘발성 저항 메모리, 래치 회로 및 연산 회로 Download PDF

Info

Publication number
KR101486406B1
KR101486406B1 KR1020097004498A KR20097004498A KR101486406B1 KR 101486406 B1 KR101486406 B1 KR 101486406B1 KR 1020097004498 A KR1020097004498 A KR 1020097004498A KR 20097004498 A KR20097004498 A KR 20097004498A KR 101486406 B1 KR101486406 B1 KR 101486406B1
Authority
KR
South Korea
Prior art keywords
state
volatile
circuit
latch circuit
switch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020097004498A
Other languages
English (en)
Korean (ko)
Other versions
KR20090057239A (ko
Inventor
클라우드 엘 버틴
토마스 뤽스
조나단 더블유 와드
프랑크 구오
스티븐 엘 콘섹
밋셸 메인홀드
Original Assignee
난테로 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 난테로 인크. filed Critical 난테로 인크.
Publication of KR20090057239A publication Critical patent/KR20090057239A/ko
Application granted granted Critical
Publication of KR101486406B1 publication Critical patent/KR101486406B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117Shapes of semiconductor bodies
    • H10D62/118Nanostructure semiconductor bodies
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/56Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0064Verifying circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/02Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using elements whose operation depends upon chemical change
    • G11C13/025Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using elements whose operation depends upon chemical change using fullerenes, e.g. C60, or nanotubes, e.g. carbon or silicon nanotubes
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C14/00Digital stores characterised by arrangements of cells having volatile and non-volatile storage properties for back-up when the power is down
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C17/00Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
    • G11C17/14Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
    • G11C17/16Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using electrically-fusible links
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/70Masking faults in memories by using spares or by reconfiguring
    • G11C29/86Masking faults in memories by using spares or by reconfiguring in serial access memories, e.g. shift registers, CCDs, bubble memories
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/20Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117Shapes of semiconductor bodies
    • H10D62/118Nanostructure semiconductor bodies
    • H10D62/119Nanowire, nanosheet or nanotube semiconductor bodies
    • H10D62/121Nanowire, nanosheet or nanotube semiconductor bodies oriented parallel to substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117Shapes of semiconductor bodies
    • H10D62/118Nanostructure semiconductor bodies
    • H10D62/119Nanowire, nanosheet or nanotube semiconductor bodies
    • H10D62/122Nanowire, nanosheet or nanotube semiconductor bodies oriented at angles to substrates, e.g. perpendicular to substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/20Organic diodes
    • H10K10/29Diodes comprising organic-inorganic heterojunctions
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • G11C2013/0076Write operation performed depending on read result
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/10Resistive cells; Technology aspects
    • G11C2213/19Memory cell comprising at least a nanowire and only two terminals
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/71Three dimensional array
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/72Array wherein the access device being a diode
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/20Carbon compounds, e.g. carbon nanotubes or fullerenes
    • H10K85/221Carbon nanotubes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/70Nanostructure
    • Y10S977/762Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Semiconductor Memories (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020097004498A 2006-08-08 2007-08-08 스케일러블 2단자 나노튜브 스위치를 갖는 비휘발성 저항 메모리, 래치 회로 및 연산 회로 Active KR101486406B1 (ko)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
US83634306P 2006-08-08 2006-08-08
US83643706P 2006-08-08 2006-08-08
US60/836,437 2006-08-08
US60/836,343 2006-08-08
US84058606P 2006-08-28 2006-08-28
US60/840,586 2006-08-28
US85510906P 2006-10-27 2006-10-27
US60/855,109 2006-10-27
US91838807P 2007-03-16 2007-03-16
US60/918,388 2007-03-16
PCT/US2007/075521 WO2008021912A2 (en) 2006-08-08 2007-08-08 Nonvolatile resistive memories, latch circuits, and operation circuits having scalable two-terminal nanotube switches

Publications (2)

Publication Number Publication Date
KR20090057239A KR20090057239A (ko) 2009-06-04
KR101486406B1 true KR101486406B1 (ko) 2015-01-26

Family

ID=39082936

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020097004498A Active KR101486406B1 (ko) 2006-08-08 2007-08-08 스케일러블 2단자 나노튜브 스위치를 갖는 비휘발성 저항 메모리, 래치 회로 및 연산 회로
KR1020097004772A Active KR101461688B1 (ko) 2006-08-08 2007-08-08 비휘발성 나노튜브 다이오드 및 비휘발성 나노튜브 블럭과,이를 이용한 시스템 및 그 제조 방법
KR1020097004520A Active KR101169499B1 (ko) 2006-08-08 2007-08-08 비휘발성 나노튜브 블록을 사용한 메모리 소자 및 교차점 스위치와 이들 어레이

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020097004772A Active KR101461688B1 (ko) 2006-08-08 2007-08-08 비휘발성 나노튜브 다이오드 및 비휘발성 나노튜브 블럭과,이를 이용한 시스템 및 그 제조 방법
KR1020097004520A Active KR101169499B1 (ko) 2006-08-08 2007-08-08 비휘발성 나노튜브 블록을 사용한 메모리 소자 및 교차점 스위치와 이들 어레이

Country Status (5)

Country Link
EP (5) EP2057633B1 (https=)
JP (4) JP6114487B2 (https=)
KR (3) KR101486406B1 (https=)
TW (3) TWI457923B (https=)
WO (3) WO2008021911A2 (https=)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9911743B2 (en) 2005-05-09 2018-03-06 Nantero, Inc. Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same
US8102018B2 (en) 2005-05-09 2012-01-24 Nantero Inc. Nonvolatile resistive memories having scalable two-terminal nanotube switches
US8008745B2 (en) 2005-05-09 2011-08-30 Nantero, Inc. Latch circuits and operation circuits having scalable nonvolatile nanotube switches as electronic fuse replacement elements
US7982209B2 (en) 2007-03-27 2011-07-19 Sandisk 3D Llc Memory cell comprising a carbon nanotube fabric element and a steering element
US7667999B2 (en) 2007-03-27 2010-02-23 Sandisk 3D Llc Method to program a memory cell comprising a carbon nanotube fabric and a steering element
JP2010522991A (ja) * 2007-03-27 2010-07-08 サンディスク スリーディー,エルエルシー カーボンナノチューブ構造素子およびステアリング素子を含むメモリセルおよびそれを形成する方法
JP5274799B2 (ja) * 2007-08-22 2013-08-28 ルネサスエレクトロニクス株式会社 半導体記憶装置
US8558220B2 (en) 2007-12-31 2013-10-15 Sandisk 3D Llc Memory cell that employs a selectively fabricated carbon nano-tube reversible resistance-switching element formed over a bottom conductor and methods of forming the same
US8878235B2 (en) * 2007-12-31 2014-11-04 Sandisk 3D Llc Memory cell that employs a selectively fabricated carbon nano-tube reversible resistance-switching element and methods of forming the same
US20090166610A1 (en) * 2007-12-31 2009-07-02 April Schricker Memory cell with planarized carbon nanotube layer and methods of forming the same
US8236623B2 (en) 2007-12-31 2012-08-07 Sandisk 3D Llc Memory cell that employs a selectively fabricated carbon nano-tube reversible resistance-switching element and methods of forming the same
KR20100136490A (ko) 2008-04-11 2010-12-28 쌘디스크 3디 엘엘씨 비휘발성 메모리에 사용하기 위한 탄소 나노-튜브 필름을 에칭하는 방법
US8467224B2 (en) 2008-04-11 2013-06-18 Sandisk 3D Llc Damascene integration methods for graphitic films in three-dimensional memories and memories formed therefrom
US8110476B2 (en) 2008-04-11 2012-02-07 Sandisk 3D Llc Memory cell that includes a carbon-based memory element and methods of forming the same
WO2009137222A2 (en) 2008-04-11 2009-11-12 Sandisk 3D, Llc Memory cell that includes a carbon nano-tube reversible resistance-switching element and methods of forming the same
US8304284B2 (en) 2008-04-11 2012-11-06 Sandisk 3D Llc Memory cell that employs a selectively fabricated carbon nano-tube reversible resistance-switching element, and methods of forming the same
US8530318B2 (en) 2008-04-11 2013-09-10 Sandisk 3D Llc Memory cell that employs a selectively fabricated carbon nano-tube reversible resistance-switching element formed over a bottom conductor and methods of forming the same
US8569730B2 (en) 2008-07-08 2013-10-29 Sandisk 3D Llc Carbon-based interface layer for a memory device and methods of forming the same
US8309407B2 (en) * 2008-07-15 2012-11-13 Sandisk 3D Llc Electronic devices including carbon-based films having sidewall liners, and methods of forming such devices
TW201021161A (en) * 2008-07-18 2010-06-01 Sandisk 3D Llc Carbon-based resistivity-switching materials and methods of forming the same
US8466044B2 (en) 2008-08-07 2013-06-18 Sandisk 3D Llc Memory cell that includes a carbon-based memory element and methods forming the same
US8421050B2 (en) 2008-10-30 2013-04-16 Sandisk 3D Llc Electronic devices including carbon nano-tube films having carbon-based liners, and methods of forming the same
US8835892B2 (en) 2008-10-30 2014-09-16 Sandisk 3D Llc Electronic devices including carbon nano-tube films having boron nitride-based liners, and methods of forming the same
KR20100052597A (ko) * 2008-11-11 2010-05-20 삼성전자주식회사 수직형 반도체 장치
US8183121B2 (en) * 2009-03-31 2012-05-22 Sandisk 3D Llc Carbon-based films, and methods of forming the same, having dielectric filler material and exhibiting reduced thermal resistance
TWI478358B (zh) * 2011-08-04 2015-03-21 Univ Nat Central A method of integrated AC - type light - emitting diode module
US9129894B2 (en) * 2012-09-17 2015-09-08 Intermolecular, Inc. Embedded nonvolatile memory elements having resistive switching characteristics
US9111611B2 (en) 2013-09-05 2015-08-18 Kabushiki Kaisha Toshiba Memory system
US9875332B2 (en) * 2015-09-11 2018-01-23 Arm Limited Contact resistance mitigation
JP2018186260A (ja) * 2017-04-25 2018-11-22 国立大学法人横浜国立大学 熱電発電デバイスおよび熱輸送デバイス
CN112151098A (zh) * 2019-06-27 2020-12-29 台湾积体电路制造股份有限公司 多熔丝记忆体单元电路
US11594269B2 (en) * 2020-06-19 2023-02-28 Taiwan Semiconductor Manufacturing Company, Ltd. One time programmable (OTP) magnetoresistive random-access memory (MRAM)
US11258023B1 (en) * 2020-08-05 2022-02-22 Nantero, Inc. Resistive change elements using passivating interface gaps and methods for making same
KR102943385B1 (ko) * 2021-06-17 2026-03-23 삼성전자주식회사 반도체 메모리 소자
US11881274B2 (en) * 2021-11-15 2024-01-23 Ememory Technology Inc. Program control circuit for antifuse-type one time programming memory cell array
US12063039B2 (en) * 2021-12-01 2024-08-13 Mediatek Inc. Register with data retention
CN116306390B (zh) * 2023-03-16 2026-03-27 长鑫存储技术有限公司 输入输出电路的设计方法、装置、设备及存储介质
US12609714B2 (en) 2023-08-28 2026-04-21 Macronix International Co., Ltd. Analog digital conversion sensing by dynamically varying charging capacitor values
US12354672B2 (en) 2023-08-28 2025-07-08 Macronix International Co., Ltd. Memory sensing with global non-regular counter and/or global multiple reference voltages

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6493272B1 (en) * 1999-07-02 2002-12-10 Nec Corporation Data holding circuit having backup function
US20040085798A1 (en) * 2002-08-27 2004-05-06 Wataru Yokozeki Nonvolatile data storage circuit using ferroelectric capacitors
US6919592B2 (en) * 2001-07-25 2005-07-19 Nantero, Inc. Electromechanical memory array using nanotube ribbons and method for making same
KR20080009319A (ko) * 2005-05-09 2008-01-28 난테로 인크. 나노튜브 스위치를 이용한 비휘발성 새도우 래치

Family Cites Families (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4256514A (en) 1978-11-03 1981-03-17 International Business Machines Corporation Method for forming a narrow dimensioned region on a body
FR2478879A1 (fr) * 1980-03-24 1981-09-25 Commissariat Energie Atomique Procede de realisation de dispositifs a effet memoire a semi-conducteurs amorphes
JPS57113296A (en) * 1980-12-29 1982-07-14 Seiko Epson Corp Switching element
US4442507A (en) 1981-02-23 1984-04-10 Burroughs Corporation Electrically programmable read-only memory stacked above a semiconductor substrate
USRE34363E (en) 1984-03-12 1993-08-31 Xilinx, Inc. Configurable electrical circuit having configurable logic elements and configurable interconnects
US4646266A (en) * 1984-09-28 1987-02-24 Energy Conversion Devices, Inc. Programmable semiconductor structures and methods for using the same
US4944836A (en) 1985-10-28 1990-07-31 International Business Machines Corporation Chem-mech polishing method for producing coplanar metal/insulator films on a substrate
US4743569A (en) * 1987-04-20 1988-05-10 Texas Instruments Incorporated Two step rapid thermal anneal of implanted compound semiconductor
US4916087A (en) 1988-08-31 1990-04-10 Sharp Kabushiki Kaisha Method of manufacturing a semiconductor device by filling and planarizing narrow and wide trenches
US5005158A (en) * 1990-01-12 1991-04-02 Sgs-Thomson Microelectronics, Inc. Redundancy for serial memory
US5311039A (en) * 1990-04-24 1994-05-10 Seiko Epson Corporation PROM and ROM memory cells
US5096849A (en) 1991-04-29 1992-03-17 International Business Machines Corporation Process for positioning a mask within a concave semiconductor structure
US5536968A (en) 1992-12-18 1996-07-16 At&T Global Information Solutions Company Polysilicon fuse array structure for integrated circuits
DE4305119C2 (de) * 1993-02-19 1995-04-06 Eurosil Electronic Gmbh MOS-Speichereinrichtung zur seriellen Informationsverarbeitung
US5345110A (en) 1993-04-13 1994-09-06 Micron Semiconductor, Inc. Low-power fuse detect and latch circuit
JPH0729373A (ja) * 1993-07-08 1995-01-31 Mitsubishi Electric Corp 半導体記憶装置
US5818749A (en) * 1993-08-20 1998-10-06 Micron Technology, Inc. Integrated circuit memory device
US5670803A (en) 1995-02-08 1997-09-23 International Business Machines Corporation Three-dimensional SRAM trench structure and fabrication method therefor
US5546349A (en) 1995-03-13 1996-08-13 Kabushiki Kaisha Toshiba Exchangeable hierarchical data line structure
US5768196A (en) * 1996-03-01 1998-06-16 Cypress Semiconductor Corp. Shift-register based row select circuit with redundancy for a FIFO memory
US5831923A (en) 1996-08-01 1998-11-03 Micron Technology, Inc. Antifuse detect circuit
US5912937A (en) * 1997-03-14 1999-06-15 Xilinx, Inc. CMOS flip-flop having non-volatile storage
US6629190B2 (en) * 1998-03-05 2003-09-30 Intel Corporation Non-redundant nonvolatile memory and method for sequentially accessing the nonvolatile memory using shift registers to selectively bypass individual word lines
US6008523A (en) 1998-08-26 1999-12-28 Siemens Aktiengesellschaft Electrical fuses with tight pitches and method of fabrication in semiconductors
JP4658329B2 (ja) * 1999-02-12 2011-03-23 ボード オブ トラスティーズ,オブ ミシガン ステイト ユニバーシティ 帯電粒子を収容するナノカプセル、その用法及び形成法
BR0009308A (pt) * 1999-03-25 2001-12-18 Energy Conversion Devices Inc Elemento de memória
JP2002157880A (ja) 2000-11-15 2002-05-31 Matsushita Electric Ind Co Ltd 半導体記憶装置
US6750802B1 (en) 2001-02-09 2004-06-15 Richard Olen Remote controller with programmable favorite keys
US6570806B2 (en) 2001-06-25 2003-05-27 International Business Machines Corporation System and method for improving DRAM single cell fail fixability and flexibility repair at module level and universal laser fuse/anti-fuse latch therefor
US6706402B2 (en) 2001-07-25 2004-03-16 Nantero, Inc. Nanotube films and articles
US7259410B2 (en) 2001-07-25 2007-08-21 Nantero, Inc. Devices having horizontally-disposed nanofabric articles and methods of making the same
US6835591B2 (en) * 2001-07-25 2004-12-28 Nantero, Inc. Methods of nanotube films and articles
US6924538B2 (en) 2001-07-25 2005-08-02 Nantero, Inc. Devices having vertically-disposed nanofabric articles and methods of making the same
US6643165B2 (en) 2001-07-25 2003-11-04 Nantero, Inc. Electromechanical memory having cell selection circuitry constructed with nanotube technology
US6574130B2 (en) 2001-07-25 2003-06-03 Nantero, Inc. Hybrid circuit having nanotube electromechanical memory
US6911682B2 (en) 2001-12-28 2005-06-28 Nantero, Inc. Electromechanical three-trace junction devices
US6784028B2 (en) 2001-12-28 2004-08-31 Nantero, Inc. Methods of making electromechanical three-trace junction devices
KR100450825B1 (ko) * 2002-02-09 2004-10-01 삼성전자주식회사 탄소나노튜브를 이용하는 메모리 소자 및 그 제조방법
JP5165828B2 (ja) * 2002-02-09 2013-03-21 三星電子株式会社 炭素ナノチューブを用いるメモリ素子及びその製造方法
US6624499B2 (en) 2002-02-28 2003-09-23 Infineon Technologies Ag System for programming fuse structure by electromigration of silicide enhanced by creating temperature gradient
US6889216B2 (en) * 2002-03-12 2005-05-03 Knowm Tech, Llc Physical neural network design incorporating nanotechnology
WO2003085675A2 (en) * 2002-04-04 2003-10-16 Kabushiki Kaisha Toshiba Phase-change memory device
US6768665B2 (en) * 2002-08-05 2004-07-27 Intel Corporation Refreshing memory cells of a phase change material memory device
JP4547852B2 (ja) * 2002-09-04 2010-09-22 富士ゼロックス株式会社 電気部品の製造方法
US6831856B2 (en) * 2002-09-23 2004-12-14 Ovonyx, Inc. Method of data storage using only amorphous phase of electrically programmable phase-change memory element
JP2004133969A (ja) * 2002-10-08 2004-04-30 Renesas Technology Corp 半導体装置
US7606059B2 (en) * 2003-03-18 2009-10-20 Kabushiki Kaisha Toshiba Three-dimensional programmable resistance memory device with a read/write circuit stacked under a memory cell array
US6944054B2 (en) * 2003-03-28 2005-09-13 Nantero, Inc. NRAM bit selectable two-device nanotube array
US7294877B2 (en) * 2003-03-28 2007-11-13 Nantero, Inc. Nanotube-on-gate FET structures and applications
WO2004090984A1 (en) * 2003-04-03 2004-10-21 Kabushiki Kaisha Toshiba Phase change memory device
US7095645B2 (en) * 2003-06-02 2006-08-22 Ambient Systems, Inc. Nanoelectromechanical memory cells and data storage devices
US7280394B2 (en) 2003-06-09 2007-10-09 Nantero, Inc. Field effect devices having a drain controlled via a nanotube switching element
US7115960B2 (en) * 2003-08-13 2006-10-03 Nantero, Inc. Nanotube-based switching elements
WO2005048296A2 (en) * 2003-08-13 2005-05-26 Nantero, Inc. Nanotube-based switching elements with multiple controls and circuits made from same
US7416993B2 (en) 2003-09-08 2008-08-26 Nantero, Inc. Patterned nanowire articles on a substrate and methods of making the same
JP3995167B2 (ja) * 2003-10-24 2007-10-24 有限会社金沢大学ティ・エル・オー 相変化型メモリ
KR100694426B1 (ko) * 2004-02-16 2007-03-12 주식회사 하이닉스반도체 나노 튜브 셀 및 이를 이용한 메모리 장치
EP1723676A4 (en) * 2004-03-10 2009-04-15 Nanosys Inc MEMORY BLOCKS WITH NANO-ABILITY AND ANISOTROPE CHARGE CARRIER ARRAYS
US6969651B1 (en) * 2004-03-26 2005-11-29 Lsi Logic Corporation Layout design and process to form nanotube cell for nanotube memory applications
US7161403B2 (en) * 2004-06-18 2007-01-09 Nantero, Inc. Storage elements using nanotube switching elements
US6955937B1 (en) * 2004-08-12 2005-10-18 Lsi Logic Corporation Carbon nanotube memory cell for integrated circuit structure with removable side spacers to permit access to memory cell and process for forming such memory cell
US7224598B2 (en) * 2004-09-02 2007-05-29 Hewlett-Packard Development Company, L.P. Programming of programmable resistive memory devices
TW200620473A (en) * 2004-09-08 2006-06-16 Renesas Tech Corp Nonvolatile memory device
TWI348169B (en) * 2004-09-21 2011-09-01 Nantero Inc Resistive elements using carbon nanotubes
EP1807919A4 (en) 2004-11-02 2011-05-04 Nantero Inc NANORON ELEMENTS FOR PROTECTION AGAINST ELECTROSTATIC DISCHARGE AND CORRESPONDING NON-VOLATILE AND VOLATILE NANOPHONE SWITCHES
US7208372B2 (en) * 2005-01-19 2007-04-24 Sharp Laboratories Of America, Inc. Non-volatile memory resistor cell with nanotip electrode
KR100682925B1 (ko) * 2005-01-26 2007-02-15 삼성전자주식회사 멀티비트 비휘발성 메모리 소자 및 그 동작 방법
US7394687B2 (en) * 2005-05-09 2008-07-01 Nantero, Inc. Non-volatile-shadow latch using a nanotube switch
US7479654B2 (en) 2005-05-09 2009-01-20 Nantero, Inc. Memory arrays using nanotube articles with reprogrammable resistance
JP4843760B2 (ja) * 2005-12-26 2011-12-21 株式会社発明屋 カーボンナノチューブを用いた記憶素子

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6493272B1 (en) * 1999-07-02 2002-12-10 Nec Corporation Data holding circuit having backup function
US6919592B2 (en) * 2001-07-25 2005-07-19 Nantero, Inc. Electromechanical memory array using nanotube ribbons and method for making same
US20040085798A1 (en) * 2002-08-27 2004-05-06 Wataru Yokozeki Nonvolatile data storage circuit using ferroelectric capacitors
KR20080009319A (ko) * 2005-05-09 2008-01-28 난테로 인크. 나노튜브 스위치를 이용한 비휘발성 새도우 래치

Also Published As

Publication number Publication date
JP5410974B2 (ja) 2014-02-05
WO2008021912A3 (en) 2008-06-19
KR20090057375A (ko) 2009-06-05
EP2057633B1 (en) 2013-03-06
EP2057633A4 (en) 2009-11-25
TW200832399A (en) 2008-08-01
WO2008021911A3 (en) 2008-05-02
WO2008021911A2 (en) 2008-02-21
WO2008021900A2 (en) 2008-02-21
EP2104109A1 (en) 2009-09-23
TW200826302A (en) 2008-06-16
TW200826102A (en) 2008-06-16
EP2070088A4 (en) 2009-07-29
KR20090057239A (ko) 2009-06-04
EP2057683A2 (en) 2009-05-13
TWI419163B (zh) 2013-12-11
KR101461688B1 (ko) 2014-11-13
EP2104108A1 (en) 2009-09-23
EP2057683A4 (en) 2010-03-10
JP2010515240A (ja) 2010-05-06
WO2008021912A2 (en) 2008-02-21
HK1137163A1 (en) 2010-07-23
EP2057633A2 (en) 2009-05-13
KR20090043552A (ko) 2009-05-06
TWI463673B (zh) 2014-12-01
WO2008021900A3 (en) 2008-05-29
JP2017085134A (ja) 2017-05-18
TWI457923B (zh) 2014-10-21
JP2010515241A (ja) 2010-05-06
KR101169499B1 (ko) 2012-07-27
EP2070088A2 (en) 2009-06-17
JP5394923B2 (ja) 2014-01-22
HK1138425A1 (en) 2010-08-20
JP6114487B2 (ja) 2017-04-12
JP2010515285A (ja) 2010-05-06

Similar Documents

Publication Publication Date Title
KR101486406B1 (ko) 스케일러블 2단자 나노튜브 스위치를 갖는 비휘발성 저항 메모리, 래치 회로 및 연산 회로
US8102018B2 (en) Nonvolatile resistive memories having scalable two-terminal nanotube switches
US8008745B2 (en) Latch circuits and operation circuits having scalable nonvolatile nanotube switches as electronic fuse replacement elements
CN101542631B (zh) 具有可缩放双端子纳米管开关的非易失性阻性存储器、闩锁电路和工作电路
US8541843B2 (en) Nonvolatile nanotube programmable logic devices and a nonvolatile nanotube field programmable gate array using same
US8351291B2 (en) Electrically programmable fuse module in semiconductor device
US8456884B2 (en) Semiconductor device
US11393528B2 (en) RRAM circuit and method
Jayaraman et al. 80-kb logic embedded high-K charge trap transistor-based multi-time-programmable memory with no added process complexity
US20070242495A1 (en) Programmable read-only memory
US12315562B2 (en) RRAM circuit and method
CN101715594A (zh) 空间分布的放大器电路
Rosendale et al. A 4 megabit carbon nanotube-based nonvolatile memory (NRAM)
HK1138152A (en) Nonvolatile resistive memories, latch circuits, and operation circuits having scalable two-terminal nanotube switches
JP2004259320A (ja) オプションフューズ回路
JP2010262711A (ja) 電気フューズメモリを有する半導体デバイス
TW202334954A (zh) 低電阻mtj反熔絲電路設計及操作方法
TW200423385A (en) Pure CMOS latch-type fuse circuit

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20090303

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20120806

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20130827

Patent event code: PE09021S01D

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20140228

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20141029

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20150120

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20150121

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
FPAY Annual fee payment

Payment date: 20180108

Year of fee payment: 4

PR1001 Payment of annual fee

Payment date: 20180108

Start annual number: 4

End annual number: 4

FPAY Annual fee payment

Payment date: 20190109

Year of fee payment: 5

PR1001 Payment of annual fee

Payment date: 20190109

Start annual number: 5

End annual number: 5

FPAY Annual fee payment

Payment date: 20200109

Year of fee payment: 6

PR1001 Payment of annual fee

Payment date: 20200109

Start annual number: 6

End annual number: 6

PR1001 Payment of annual fee

Payment date: 20210113

Start annual number: 7

End annual number: 7

PR1001 Payment of annual fee

Payment date: 20250107

Start annual number: 11

End annual number: 11